September 27, 2016 PNNL SiC/SiC Test Blanket Module Contributions CH Henager, Jr. GE Youngblood RJ Kurtz Pacific Northwest National Laboratory Richland,

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September 27, 2016 PNNL SiC/SiC Test Blanket Module Contributions CH Henager, Jr. GE Youngblood RJ Kurtz Pacific Northwest National Laboratory Richland, WA ITER-TBM Meeting August 10-12, 2005 Idaho Falls, ID

September 27, 2016 Large, Geometrically Complex Structures can be Readily Fabricated From SiC Actively Cooled Thrust Chambers Misc. Components Combustor Liners

September 27, 2016 Thermal Conductivity – Currently Too High FCI Goal

Recent Electrical Conductivity Measurements Composite Disk SiC fibers FCI Goal

September 27, 2016 Mechanical Properties n SiC/SiC composites are tough and strong but… â Composite cracks expose fibers. â Fatigue due to thermal pulses could pump PbLi into composite interior. â Thermal gradients allow vapor transport. â Thermal stresses and fatigue require study and understanding.

September 27, 2016 Joining and Bonding n Joining is a critical technology for ceramics and composites â Fabricated simple shapes in complex structures â Hermetic face plates for SiC/SiC in critical environments â Dissimilar materials issues in radiation effects and mechanical/chemical compatibility â Many methods for joining that can be adapted for TBM needs Pre-ceramic polymer joints Displacement reaction joining Brazing

September 27, 2016 Reactive Joining of SiC Using Ti 3 SiC 2 /SiC Composites Joint between  -SiC using displacement reaction between TiC + Si (tape cast powders) processed in argon at 1200˚C/30 MPa. n Strong bonding occurs due to Ti 3 SiC 2 + SiC forming during reaction. Note interfacial carbides formed during the reaction. n Joints are tough and strong since Ti 3 SiC 2 phase exhibits plasticity under some conditions. n Joints can be tailored using other metal carbides reacting with Si.

September 27, 2016 Suggested Contributions to ITER TBM Programs utilizing SiC/SiC n Transverse thermal conductivity measurements â TBM design dependent measurements n Transverse and in-plane electrical conductivity measurements â Design and measure low conductivity materials n Mechanics and environmental interactions â Thermal stress gradients and thermal fatigue â PbLi vapor transport and crack growth effects n Joining and bonding â Sealing porous SiC/SiC with hermetic bond layer (design) â Compatibility (stress, fracture, and environmental) in TBM n Modeling â All aspects of thermal and electrical properties â Radiation effects â TBM cracking, thermal fatigue, crack “pumping” of PbLi