SVD Summary Markus Friedl (HEPHY Vienna) Wetzlar SVD-PXD Meeting, 6 February 2013

 Dense schedule  Lots of discussion  This is only a summary  Please look at actual presentations for details  Nice finale: conference dinner 6 February 2013M.Friedl (HEPHY Vienna): SVD Summary2

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary3 Sensors Modules Electronics Testbeam Results Software Summary

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary4 Sensors Modules Electronics Testbeam Results Software Summary

DSSD sensors 5 Feb Toru Tsuboyama

Summary Large DSSD Necessary sensors have been delivered. We can have more mechanical samples. Trapezoidal DSSD 2 prototypes have been produced and tested with Micron. Mixed (proto-I) and Atoll (proto-I) p-stop for n-side strips. Analysis result will be presented by Manfred. Atoll p-stop showed the best performance. Order is done.  Delivery in September Small (L3) DSSD Total 24 chips have been ordered to HPK. Specification in TDR was not changed. DSSD structure is same as that of large DSSD Delivery: End of September. DSSD T. Tsuboyama (KEK) PXD-SVD meeting, 5 Feb 2013, Watzler, Germany 6

Comments on ladder structure 5 Feb Toru Tsuboyama

Length of Origami/PF/PB DSSD T. Tsuboyama (KEK) PXD-SVD meeting, 5 Feb 2013, Watzler, Germany 8 It looks the present length of ORIGAMI PCB, PF1, PF2, PB1 and PB2 is determined from those models. I already submitted all the flex circuits. – I would like to know how tolerance this structure have. We still have some time to change length. Origamis & pitch adapters will be delivered by end of March.

DSSD-Rib height Barrel part 1.5 mm Slant part 1.0 mm 1.0 mm is rather tight as we will apply 2-row bonding loop height 0.3 mm and 0.6 mm. Immanuel already knows this and is correcting the design. DSSD T. Tsuboyama (KEK) PXD-SVD meeting, 5 Feb 2013, Watzler, Germany mm 1.0 mm

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary10 Sensors Modules Electronics Testbeam Results Software Summary

SVD Ladder assembly at IPMU Yoshiyuki Onuki University of Tokyo, Kavli IPMU Higuchi Takeo, Kavli IPMU 11

Summary REBO-7 (wire-bonding machine) is available to make 10 g. In PA1 case, parameters are recommended – PA1 (Power 60, Force 60,Time 20(ms)) – Detector (Power 60, Force 60,Time 20(ms)) PA1 (P60, F20, T20) Detector (P60, F20, T20) Foot-prints 12

New space for TIFR at IPMU Construction: 21th(Tur) Feb. – 27 th (Wed) Feb. 13

Status We are preparing the MoU between TIFR and Kavli IPMU. – New clean room space will be allocated for TIFR L4 assembly. – Our(Japan, Korea, TIFR) office room will be allocated in the Kashiwa Research Complex 2 building. Wire bonder shipment work has started. – The bonder, Delvotec 6400 (property of TIFR), will be delivered by 20th March. 14

SVD ladder assembly procedure v /02/05 Yoshiyuki Onuki University of Tokyo, Kavli IPMU 15

Let me skip some details  Onuki-san showed 100 slides with technical details on the actual assembly procedure of a L6 ladder  Yes, it is a pretty complicated procedure  These slides are a very valuable reference for experts  But I cannot really show them in this summary  すみません。 166 February 2013M.Friedl (HEPHY Vienna): SVD Summary

Plan Assembly simulation will be finished near future?(within a couple of days to 1 week). The jigs will be submitted next week. We’ll assemble mockup in this March with Vienna and TATA group at IPMU. 17

Mechanical QA of DSSD 2013/2/5 The University of Tokyo High Energy physics Aihara-lab Nobuhiro Shimizu 18

Alignment of DSSD 19 By rotating three micrometers, we can move DSSD along x, y, θ axis. ← Setting xyzθ stage. Vacuum control enables to exchange DSSD between alignment jig and assembly bench.

20 Result of measurement Black line is design value Example of Output Red lines are acceptable range(10um) Flow of Measurement

21 Summary  Combining a software and xyzθ stage, we can align DSSDs with a precision around 5um. It takes about 4min/DSSD. -> In realistic time, we can achieve our goal 10um.  Detecting a contrast of alignment mark, we can measure a position of DSSD with a precision less than 3um. -> This method is usable in actual assembly.

3 rd PXD/SVD Workshop Wetzlar, Germany L5 Assembly Plans in Vienna 5 February 2013 Christian Irmler (HEPHY Vienna)

HEPHY Clean Room Extension 23Christian Irmler (HEPHY Vienna)5 February 2013 Clean room for sensor tests Ladder assembly clean room Electronics assembly stuff will be moved to another room Wall will be removed Clean room can be extended to almost twice its actual size

New Ladder Assembly Clean Room 24Christian Irmler (HEPHY Vienna)5 February 2013 CMM Wire bonder Climate chamber CMM, wire bonder, assembly table and storage in the same room Plan to purchase a climate chamber for thermal testing Central vacuum tubes (maybe suspended from ceiling)

Schedule 25Christian Irmler (HEPHY Vienna)5 February 2013 January 2013: Clean up future room for electronics assembly Early February 2013: prepare services for electronics assembly 5+6 February 2013: paint and clean the room End of February 2013: Transfer and reinstall electronics assembly machines March 2013: –Prepare electrical installation and services in new clean room –Remove the wall –Paint (with special non-dusting paint) and clean the room April 2013: –Relocate wire bonder –Commissioning of new ladder assembly clean room

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary26 Sensors Modules Electronics Testbeam Results Software Summary

SVD FADC Status Markus Friedl (HEPHY Vienna) Wetzlar SVD-PXD Meeting, 5 February 2013

Data Format: Zero-suppressed + Hit Time  Normally, only peak sample and peak time is sent (orange)  Yellow sample data block only appears if hit time cannot be found reliably  E.g. double-peak due to pile-up  “Samples Next” = 1 in such a case 5 February 2013M.Friedl (HEPHY Vienna):SVD FADC Status28

Summary  FADC readout system in progress  Altera Stratix IV GX daughter board is produced  Now being populated and then tested  FADC mother board layout in progress  Junction box ready  1 Kenwood power supply now in Vienna  First draft of FADC output data formats exists  Four modes of operation with different output format  Highest bits unambiguously characterize headers, data and trailer 5 February 2013M.Friedl (HEPHY Vienna):SVD FADC Status29

Prototype of the SVD Finesse Transmitter Board (FTB) (Sender Part for HSD Link) wacek ostrowicz 14 slides The Prototype of the SVD FTB Recent Status for PXD+SVD combined DAQ session on Wednesday at 3rd Belle II PXD/SVD Workshop and 12th International Workshop on DEPFET Detectors and Applications in Wetzlar, Germany 4-6 February 2013

FTB Prototype version wacek ostrowicz4/14 Prototype of the SVD Finesse Transmitter Board (FTB) (Sender Part for HSD Link)

IV. Summary The most important and urgent goals: 1. Start the PCB production. 2. Agree on the Interface between Belle2Link core and FTB core 3. Start the Modules production 3. Agree on the Interface between TTD core and FTB core 4. Finish full FTB firmware. Thank you wacek ostrowicz14/14 Prototype of the SVD Finesse Transmitter Board (FTB) (Sender Part for HSD Link)

4 February 2013M.Friedl (HEPHY Vienna): SVD Introduction33

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary36 Sensors Modules Electronics Testbeam Results Software Summary

SVD-PXD meeting, Wetzlar (Germany), February 5, 2013 Beam test analysis status M. Valentan

Performance of irradiated Belle II modules Irradiated items: both Wedge & Origami 4 –Origami 3 NOT irradiated, serves as reference module After 10 MRad 60 Co gammas –p-side: Wedge down to Origami level –n-side: Wedge unchanged, Origami 4 suffered 38M. Valentan (HEPHY Vienna)February 5, 2013

Conclusions of preliminary results The wedge sensor works fine –Production has started, full delivery due end of 2013 p-stop layout: Let’s go for atoll! –Atoll pattern superior to combined pattern –p-spray suffers from irradiation –HPK uses atoll p-stop with similar geometry Tracking and resolution studies –needs very deep understanding of data –Work in progress February 5, M. Valentan (HEPHY Vienna)

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary40 Sensors Modules Electronics Testbeam Results Software Summary

5 February 2013Christian Irmler (HEPHY Vienna)44

6 February 2013M.Friedl (HEPHY Vienna): SVD Summary50 Sensors Modules Electronics Testbeam Results Software Summary

We still have room in case our community grows

We thank Sören and his team for organizing this wonderful meeting!