Budapest University of Technology and Economics Department of Electron Devices eet.bme.hu Research and Development at the Ferenc Ender

Slides:



Advertisements
Similar presentations
18 July 2001 Work In Progress – Not for Publication 2001 ITRS Test Chapter ITRS Test ITWG Mike Rodgers Don Edenfeld.
Advertisements

Simulation, Modelling and Computer Aided Design Laboratory
WATERLOO ELECTRICAL AND COMPUTER ENGINEERING 20s: Computer Hardware 1 WATERLOO ELECTRICAL AND COMPUTER ENGINEERING 20s Computer Hardware Department of.
Budapest University of Technology and Economics Department of Electron Devices Microelectronics (VIEE306), BSc course Autumn semester.
G-Number 1 Challenges and Opportunities for Technion and the Israeli Chip Industry Avinoam Kolodny EE Department Technion – Israel Institute of Technology.
3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits Pingqiang Zhou, Yuchun Ma, Zhouyuan Li, Robert.
Turnkey IC and Device Packaging Package Science Services LLC Package design, characterization, simulation, modeling, measurements and analysis.
Electronics’2004, Sozopol, September 23 Design of Mixed Signal Circuits and Systems for Wireless Applications V. LANTSOV, Vladimir State University
Paul Rose European Electronics AE Manager LuxLive 2013 How to use Thermal Design Software.
What disciplines students learn in Electrical and Computer Engineering Technology.
Spring 08, Jan 15 ELEC 7770: Advanced VLSI Design (Agrawal) 1 ELEC 7770 Advanced VLSI Design Spring 2007 Introduction Vishwani D. Agrawal James J. Danaher.
Spring 07, Jan 16 ELEC 7770: Advanced VLSI Design (Agrawal) 1 ELEC 7770 Advanced VLSI Design Spring 2007 Introduction Vishwani D. Agrawal James J. Danaher.
Digital Design: Chapters Chapter 1. Introduction Digital Design - Logic Design? Analog versus Digital Once-analog now goes digital –Still pictures.
Electronics Cooling Mechanical Power Engineering Dept.
Part-C Main topics B1- Electronics cooling methods in industry Heat sinks and cold plates for electronic cooling "Heat sinks" Heat pipes in electronic.
© imec IMEC and its DESICS division. © imec Personnel (1999): ± 850 people 30,000 m 2 facilities, incl. 6000m 2 ultra clean processing area.
Budapest University of Technology & Economy Department of Electron Devices.
“Electrical Engineering focuses on the fundamental aspects of the discipline such as network analysis, electronics, electronic system design, signal processing,
ME381R Lecture 1 Overview of Microscale Thermal Fluid Sciences and Applications Dr. Li Shi Department of Mechanical Engineering The University of Texas.
The University of Texas at Dallasutdallas.edu Highlights ▪ 110+ faculty in five departments ▪ Electrical Engineering ▪ Computer Science ▪ Materials Science.
We connect chips and systems
ECEn 191 – New Student Seminar - Session 5: Integrated Circuits Integrated Circuits ECEn 191 New Student Seminar.
Kick-Off Meeting Catania – February 26, 2010 THERMINATOR Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.
Masters and Masters Qualifier in Electronic Systems and Telecommunications Engineering School of Electronic Engineering
Budapest University of Technology and Economics eet.bme.hu Department of Electron Devices A. Timár, M. Rencz Temperature dependent timing in standard cell.
Chemical Vapor Deposition A Simple method of bottom up Fabrication.
Budapesti University of Technology and Economics Department of Electron Devices eet.bme.hu THERMINATOR – Training Gergely Nagy Catania,
M. McCorquodale University of Michigan Electrical Engineering & Computer Science Mobius Integrated Systems Corporation Ann Arbor, MI January, 2001 Michael.
PROF. DANIEL ERNST FEBRUARY 28 TH, 2011 COMPUTER HARDWARE CS 146 The Big Picture in Computer Science.
VLSI & ECAD LAB Introduction.
Microelectronic Packaging Education for the 21 st Century Objective Develop new courses to be developed by Faculty to be shared globally to educate students.
CMP 4202: VLSI System Design Lecturer: Geofrey Bakkabulindi
The economic competitiveness of the European Automotive Embedded Software industry: HOW CAN EUROPEAN POLICIES HELP? Brussels 28 April 2010 Dr. Panagiotis.
CSE 494: Electronic Design Automation Lecture 2 VLSI Design, Physical Design Automation, Design Styles.
FSRM TC - DTU COREP – BME CEA EUROTRAINING Microelectronics knowhow for profit EuroTraining – Supporting University Programmes in Nanoelectronics.
ECE 3110: Introduction to Digital Systems Introduction (Contd.)
Testability of Analogue Macrocells Embedded in System-on-Chip Workshop on the Testing of High Resolution Mixed Signal Interfaces Held in conjunction with.
1 Objective 3.2 Smart Components and Systems Integration Georg Kelm, DG INFSO, Nanoelectronics InfoDay, Brussels, 11 October 2010 FP7 ICT Work Programme.
MANISH GUPTA. Presentation Outline Introduction Motivation Content Expected Impact Funding Schemes & Budget.
Moore’s Law and Its Future Mark Clements. 15/02/2007EADS 2 This Week – Moore’s Law History of Transistors and circuits The Integrated circuit manufacturing.
MIcro-NanOSystems ECAD Laboratory AMICOM: Advanced MEMS for RF and Millimeterwave Communications The European Network of Excellence on RF MEMS.
EE141 © Digital Integrated Circuits 2nd Introduction 1 EE5900 Advanced Algorithms for Robust VLSI CAD Dr. Shiyan Hu Office: EERC 731 Adapted.
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology,
ICT 25 Generic micro- and nano-electronic technologies Marc Boukerche DG CONNECT, A.4 Components.
Dirk Beernaert European Commission Head of Unit Nanoelectronics EC Programmes in Micro & nanoelectronics A way to a bright future? EU 2020, KET, H2020,
Introduction to Mechatronics System Design
EMT 351/4 DIGITAL IC DESIGN Week # 1 EDA & HDL.
Main Research Areas Signal Processing and Communications
• Very pure silicon and germanium were manufactured
Introduction SISSI: Simulator for Integrated Structures by Simultaneous Iteration Experimental software package on top of a particular design kit within.
Integrated Circuits.
Date of download: 10/13/2017 Copyright © ASME. All rights reserved.
DELLSOFT Technologies Pvt. Ltd.
ELEC 7770 Advanced VLSI Design Spring 2016 Introduction
VLSI Tarik Booker.
Applied curricula in space exploration and intelligent robotic systems
ALICE PD group meeting Andrea Francescon.
Information Society & Media Directorate-General
ELEC 7770 Advanced VLSI Design Spring 2014 Introduction
Challenges in Nanoelectronics: Process Variability
Digital Integrated Circuits 01: Introduction
ELEC 7770 Advanced VLSI Design Spring 2012 Introduction
ELEC 7770 Advanced VLSI Design Spring 2010 Introduction
ECNG 1014: Digital Electronics Lecture 1: Course Overview
Trends in Electronics Reliability Testing
OBJECTIVES OF MINI PROJECT
HIGH LEVEL SYNTHESIS.
Lodz University of Technology - DMCS
CENTRO NACIONAL DE MICROELECTRÓNICA (CNM)
• Very pure silicon and germanium were manufactured
Presentation transcript:

Budapest University of Technology and Economics Department of Electron Devices eet.bme.hu Research and Development at the Ferenc Ender

© BME Department of Electron Devices, eet.bme.hu February 6, Budapest University of Technology and Economics

© BME Department of Electron Devices, eet.bme.hu February 6, Budapest University of Technology and Economics Department of Electron Devices ► The only university department in Hungary dealing with all aspects of (monolithic) microelectronics. These include  devices physics and technology,  analog and digital integrated circuit design  MEMS simulation and design  LEDs and solar cells  Complex hardware and system design  thermal issues in IC & packaging design  Space technology  Photovoltaic devices  Chip sized biomedical devices ► The department is one of the main organizators of THERMINIC and DTIP conferences

© BME Department of Electron Devices, eet.bme.hu February 6, Research activities – tematic summary ► Advanced measurement techniques ► Thermal transient testing and structure function analysis of device packages ► Meterial characterization and in-situ monitoring of aging of thermal interface materials ► Combined thermal and radiometric/photometric measurement of power LEDs ► Novel simulation algorithms and models ► Algorithmic formal languages for System-on-Chip design ► Thermal aware design of complex digital ICs with logithermal simulation ► Modeling of photovoltaic devices ► Modeling of biomedical microdevices with two phase flows ► Novel device design ► Development of novel biomedical microreactor devices ► Thermo-electric logical circuits (TELC) ► Novel organic compound solar cells

© BME Department of Electron Devices, eet.bme.hu February 6, Current Research – projects (summary) ► 14 accomplished projects from the last 5 years (10 EU projects, 5 national projects) ► 2 industrial standards (JEDEC), technology transfer: Mentor Graphics Ltd., MicReD division, C4S Llc ► Currently running 4 projects including ► H2020 ICT Project ► EuroCPS ( ) ► Delphi4LED ( ) ► 1 joint Educational Project ► Smart Systems Integration ( ) ► 2 national and industrial Projects

© BME Department of Electron Devices, eet.bme.hu February 6, Facilities – Integrated Smart Systems Laboratories ► Thermal and Reliability Testing Facility  Thermal imaging, micro cooling, thermal transient testing, combined thermal, optic/radiatic measurements ► Semiconductor Technology Laboratory  Class 1000 clean room, basic MEMS, solar cell, MOS technology capabilities, device characterisation laboratory ► Chip Based Biomedical Devices Laboratory  Single and multiphase microfluidics, MNP based LoC devices, device characterisation ► Integrated Smart System Design Laboratory  Up to date industrial standard MEMS, digital and analog CAD tools and characterisation capabilities

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Advanced measurement techniques ► Themal transient measurements and structure function analysis ► A non-destructive analyisis method of the device’s fine thermal structure ► Technology transfer: MicRED Ltd, later acquired by Mentor Graphics

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Reliability analysis and life-time estimation of power electronics modules ► Standard power cycling combined with thermal transient testing and die attach quality analysis ► SMARTPOWER EU FP7

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Novel simulation algorithms and models ► Thermal aware device design – power dissipation per unit area increases ► 3D stacked structures – new challanges of heat removal ► System on chips – run-time configurable, application specific macrocells

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Optimized RTL design by AMDL ► Koncepció, érthető magyarázat, ábra (ha nem ez akkor csere)

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Optimized RTL design by AMDL ► Eredmények, főleg ábrák, táblázatok stb

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Thermal aware design of complex digital ICs ► Koncepció: hogy vannak összerakva a különböző megoldók rendszer szinten, miért jó ez stb, magyarázó ábra

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Thermal aware design of complex digital ICs ► Eredmények, ha van, egy időfüggő eset videón? Ha nem akkor temperature map ábrák, akár az ami az előző dián van csak jobb minőségben

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Multi-domain characterization of power LEDs ► Koncepció, rövid leírás, célkitűzés stb, ez az ábra jobb minőségben ha lehet

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Multi-domain characterization of power LEDs ► Eredmények, ha lehet inkább ábrák, táblázatok stb

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Novel device design ► ‘More Moore’: development beyond the Moore’s law: pushing the red brick wall ► ‘More than Moore’ – utilizing of nanotechnologies in electronics and bioMEMS

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Thermal Electric Logic Circuit for nanoelectronics ► Koncepció, magyarázó ábrák, fém-félvezető átmenet stb.

© BME Department of Electron Devices, eet.bme.hu July 22, 2014 BME EET R&D Thermal Electric Logic Circuit for nanoelectronics ► Látványosabb eredmények, diagramok, táblázat stb.