AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 1 – outermost chip pads and bias for isolated amplifiers Note the “bars” of bias pads encircling the chip. For bias bonds, anywhere along these extended pads is equivalent and can be varied, if another angle is easier to achieve during wire-bonding. p September 2015 Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Pink = bias for amplifiers iPFB iNBias VPLoad iN iNSF Casc iPFB iNBias VPLoad iN iNSF Casc APA8 APA1 APA2 APA3 APA4 APA5 APA6 APA7 Board cutout for Edge TCT Note that for this Edge TCT configuration, Active Pixels Arrays APA1 and APA7 are not bonded out, so that arrays APA2 and APA8 can be read out. This is because APA2 and APA8 could be stimulated by laser.

AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 2 – inner throw for Passive Pixel Array 9 (PPA9) and the isolated amplifiers. These are layers of bonds arcing over the bonds for active pixel array APA3. p. 2 iPFB iNBias VPLoad iN iNSF Casc iPFB iNBias VPLoad iN iNSF Casc APA8 APA1 APA2 APA3 APA4 APA5 APA6 APA7 PPA9 Board cutout for Edge TCT Note that isolated amplifier pads Out4 and Out5 are not connected, to ease the bonding of PPA9. Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Pink = jumpers to outer pads

p. 3 iPFB iNBias VPLoad iN iNSF Casc iPFB iNBias VPLoad iN iNSF Casc APA8 APA1 APA2 APA3 APA4 APA5 APA6 APA7 AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 3 – outer throw for isolated amplifiers This is a layer arcing over the inner throw for the isolated amplifiers, or interspersed with the inner throw. Bonds anywhere along the long vertical input ‘bar’ pad are equivalent. Board cutout for Edge TCT Note that isolated amplifier pads In4 and In5 are not connected, to ease the bonding of PPA9. The angle of the 5 input wire bonds can be varied freely, as bonding anywhere along the extended input pad is equivalent. Input pad for isolated amplifiers Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground

AMS-CHESS-1 daughterboard – bonding diagram for Edge TCT Part 4 – bonds for capacitors and high voltage Capacitors should be glued with non-conductive glue p. 4 Blue = signal Yellow = bias Orange = 3.3V Red = HV White = ground Bond these pads multiple times iNSF iN iPFB VDD3V3 Board cutout for Edge TCT

Notes about capacitors Capacitors should be glued with non-conductive glue. Pins 1 & 2 are tied together; pins 3 & 4 are tied together. Orientation for C1, C4, C5 and C6: Orientation for C3: p. 5 Label expected to be E6101 on all capacitors C1 = VDD3V3 to GNDC4 = iN to GND C3 = VDD3V3 to GNDC5 = iPFB to VDD3V3 Note, there is no C2 (by oversight)C6 = iNSF to GND Capacitor specifications: Manufacturer: Ipdia Part number: EMSC 42F.610 ( F.610) Value: 100nF Size: 0404 Height: 100µm This connecting bar is probably the best feature for orienting the capacitors.