Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/20101Susanne Kyre UCSB.

Slides:



Advertisements
Similar presentations
Conduction Conceptests
Advertisements

Further Modifications to the ARIES T-tube Divertor Concept Jeremy Burke ARIES-Pathways Project Meeting Jan 26,
Application of Steady-State Heat Transfer
Mike Fitton Engineering Analysis Group Design and Computational Fluid Dynamic analysis of the T2K Target Neutrino Beams and Instrumentation 6th September.
The Layup of the Multi-chip Module Note: Assuming all two glues are of silicone type.
Status of T2K Target 2 nd Oxford-Princeton High-Power Target Workshop 6-7 th November 2008 Mike Fitton RAL.
The AMS-02 detector is based on a large acceptance (~0.5 m²sr) and high sensitivity spectrometer composed by a super-conducting magnet (0.8 T), cooled.
1 Module and stave interconnect Rev. sept. 29/08.
M. Yoda, S. I. Abdel-Khalik, D. L. Sadowski and M. D. Hageman Woodruff School of Mechanical Engineering Extrapolating Experimental Results for Model Divertor.
The LHCb Inner Tracker LHCb: is a single-arm forward spectrometer dedicated to B-physics acceptance: (250)mrad: The Outer Tracker: covers the large.
Feasibility Analysis h T1 T2 T3 T4 T5 One Dimensional Transient Analysis One Dimensional Finite Difference Steady State Analysis T1 and T5 will be known.
Mechanical Work Plan Discussion Bill Cooper Fermilab.
W. EbensteinDOE Review Duke UniversitySeptember 1999 TRT Barrel Cooling: Electronics  Motivation: u Overheating of electronics causes premature failure.
M. Gilchriese Integrated Stave Mechanics/Cooling Backup ATLAS Upgrade Workshop Valencia December 2007 M. Cepeda, S. Dardin, M. Gilchriese, C. Haber and.
26 April 2013 Immanuel Gfall (HEPHY Vienna) Belle II SVD Overview.
Calorimeter Analysis Tasks, July 2014 Revision B January 22, 2015.
, T. Tischler, CBM Collaboration Meeting, GSI Status MVD demonstrator: mechanics & integration T.Tischler, S. Amar-Youcef, M. Deveaux, D. Doering,
Rate Processes - Part 1. 2 Objectives Know the relationships between rate, flux, and driving force Define the proportionality constants for heat, fluid.
20 th June 20111Enrico Da Riva, V. Rao Project Request and Geometry constraints June 20 th 2011 Bdg 298 Enrico Da Riva,Vinod Singh Rao CFD GTK.
Low mass carbon based support structures for the HL-LHC ATLAS pixel forward disks R. Bates* a, C. Buttar a, I. Bonad a, F. McEwan a, L. Cunningham a, S.
VG1 i T i March 9, 2006 W. O. Miller ATLAS Silicon Tracker Upgrade Upgrade Stave Study Topics Current Analysis Tasks –Stave Stiffness, ability to resist.
July 4 th 20061Moritz Kuhn (TS/CV/DC/CFD) CERN July 4 th 2006 Moritz Kuhn Cooling of the P326 Gigatracker silicon pixel detector (SPIBES) CFD – Cooling.
Y. Ikegami, T. Kohriki, S. Terada Y. Unno (KEK), K. Hara (Univ. of Tsukuba) G. Barbier, F. Cadoux, A. Clark, D. Ferrere, S. Gonzalez-Sevilla, D. La Marra,
BTeV Pixel Substrate C. M. Lei November Design Spec. Exposed to >10 Mrad Radiation Exposed to Operational Temp about –15C Under Ultra-high Vacuum,
FVTX substrate FEA1 FVTX Substrate FEA C. M. Lei March 02, 2006.
Thermal & Mechanical Support for Diamond Pixel Modules Justin Albert Univ. of Victoria Nov. 6, 2008 ATLAS Tracker Upgrade Workshop.
August 7, 2003K. Chow, LHC Luminosity Detector Thermal Analysis1 Analysis cases Approach: Start simple to get information— with speed with confidence that.
PHENIX Silicon Vertex Tracker. Mechanical Requirements Stability requirement, short and long25 µm Low radiation length
LHC CMS Detector Upgrade Project FPIX Cooling Update Stefan Grünendahl, Fermilab For the FPIX Mechanical Group, 29 January 2015 Stefan Grünendahl,
1 VI Single-wall Beam Pipe Option: status and plans M.Olcese TMB June 6th 2002.
1 Monophase Measurements on Prototype Pixel Structures D. Bintinger, M. Gilchriese, J. Taylor and J. Wirth and contributions from D. Cragg, E. Perrin and.
12/3/2015R. Mountain, Syracuse University LHCb CO2 Cooling EDR2.
D. M. Lee, LANL 1 07/10/07 Forward Vertex Detector Overview Technical Design Overview Design status.
Walter Sondheim 6/9/20081 DOE – Review of VTX upgrade detector for PHENIX Mechanics: Walter Sondheim - LANL.
Phase 1 FPix Cooling Tube Testing Erik Voirin, C.M. Lei, Harry Cheung, Stefan Gruenendahl (FNAL) Kirk Arndt, Qiuguang Liu (Purdue) Phase 1 FPIX cooling.
M. Yoda, S. I. Abdel-Khalik, D. L. Sadowski, B. H. Mills and M. D. Hageman G. W. Woodruff School of Mechanical Engineering Correlations for Divertor Thermal-Hydraulic.
PS Module Ron Lipton, Feb A bit of History During much of the conceptual design phase of the outer tracker we had focused on the “long barrel”
Marc Anduze – CALICE Meeting – KOBE 10/05/07 Mechanical R&D for Technological EUDET ECAL Prototype.
A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN1 Micro-module assembly -  -module elements - alignment of the silicon sensors to the.
Upgrade PO M. Tyndel, MIWG Review plans p1 Nov 1 st, CERN Module integration Review – Decision process  Information will be gathered for each concept.
E. Da Riva/M. Gomez Marzoa1 WG4 Meeting - 27th June 2012 Air Cooling by means of carbon fiber structure Enrico DA RIVA (EN-CV-PJ) Manuel GOMEZ MARZOA (EN-CV-PJ)
Pixel upgrade test structure: CO 2 cooling test results and simulations Nick Lumb IPN-Lyon MEC Meeting, 10/02/2010.
Cooling of GEM detector CFD _GEM 2012/03/06 E. Da RivaCFD _GEM1.
Exercises for Q1. Insulated copper tube A thin walled 10 mm copper tube is used to transport a low-temperature refrigerant with a temperature that is.
10 September 2010 Immanuel Gfall (HEPHY Vienna) Belle II SVD Upgrade, Mechanics and Cooling OEPG/FAKT Meeting 2010.
Origami and Cooling 24th September 2012 C. Irmler (HEPHY Vienna) Joint PXD and SVD Meeting Göttingen.
Tracker Upgrade Mechanical/Thermal Engineering 3 June meeting theme: Modules and Structures News on Phase 1 BPIX Upgrade Mechanics & Modules, R. Horisberger.
B [OT - Mechanics & Cooling] Stefan Gruenendahl February 2, 2016 S.Grünendahl, 2016 February 2 Director's Review -- OT: Mechanics &
TUTORIAL 1 7/3/2016.
MVD COOLING STATUS-PAST AND UPDATES PIXEL COOLING PROJECT: -STUDIES and TEST on MATERIALS (Carbon Foam) -THERMAL FEM ANALYSES and TEST on DISKS and STAVES.
TS Cool Down Studies TSu Unit Coils (24-25) N. Dhanaraj and E. Voirin Tuesday, 10 March 2015 Reference: Docdb No:
MVD COOLING STATUS COOLING PLANT UPDATE: -ADDITION of the NEW CIRCUITS FOR GBT AND DC-DC Converter BOARDS IN THE COOLING PLANT -THERMAL STUDY OF GBT AND.
FVTX substrate FEA1 FVTX Substrate FEA C. M. Lei March 02, 2006.
Graham Beck (QMUL) LBNL Sept Berlin, March 2013: FEA of Side-Mounted Card + Straight Cooling Pipe (not wiggled through SMC region): For adequate.
Atlas SemiConductor Tracker final integration and commissioning Andrée Robichaud-Véronneau Université de Genève on behalf of the Atlas SCT collaboration.
Marc Anduze – EUDET Meeting – PARIS 08/10/07 Mechanical R&D for EUDET module.
Mickael Frotin– 19/10/2009 ECAL MACHANICAL R&D CALICE meeting - Genève 1.
13 May 2011 Eddy Jans 0 Plans for the VELOpix-module LHCb-Nikhef discussion some specifications some requirements some ideas about the VELOpix-module some.
Local Supports for Inclined Layout: CERN Update
? ENDCAP: Mechanics IFIC-Valencia.
Optimized design for an sLHC Silicon tracker
Phase 2 Outer Tracker Module analysis
Ideas and Plans on Tracker Module Mechanics Developments
WG4 – Progress report R. Santoro and A. Tauro.
Hybrid Mechanical/Thermal Design ideas
SIT AND FTD DESIGN FOR ILD
Tests on a dummy facet of PIX upgrade using CO2 cooling
Thermal behavior of the LHCb PS VFE Board
Single Detector Design
Presentation transcript:

Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/20101Susanne Kyre UCSB

TK Module design parameters from Nov 2009 TUPO presentation by Hans Postema 2.5 cm strip length Sensor glued on 2 TPG strips TPG strips on the backplane side TPG strips connected to cooling block on cooling pipe Hybrid with apv’s glued on sensor, strip side, above the TPG strip DC-DC converter glued on the TPG strip of the sensor. One DC-DC converter powers 2 hybrids 2/8/2010Susanne Kyre UCSB2

Dimensions and Materials PartMaterialArea [mm 2] Thickness [mm] thermal conductivity [W/mK]Power [mW] SensorSilicon84.5 x ChipSilicon10 x DC-DC coilSilicon12 x HybridG10 and copper 85 x x 30 (ears) in plane; 0.37 out of plane Support stripTPG116 x in plane; 20 out of plane Epoxy thermally conductive epoxyall glue joints Cooling BlockBeryllium Oxide 13.5 x mm cooling tube dia /8/20103Susanne Kyre UCSB

Module FEA 2/8/2010Susanne Kyre UCSB4

Result of steady state thermal analysis Maximum Temperature: -27.0°C (at center readout chips on hybrid #2) 2/8/2010Susanne Kyre UCSB5

Result of steady state thermal analysis Maximum Sensor temperature: -28.3°C 2/8/2010Susanne Kyre UCSB6

TK Rod design parameters 12 Modules per rod (6 facing up, 6 facing down) One cooling loop per rod Cooling block temperature at inlet: -30°C Cooling block temperature at outlet: -25°C Sensor, DC-DC and Readout chip power as in Module analysis 2/8/2010Susanne Kyre UCSB7

Cooling block temperatures From Module analysis: Heat flux through cooling block-pipe interface differs with cooling block location Assume: ΔT between cooling blocks is proportional to difference in heat flux between cooling blocks 2/8/2010Susanne Kyre UCSB8

Rod FEA 2/8/2010Susanne Kyre UCSB9

Result of steady state thermal analysis Maximum Temperature: -24.0°C at hybrid #2 on module closet to inlet/outlet 2/8/2010Susanne Kyre UCSB10 Max. Temp

Result of steady state thermal analysis Maximum Sensor temperature: -25.1°C at sensor closest to inlet/outlet This sensor also has the largest temperature gradient: 3.0°C across the sensor 2/8/2010Susanne Kyre UCSB11