Proto micromegas au LAPP 14 november 2008The DHCAL Board for the m2 and m3 prototype1 ASU DIF Inter DIF terminaison FPC USB Test Vendredi dernier….

Intermediate board 14 november 2008The DHCAL for the m2 and m3 prototype2 Prototype for M 2 : Hardroc chip : Hirose connector : Terminaison board : Flat Printed Circuit ASU prototype contain 4 hardroc chips Detector size of ASU prototype is 8x32mm Test with 3 ASU prototype (or 2 ASU minimum) First assembly in october 2008 ; Beam test in november 2008 DIF Samtec connection

14 november 2008The DHCAL for the m2 and m3 prototype3 From proto to M 2 design Projet 6_HR2 Projet 24_HR2 Module with HR2 Proto with 4 HR1 Design with 24 HR2

14 november 2008The DHCAL for the m2 and m3 prototype4 Detector module in M 2 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) Each ASIC process traitment of 64 pads (8x8cm) ~1 m Cut with bulk By cern Cut with bulk By cern PCB before assembly

Intermediate board 14 november 2008The DHCAL for the m2 and m3 prototype5 Link in M 2 : ASIC chip (64 channels) : Hirose connector : Terminaison board : Flat Printed Circuit Intermediate board DIF Samtec connection DIF Samtec connection DIF Samtec connection

14 november 2008The DHCAL for the m2 and m3 prototype6 Data flow: DIF ASIC Driver circuit on intermediate board Resistor on terminaison board = FPGA on DIF Add buffer by precaution for CK_SC Put resistor on ASU => remove terminaison board ?

14 november 2008The DHCAL for the m2 and m3 prototype7 Data flow: DIF ASIC Shunt chain on intermediate board Shunt chain with driver on terminaison board = FPGA on DIF Add buffer by precaution for Q_SC Put shunt and driver on ASU => remove terminaison board ?

14 november 2008The DHCAL for the m2 and m3 prototype8 Data flow: DIF ASIC Open Collector driver for digital signals Multiplexer for analog signal Add OC driver by precaution for Dout, Ramfull,Transmit_on?

14 november 2008The DHCAL for the m2 and m3 prototype9 Power distribution: DIF ASIC, dectector : Power connector Micromegas High Voltage mesh2 Low Voltage Analog power Low Voltage Digital power Micromegas High Voltage mesh1 Micromegas High Voltage drift cathode

Urgent Questions 1 or 2 design for ASU 1 or 2 connector by line 14 november 2008The DHCAL Board for the m2 and m3 prototype10

14 november 2008The DHCAL for the m2 and m3 prototype11 Detector module in M 2 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 1 unified ASU PCB ~1 m PCB before assembly Intermediate board DIF Samtec connection DIF Samtec connection DIF Samtec connection + Terminaison board

14 november 2008The DHCAL for the m2 and m3 prototype12 Detector module in M 2 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 32x48 cm ( 24 ASICs ) (HARDROC or DIRAC) 2 type of ASU PCB ~1 m Intermediate board DIF Samtec connection DIF Samtec connection DIF Samtec connection Type 1 Type 2 (with terminaison)

14 november 2008The DHCAL for the m2 and m3 prototype13 From proto to M 2 design Proto with 4 HR1 68 points 30 points 80 points 40 points Change for type1 or type2? type1 type2