Your Technology Experts…2016

2 Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. Your Full Service, Time Sensitive, Printed Circuit Board Solution Mil / Aerospace Medical DataCom TeleCom Industrial

3 Streamline Circuit Corp’s Facility Manufacturing all levels of technology – Time sensitive prototyping through production The facility was established in 1982 – New management team installed September ,000 sq. ft. PCB manufacturing facility – Complete manufacturing process 1 mile from the San Jose Airport – Delivery convenience for out of state customers Located in Silicon Valley – Short car ride away for pick up & deliveries Financially secure in current market conditions – Low cost infrastructure Located in Silicon Valley

Management and their Experience Chuck Dimick –CEO / Founder Over 35 years of experience in PCB manufacturing. Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson – President / Founder Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak – Sr. Vice President of Sales & Marketing / Founder Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Gary Greenberg – VP of Operations Over 31 years of industry experience. Previously VP of West Coast Operations for the EMS Division. Has held roles in Operations, Engineering, and Quality at DDI, Teradyne and Raytheon. Glenn Holland – Director of Quality Over 31 years of Industry experience. Previously held position of Director of Quality at TTM / Via Systems. Has experience in Operations, Assembly, Engineering and Quality.

Management and their Experience Cont. Mike Trammel – Director of Engineering Over 27 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience. Lorraine Hook – Director of Quality Systems Over 44 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager. JR Ramirez – Production Manager / Founder Over 35 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Louis Oliveira – Pre-Production Engineering Manager Over 28 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits. Phil Ramon – Pre-Production Engineering Supervisor Over 37 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex.

6 Customer Service Support Customer Service (24 hours - 7 days a week) –Sales, Engineering, Manufacturing and Quality Dedicated customer service readily available-our support group’s located onsite in the facility Quick response to all requests such as: –Job status –Delivery pull-in –Quantity Increases –Engineering design modification Inside Sales Customer Support

7 Proactive Engineering Services Manufacturing Capabilities –Prototype though volume –All time sensitive builds DFM (Design for Manufacturability) –DFM Software (reviews in 10 minutes) –Net list compare to customer data –Custom Verification programs –Looking for customer design error –In plan Smart data Collection System Controlled Impedance Verification –Stack up assistance –Copper distribution –Material verification Cam Valor Stations 4 Laser Direct Imaging units

8 Pre-Production Engineering Services “In Plan” planning software Customer Specific Rules Based Automation Valor front end CAM (Unlimited Seats) Industry Standard for front end engineering Stack up consultations, Service Offered No Charge $ Insight Frontline DFM’s, Service Offered No Charge $ Tech Seminars /Webinars Material Science, Latest in Laminates and Pre Preg’s R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready!

DFM Scan & Report Stack up assistance Copper distribution Material verification Sub Panel /Array Support Controlled Impedance Verification

10 Quality Reassurance Net list compare prior to MFG –Matching Net list to Gerber data Front End DRC (design rule check) –Searching for customer design mistakes AOI Automated Optical Inspection –Verifying inner & outer layers X-Ray Verification –After Lam (Inspecta), After Drilling Cross Section Verification –Hole Integrity True-Chem Software Controlled Impedance Testing –TDR test of panel coupons 100% Net List Test On All Product –Eliminator Tester & flying probe Coordinate Measurement Machine –First articles, 100% measurement verification In house Mil & deliverable Lab Automated Optical Inspection Fusion 22

11 On Time Delivery Assurance 100% In-house manufacturing from start to finish –Control delivery & customer flexibility –In-process quality verification system –No out sourcing delivery delays Employee Training program –Performance evaluation every 6 months In-house Chemical Laboratory –Cross Sections –Chemical analysis –Mil spec verification Vacuum Lamination press 10 flying Probe Testers

12 Continuous Improvement Programs Working daily on: – Research and Development – Pre-Engineering Programs – Improvement Process Program – Department Performance Reviews – Preventative maintenance program – Employee Training Program – Planned Capital expense program Management meetings 7 Laser drills

13 A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28:1 High Aspect Ratio 3.23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. AS9100 Rev. C / ISO 9001 / ISO Mil-Spec / ITAR RoHS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24” x 30” Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non- Conductive Filled) 75+ Materials (Hybrid Constructions) Certifications

14 1. Line and Space 2. Drilled Via Size 3. Misc. Attributes 4. Laminate Materials.0038” +/-.001” Line Width Line Space.002” +/ ”.001” +/ ”.0005” +/ ” Tolerance.003” +/-.001 ” Drill Size Pad Diam Aspect Ratio. 008” +.010” 28:1.004” +.008” 20:1.003” +.006” 20:1.003” +.002” 28:1 Layer Count Thickness Board Size 36 to 48 Up to.300” <19”X22” 48 to 60 Up to.350” <22X28 >.350 Up to 36 Up to.187” <16”X22” UL Multilayers Interposer Substates UTR’s High Speed Flex High Reliability Flex Data Security Nano Foils Alternative Resin Systems Standard Manufacturing Advanced Manufacturing Emerging Technology Engineering walk through *UTR = Ultra Thin Rigid PCB TECHNOLOGY ROADMAP FR4 Polyimide PTFE HC (Rogers) Rigid Flex EMI Shield Conductive Bond Ply Thin Flex UL Approved Next Generation HSD Advanced Interposers Flex Rigid Flex FR4 Stiffeners

15 5. Micro Via Size Via Size Pad Dam Aspect Ratio.004” +.005”.6:1.003” +.004” 1:1.002” +.004” 2:1.001” +.003” 3:1 6. Surface Finishes HASL Entek Imm Silver ENIG ENEPIG LF HASL Eless Au Sel Solder Imm tin Solder Bump TBD 7. LDI Soldermask +/-.003”.006” +/-.002”.003” +/-.001”.002” Tangency 8. Conductive and Non-Conductive Via Fill.012” 8:1.010” 12:1.008” 18:1 < :1 Min hole Aspect Ratio Registration Min opening TECHNOLOGY ROAD MAP CONTINUED Standard Manufacturing Advanced Manufacturing Emerging Technology Engineering Walk through

ISO 9001:2000 Mil-Spec in process ITAR AS9100 Rev C Mil-Spec IPC 6012,13,15,16,18 Class 3 Nadcap

17 Q-Pulse Total Quality Management Quality Assurance Systems –Q-Pulse Quality System NCMR’s and Corrective Actions Audits Training Equipment Calibrations BACK

18 Use advanced equipment technologies to manufacture today's printed circuit board requirements The future in PCB manufacturing is about technology and automation Hire and Train equipment operators High percentage engineering personnel and staff Streamline’s Capital Expenditures Cuposit & Electroless Line Laser Direct Imaging Nuvogo 800 LDI DES Inner Layer Stripline

Design Strategies Resin Fill off set Vias Resin fill/stacked Vias Epoxy fill with copper Vias All Copper Fill process

20 A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology is a cost effective route for advanced technology. V-Stacks: Patented MicroVia technology that will change everything

Rigid-Flex Examples 6 Layer Rigid Flex 8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity 10 Layer Micro via BGA

IPC Manufacturing Class & Industries 22

Streamline Circuits Corp Martin Ave, Santa Clara, CA USA (877)