Strip detector with surrounding guardring Dimension Details 6750um (active edge boundaries) 6500um active width (130strips x 50um) Entrance window for.

Slides:



Advertisements
Similar presentations
Silicon Technical Specifications Review General Properties Geometrical Specifications Technology Specifications –Mask –Test Structures –Mechanical –Electrical.
Advertisements

This will be your summary section.
ECFA-DESY meeting, Krakow, 16 th September 2001Václav Vrba, Institute of Physics, AS CR 1 Václav Vrba Institute of Physics AS CR, Prague Silicon pad sensors.
3.7 Optimization Problems
Magnet rotated by 5.9 degree Distance from entrance point to magnet right bottom corner m.
G.Villani jan. 071 CALICE pixel Deep P-Well results Nwell ≈ 900 μm 2 P-well 1μm ring gap Collecting diodes 3.6 x 3.6 μm 2 Bias: NWell 3.5V Diodes: 1.5V.
20th RD50 Workshop (Bari)1 G. PellegriniInstituto de Microelectrónica de Barcelona G. Pellegrini, C. Fleta, M. Lozano, D. Quirion, Ivan Vila, F. Muñoz.
Status and outlook of the Medipix3 TSV project
3D chip and sensor Status of the VICTOR chip and associated sensor Bonding and interconnect of chip and sensor Input on sensor design and interconnection.
Sensor and ladder and dimensions dateChangeVersionwho 3/26/2013Updated with U2 fid positions 1.1LG.
1 Monolithic Pixel Sensor in SOI Technology - First Test Results H. Niemiec, M. Koziel, T. Klatka, W. Kucewicz, S. Kuta, W. Machowski, M. Sapor University.
Using the Alphabet of lines. Drawing should be near bottom left corner. The front view shows how wide and how tall the object is.
Medipix sensors included in MP wafers 2 To achieve good spatial resolution through efficient charge collection: Produced by Micron Semiconductor on n-in-p.
Sensor (0,0) (20235, 22725) PXL Ultimate sensor Diced Silicon Size mm x mm There is a uniform 15 um border around the sensor lithography 15.
Inserting one 3” Long Pipe Component before another Piping Component (Flg Pair). 1.
TDCPIX_2012. TDCPIX size Proposal numbering pads.
Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing.
Foundry Characteristics
February, 2007Vaclav Vrba, Prague FVTX Strip Sensor Design General features:  Strip pitch = 75 µm  # chip channels = 128;  chip width = 128 x 75 µm.
Draw a Castle In Two Point Perspective. When making cylinders appear three-dimensional, you begin by drawing a rectangle using two-point perspective.
25th RD50 Workshop (Bucharest) June 13th, Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona IMB-CNM, Barcelona (Spain)
Dimensioning the focal plane (RSC centric version) C. Bebek 9 July 2003 Revised 14 July 2003.
Maximum Areas in HPK Rule (ATLAS internal only) Y. Unno (KEK) 2015/1/13, 2015/4/8 updated, Y. Unno1.
XYZ 1/7/2016 MIT Lincoln Laboratory APS-2 Diode Simulation First Look V. Suntharalingam 27 July 2007.
Design and Implement a Electro thermal Compliant
Tonto B. 22 Full field – 3 dies in a field Structure repeated Die #2 Structure repeated Die #3 Die #1 (0,0) (19340,6420) 6420um.
Magnification showing pads and “bias ring” First Look at SiD Charge Division Sensors at SCIPP.
Maria Rita Coluccia Simon Kwan Fermi National Accelerator Laboratory
R. Bradford 10 December, 2014 Sensor Details. Explanation Submitted some designs that will be included on the Novati/Tezzaron submission. Designs based.
ICT 1 SINTEF Edge-On Sensor with Active Edge Fabricated by 3D-Technology T. E. Hansen 1), N. Ahmed 1), A. Ferber 2) 1) SINTEF MiNaLab 2) SINTEF Optical.
Giulio Pellegrini 27th RD50 Workshop (CERN) 2-4 December 2015 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona 1 Status of.
Latest news on 3D detectors IRST CNM IceMos. CNM 2 wafers fabricated Double side processing with holes not all the way through, (aka Irst) n-type bulk.
R. Bradford 3 February,  BNL offered to share 4” wafer. We purchased ¼ of the wafer with the remainder being used for silicon drift detectors for.
CHAPTER 15 Floating and Positioning. FLOAT VS. POSITION  Floating an element moves it to the left or right, allowing the following text to wrap around.
IRC 2009 OVERALL. SITE PLAN PROPERTY LINES LOCATION OF BUILDING GRADES STREETS.
3D Simulation Studies of Irradiated BNL One-Sided Dual-column 3D Silicon Detector up to 1x1016 neq/cm2 Zheng Li1 and Tanja Palviainen2 1Brookhaven National.
Contact Us.
New Mask and vendor for 3D detectors
Available detectors in Liverpool
Temperature Sensors on Flexible Substrates
SuperB SVT Silicon Sensor Requirements
Sensor Wafer: Final Layout
CEN 180: Civil Engineering Drawing II
HPL DG d=1.4mm/e= mm.
How To Add A Xerox Printer To Google Chrome
Frio River Cabins - Frio Vacation Homes - Frio Country Resort
Design and fabrication of Endcap prototype sensors (petalet)

Layer Thickness and Map Width
Jute Padding 1974 TCS before removal
Development of thin GEM readout structures
Монголын ноосон бүтээгдэхүүн үйлдвэрлэгчдийн холбоо
بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه
Faded picture background with full-color overlay (Intermediate)
Darkened picture background with full-color circle (Intermediate)
Documentation Standards
ECE 424 – Introduction to VLSI Design
Cross section It is supposed a hill has been cut vertically, then we can see the side view, or cross section of the hill A section is a slice vertically.
Ашық сабақ 7 сынып Файлдар мен қапшықтар Сабақтың тақырыбы:
Windows басқару элементтері
Қош келдіңіздер!.
ISO view of pipe w/ individual EC detector installed
Информатика пән мұғалімі : Аитова Карима.
Firebase Vs. MongoDB: Choose the Best Database of 2019
For More Details:
Meet Us
Now Buy Best External Door Hardware from Doorhardware
Contact Us
Faded picture background with full-colour overlay (Intermediate)
Fabrication of 3D detectors with columnar electrodes of the same doping type Sabina Ronchina, Maurizio Boscardina, Claudio Piemontea, Alberto Pozzaa, Nicola.
Presentation transcript:

strip detector with surrounding guardring Dimension Details 6750um (active edge boundaries) 6500um active width (130strips x 50um) Entrance window for x-rays 2415um

Pad layout for strip detector w/surrounding Guard Ring Backside contact: opening 196um x 46um, both left and right bottom corner Pad opening: 32umx192um Guard ring Pad opening 32umx192um

Cross section of GR device Active device on support substrate 2415um Active device Support substrate 75um (plasma diced) 300um (wafer-saw) 2415um 50um-100um?