ASIC-LOP/LSTP Roadmap Assumptions - Vdd: equals to the HP proposal of USA. But trend is different with each other. - Performance: 10%/year growth.

Slides:



Advertisements
Similar presentations
Work in Progress --- Not for Publication p. 1--PIDS Summary, Dec.04 PIDS Summary Peter M. Zeitzoff US Chair ITWG Meeting Tokyo, Japan November 30 - December.
Advertisements

(not for publication – work in progress) ITRS Summer Conference 2009 San Francisco 1 Front End Processes 2009 ITRS ITRS Public Conference July 15, 2009.
PIDS: Poster Session 2002 ITRS Changes and 2003 ITRS Key Issues ITRS Open Meeting Dec. 5, 2002 Tokyo.
Front End Processes 2010 ITRS
1 PIDS 7/1/01 18 July 2001 Work In Progress – Not for Publication P. Zeitzoff Contributors: J. Hutchby, P. Fang, G. Bourianoff, J. Chung, Y. Hokari, J.
DRAFT - NOT FOR PUBLICATION 14 July 2004 – ITRS Summer Conference PIDS Status and Key Issues: 2004 and 2005 ITRS Peter M. Zeitzoff for PIDS Technology.
DRAFT - NOT FOR PUBLICATION 14 July 2004 – ITRS Summer Conference PIDS Status and Key Issues: 2004 and 2005 ITRS Peter M. Zeitzoff for PIDS Technology.
Front End Processes ITRS 2012 Summer Public Conference 12 July 2012
ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes Shireesh Verma.
Improving insulating property of sol-gel processed gate dielectrics.
Background for Leakage Current
Advancing Strained Silicon A O’Neill, S Olsen, University of Newcastle P-E Hellstrom, M Ostling, KTH K Lyutovich, E Kasper, University of Stuttgart.
Options investigated in GOSSAMER
Kwangok Jeong and Andrew B. Kahng UCSD VLSI CAD Laboratory
Metal Oxide Semiconductor Field Effect Transistors
Derek Wright Monday, March 7th, 2005
Techniques of tuning the flatband voltage of metal/high-k gate-stack Name: TANG Gaofei Student ID: The Hong Kong University of Science and Technology.
High-K Dielectrics The Future of Silicon Transistors
ITRS 2003 Front End Processing Challenges David J. Mountain *Gate Stack Leff Control *Memory Cells Dopant Control Contacts *Starting Material FEP Grand.
Roadmap of Microelectronic Industry. Scaling of MOSFET Reduction of channel length L  L/α Integration density  α 2 Speed  α; Power/device  1/α 2 Power.
School of Electrical and Electronic Engineering Queen’s University Belfast, N.Ireland Course Tutor Dr R E Hurley Northern Ireland Semiconductor Research.
Xlab.me.berkeley.edu Xlab Confidential – Internal Only EE235 Carbon Nanotube FET Volker Sorger.
Penn ESE Spring DeHon 1 ESE (ESE534): Computer Organization Day 6: January 29, 2007 VLSI Scaling.
1 Uttam Singisetti*, Man Hoi Wong, Jim Speck, and Umesh Mishra ECE and Materials Departments University of California, Santa Barbara, CA 2011 Device Research.
Next Generation Integrated Circuits 300 mm wafers Copper metallization Low-K dielectric under interconnect lines High-K dielectric under gate Silicon-on-insulator.
Advanced Computing and Information Systems laboratory Device Variability Impact on Logic Gate Failure Rates Erin Taylor and José Fortes Department of Electrical.
*F. Adamu-Lema, G. Roy, A. R. Brown, A. Asenov and S. Roy
Novel high-k materials Can we nominate candidates for the 22 and the 16 nm nodes? Olof Engstrom Chalmers University of Technology Paul Hurley Tyndall National.
Reliability of ZrO 2 films grown by atomic layer deposition D. Caputo, F. Irrera, S. Salerno Rome Univ. “La Sapienza”, Dept. Electronic Eng. via Eudossiana.
Penn ESE370 Fall DeHon 1 ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 13: October 6, 2010 Scaling.
Performance Challenges of Future DRAM´s SINANO WS, Munich, Sept. 14th, 2007 M. Goldbach / J. Faul.
Investigation of Performance Limits of Germanium DG-MOSFET Tony Low 1, Y. T. Hou 1, M. F. Li 1,2, Chunxiang Zhu 1, Albert Chin 3, G. Samudra 1, L. Chan.
ITRS 2000 Update Work In Progress - Do Not Publish! 1 ITRS/ORTC Table Update Technology Node, DRAM Chip Size, and Logic Chip Size Update, Based on the.
ITRS: RF and Analog/Mixed- Signal Technologies for Wireless Communications Nick Krajewski CMPE /16/2005.
1 Radiation Effects on Emerging Electronics Materials & Devices MURI Annual Review Welcome & Thanks for Being Here! AFOSR PM: Kitt Reinhardt (703)
Characterization of Nanoscale Dielectrics or What characterizes dielectrics needed for the 22 nm node? O. Engstrom 1, M. Lemme 2, P.Hurley 3 and S.Hall.
Special Issues on Nanodevices1 Special Topics in Nanodevices 3 rd Lecture: Nanowire MOSFETs Byung-Gook Park.
1 High Frequency Model of Sub-100nm High-k RF CMOS ○M. Nakagawa 1, J.Song 1, Y. Nara 2, M. Yasuhira 2 *, F. Ohtsuka 2, T. Arikado 2 **, K. Nakamura 2,
Design and Analysis of A Novel 8T SRAM Cell December 14, 2010 Department of Microelectronic Engineering & Centre for Efficiency Oriented Languages University.
Background for Leakage Current
Chunxiang Zhu 1, Hang Hu 1, Xiongfei Yu 1, SJ Kim 1, Albert Chin 2, M. F. Li 1,4, Byung Jin Cho 1, and D. L. Kwong 3 1 SNDL, Dept. of ECE, National Univ.
Ion Beam Analysis of the Composition and Structure of Thin Films
Electric-field Effect on Transition Properties in a Strongly Correlated Electron (La,Pr,Ca)MnO 3 Film Electric Double Layer Transistor Source Drain Gate.
ITRS 2001 Renewal Work In Progress - Do Not Publish!
Penn ESE370 Fall DeHon 1 ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 15: October 3, 2014 Scaling.
U T JOHN G. EKERDT RESEARCH THEMES Using the tools of surface science we seek to develop and understand reaction chemistry and reaction kinetics at the.
Atomic Layer Deposition - ALD
UTB SOI for LER/RDF EECS Min Hee Cho. Outline  Introduction  LER (Line Edge Roughness)  RDF (Random Dopant Fluctuation)  Variation  Solution – UTB.
31nm Al 2 O 3, ZrO 2, HfO 2, … M1 M2 M3 M4 M5 © imec 2002.
ALD for Conformal and High Aspect Ratio Coverage Bryan (Insun) Park Mentor: J Provine 01/12/2011 EE412.
05-1 Digital Integrated Circuits 05: Advanced Fabrication & Lithography Revision
14NM FINFET IN MICROWIND.
Tunnel FETs Peng Wu Mar 30, 2017.
ESE534: Computer Organization
20-NM CMOS DESIGN.
List of materials which have been evaporated:
CMOS Scaling Effects Dr. A.V.N.Tilak Gudlavalleru Engineering College
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 14: October 7, 2011 Scaling Penn ESE370 Fall DeHon.
Hp Printer Phone Number USA Call Now Usa 1*866*535*9089
طراحي و ساخت تراشه هاي VLSI (Design and Fabrication)
In The Name of Allah درس: طراحی مدارهای VLSI
MOSFET Scaling ECE G201.
Lecture 19 OUTLINE The MOSFET: Structure and operation
MOSFET Scaling ECE G201.
MOS Capacitor Basics Metal SiO2
Summary Current density in a signal line was estimated, based on the simple circuit shown in Fig.1. This circuit is scaled down according to ITRS 2003.
Mechanical Stress Effect on Gate Tunneling Leakage of Ge MOS Capacitor
Lecture 19 OUTLINE The MOS Capacitor (cont’d) The MOSFET:
Lecture 19 OUTLINE The MOS Capacitor (cont’d) The MOSFET:
Fig. 5 Benchmarking CNT array FET performance against Si MOSFETs.
Presentation transcript:

ASIC-LOP/LSTP Roadmap Assumptions - Vdd: equals to the HP proposal of USA. But trend is different with each other. - Performance: 10%/year growth for LOP 5%/year growth for LSTP - Max. Ig: 100pA/um for LOP (no scaling) 1pA/um for LSTP (no scaling) - Ioff : Equals to the max. Ig of each LOP and LSTP. 16/7/2001 PIDS-Japan - Id-NMOS : for LOP (no scaling) for LSTP (no scaling)

Vdd in MPU(V) Vdd in ASIC/L(O)P (V) Maximum Ig per Tr (pA/1um) ASIC/L(O)P 100 Maximum Ig per Tr (pA/1um) ASIC/L(ST)P Tox,eq in MPU (nm) Tox,eq in ASIC/L(O)P (nm) Tox,eq in ASIC/L(ST)P (nm) Id-NMOS at Vdd (uA/um) ASIC/L(O)P High-k is put off one year, because of SiON and N/O leakage improvement Maximum Ioff at 25C (pA/um) ASIC/L(O)P 100 Maximum Ioff at 25C (pA/um) ASIC/L(ST)P Id-NMOS at Vdd (uA/um) ASIC/L(ST)P 16/7/2001 PIDS-Japan Vdd in ASIC/L(ST)P (V) Performance L(O)P Performance L(ST)P ASIC/LOP, LSTP Roadmap

Gate leakage (A/cm 2 ) Physically effective oxide thickness (nm) 1E-10 1E-8 1E-6 1E-4 1E-2 1E 0 Pr 2 O 3 La 2 O 3 SiO 2 Al 2 O 3 ZrO 2 Ta 2 O 5 HfO 2 Gate leakage current vs. insulator Limit in LOP/ASIC Limit in MPU Limit in LSTP/ASIC 1E 2 ITRS ’ PIDS-Japan SiON TiO 2 N/O (Revised) VLSI ‘01