Sept 24, 2005Vertex 2007 --- Power distribution --- M. Garcia-Sciveres 1 Power Distribution, Cables, and Reliability Vertex 2007 Maurice Garcia-Sciveres.

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Presentation transcript:

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 1 Power Distribution, Cables, and Reliability Vertex 2007 Maurice Garcia-Sciveres Lawrence Berkeley National Laboratory

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 2 Background: powering the ATLAS pixel detector Tube at the center of ATLAS Pixel Detector Remote sense linear regulator Connector ~10m ~2m ~90m Rack power supply ~ 10V 1V min. dropout 3.5V max. ~2V Same on this side 2KA

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 3 Support tube and internal services Through this 40cm dia. gas seal plate pass: 2KA supply and 2KA return current, 1 beam pipe, 140Gb/s data, 5KW of cooling, +HV and sensing Detector starts over here (fills 15% of tube) 2.8m

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 4 Background: powering ATLAS pixel detector Tube at the center of ATLAS Pixel Detector Remote sense linear regulator Connector ~10m ~2m ~90m Rack power supply ~ 10V 1V min. dropout 3.5V max. ~2V Same on this side 2KA

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 5 Transition to conventional cables 10% of detector 90m cables to racks Voltage regulators 10m cables to support tube 5x this connects in here Mockup with 1/8 of the stuff

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 6 What is the general problem? Density of connections is pushed to the limit, resulting in highly complex assemblies whose cost starts to compete with active elements in order to maintain reliability. The services (electrical cables and cooling pipes) dominate the radiation length ATLAS Pixels

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 7 Why do we have this problem? Speed: higher luminosity needs higher data output rate => more power. Channel count: Denser events (higher energy and pile-up of interactions) need higher granularity => more power. Physical size: Bigger detectors => power has to be delivered further. Moore’s Law: => power has to be delivered effectively further Channel Count & Data Rate Panofsky & Breidenbach “Accelerators and Detectors” Rev. Mod. Phys. 71 (1999)

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 8 Really two problems Power Distance

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 9 Effective distance scale Efficiency of power delivery is given by  = V load / V supply. (For typical case I load = I supply ) For pure cables, V supply = V load + I. R cable = V load + I.  L cable, 1/  = 1 + I . L cable / V load If load is an integrated circuit, the operating voltage is proportional to the oxide thickness, V load = I.  T ox, therefore, 1/  = 1 + I  L cable / T ox IC Feature size sets an effective distance scale for power delivery For example, when comparing CDF and ATLAS vertex detectors, cables runs are ~twice as long, but the IC feature size ratio is 0.25/0.8, so the effective cable runs are 6 times worse in ATLAS.

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 10 Power consumption & Power delivery efficiency A large operating power requirement makes the power delivery efficiency problem worse But power delivery efficiency is a problem independently of power consumption. With low power delivery efficiency, small load current changes lead to large voltage swings. This is an issue for DSM IC’s even in a low power case such as ILC The detector radiation thickness is given by the operating power, while the cable plant mass & complexity are given by the power delivery efficiency

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 11 How do we solve the problem? Reduction of IC power –Big industrial R&D area for digital circuits –Important point for HEP- analog power tied to sensor choice –Not covered further in this talk Increase power delivery efficiency –Significant interest in this area over past ~2 years. –Basic principle: deliver power at higher voltage Serial connection, or DC-DC conversion –Covered in next few slides More system-oriented design approach –What seems conservative in a narrow view may be quite the opposite for the system. –Must consider full system- including cable plant- early in the design process.

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 12 Tesla Delivering power at higher voltage is not new –Most ideas for how to do this can be found in patents filed by Tesla well before Serial powering Switched capacitors

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 13 Power efficiency vs. conversion factor Consider a next generation pixel detector for ATLAS, keeping much of the installed cable plant Now 30KW from rack 100KW from rack 35KW from rack  = 70%  = 60%  = 90%  = 50%  Module power  Rack power

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 14 Multiplication by serial connection (current recycling) Regulator can be inside IC. In fact present ATLAS pixel IC has such a regulator in it- not being used. I/O must use level shifters, and sensor bias is referenced to local regulated voltage Noise coupling between stages is to first order absent because current is conserved (one stage cannot affect the current in the next stage) Constant current source Shunt regulator IC

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 15 Serial power references Pixels T. Stockmanns, P. Fischer, F. Hugging, I. Peric, O. Runolfsson, N. Wermes, “Serial powering of pixel modules”, Nucl. Instr. & Meth. A511 (2003) 174–179; D. B. Ta, T. Stockmanns, F. Hügging, P. Fischer, J. Grosse-Knetter, Ö. Runolfsson, N. Wermes, “Serial Powering: Proof of Principle demonstration of a scheme for the operation of a large pixel detector at the LHC”, Nucl. Instr. Meth. A557 (2006) Strips Marc Weber, Giulio Villani, Mika Lammentausta, Proceedings of the 11 th workshop on electronics for LHC and future experiments, CERN-LHCC , (2005) pp ; Marc Weber, Giulio Villani, “Serial Powering of Silicon Strip Detectors at SLHC”, Proceedings of the 6 th “Hiroshima” conference on Silicon detectors (2006); Carl Haber, “A Study of Large Area Integrated Silicon Tracking Elements for the LHC Luminosity Upgrade”, Proceedings of the 6 th “Hiroshima” conference on Silicon detectors (2006).

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 16 DC-DC conversion Ubiquitous Not much explanation needed Commercial parts are inductive using ferrites High efficiency because ferrites enhance stored energy per unit volume by ~2 orders of magnitude IC DC-DC

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 17 A switched capacitor x4 DC-DC converter Phase 1 - Charge Load Vd Load Phase 2 - Discharge 4 capacitors – 10 switches Vd Load I I 4I 2I 6I 2I Ideal device operation: Ref: “DC-DC Power Conversion”, R. Ely & M. Garcia-Sciveres, 12 Workshop on Electronics for LHC and Future Experiments, CERN p. 89 (2007)

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 18 Prototype IC Received May V (source to drain) 0.35mm HV CMOS process 10 power switches in 4.3 x 4.9 mm footprint All capacitors external, all clocks external Chip re-submitted Aug. 14, 2007 with bias circuit fix AND external override Does not work outside shown voltage range due to problems with bias circuit Low power efficiency is due to large current consumption in bad bias circuit. Expect ~75% after fix. Can be used as a “passive” voltage divider. Full control of output voltage without any control signals P. Denes, R. Ely, M. Garcia-Sciveres, LBNL

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 19 Reliability and number of connections Increasing the number of connections typically DECREASES reliability. “Conservative choice” of independent connections for every circuit element may not be at all conservative from a system perspective –Need to consider full system before choosing number of I/O and slow control lines needed per element A simple calculation for a large system of N.n elements: –Case A: make N.n connections Single connection failure probability is  => Expected number of element failures is N.n.  (binomial mean) –Case B: Gang n elements together Make N connections Single connection failure probability is  => Expected number of element failures is n.N.  –B is more reliable because  <<  bigger contacts and bigger wires are more reliable. Alternatively consider B has n redundant connections. If current capacity is not an issue then  n –Analysis not as simple if internal failure of one element disables all of its ganged neighbors.

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 20 Conclusion Silicon detectors have become very large systems “Boring stuff” like power delivery efficiency and electrical contact reliability are critical design elements System consideration must be a top priority in the design process An example of system thinking: the choice of sensor parameters may have more to do with reduction of IC power than with radiation thickness of the sensor itself. Might choose a bulky sensor over a light-weight sensor because it leads to a lower mass full system. DC/DC conversion and/or serial powering will inevitably be a part of the next generation of LHC detectors

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 21 Backup 1: Section through pixel services BEAM PIPEIP -> POWER COOLING EXPENSIVE COMPOSITE STRUCTURE

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 22 Backup 2: DC-DC vs. Serial DC-DC –Single module is electrical unit. –1 common logic- no external components. –Independent control possible –Can produce “off the shelf” universal components –Requires external component (DC-DC converter) –Rad-hardness of DC-DC must be proven Serial –Multi-module electrical unit –Multiple logic levels (requires level shifting external components) –Individual control difficult (requires voltage shifted slow control) –Has to be engineered for every new application –Can be built into IC –Naturally as rad-hard as IC if built-in

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 23 Backup 3: Why switched capacitors? Commercial DC-DC down-converters for power applications are all inductive. –(Switched capacitors used to step-up voltage at low power to drive displays, etc.) Why then study switched capacitors for power? –Cannot use ferrites in magnetic field => performance penalty for magnetic converters –With magnetic converters fringe AC magnetic fields may produce pickup in detectors (must study case-by-case) –Ceramic capacitor miniaturization makes great advances year after year (but air-core inductors cannot be improved). –Over-voltage safety considerations

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 24 Backup 4: Simulation efficiencies Load-dependent. Dominated by switch resistance Load-independent charge lost in switch parasitics At peak load

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 25 Backup 5: Simulation Transient 1MHz, 1  F pump caps Startup circuit

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 26 Backup 6: Switched cap chip schematic

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 27 Backup 7: LDMOSFET

Sept 24, 2005Vertex Power distribution --- M. Garcia-Sciveres 28 Backup 8: plans for next switched cap. Expected delivery date Nov. 5 Concentrate on building “plug and play” prototypes that can be used to power existing and new detector assemblies. Target format: Inputs: Power (I_out/4), +4V (~20mA), Clock (optional). Miniaturization challenging because several external components needed. In eventual production size could be further reduced (ultimate goal is 1cm2/Amp of output) by absorbing more functionality into ASIC. 1cm 2cm 0.5A device 1cm 3cm 1A device