LengthWire Length Bond Wire Diameter 0.8 mil1.0 mil1.2 mil1.3 mil Resistance (Ohm) 5 mm0.3830.2570.1980.180 2 mm0.1540.1030.0790.072 Inductance (nH) 5.

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Presentation transcript:

LengthWire Length Bond Wire Diameter 0.8 mil1.0 mil1.2 mil1.3 mil Resistance (Ohm) 5 mm mm Inductance (nH) 5 mm mm Capacitance (pF) 5 mm mm Mutual Inductance (nH) 5 mm mm Mutual capacitance (pF) 5 mm mm MOSIS packaging vendors use 1 mil gold wire by default. Other bond wire diameters (smaller 0.8 mil or larger 1.2 or 1.3 mil) may be used in special cases. See Electrical Package Characterization. Under "Additional Information" select Plastic Packages' Electrical Performance: Reduced Bond Wire Diameter (PDF).Electrical Package Characterization Powersupply Decoupling Mosis IC Package Electrical Parasitics

TI AN-1205 Electrical Performance of Packages – RLC Values for lead-frame based packages and micro SMD packages

TI RLC Data for CSP Packages

TI RLC Data for BGAs without planes

TI IC Package Wirebond Inductance

Intel Multilayer Package Lead Electrical Characteristics

Intel Crosstalk Package Electrical Characteristics Inductive Parsasitics

Intel Crosstalk Package Electrical Characteristics (continued) Capacitive Coupling

Intel PQFP Package Electrical Parasitics

Intel QFP Package Electrical Parasitics Intel SQFP/TQFP Package Electrical Parasitics

Intel Package I/O Lead Electrical Parasitics for TCP Packages

Intel Package Core Power Loop Electrical Characteristics

Intel CQFP Electrical Data (a mature package)

Intel MM Electrical Data (a mature package)

Intel PQFP Electrical Data (a mature package)

Intel PLCC Electrical Data (a mature package)

Intel QFP Electrical Data (a mature package)

Intel SQFP/TQFP Electrical Data (a mature package)

Intel SOP Electrical Data (a mature package)