NOC keyhaneh kia – 94/1. increasing the number of cores on chip 3D NOC. 3D NOCinter net., intra net.

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Presentation transcript:

NOC keyhaneh kia – 94/1

increasing the number of cores on chip 3D NOC. 3D NOCinter net., intra net.

Sub title  Topology  Floor planning

Topology  Mesh: simplicity, scalability.  Ring: simplicity, low delay.  BFT: high speed, load balancing.  Torus  Hierarchical models  new models

Communication link  Wired bus based solder balls through silicon via: tsv  wireless capacitive coupling inductive coupling optical links

Weird net. -Lack of scalability and flexibility. -TSV clustering - power consumption & area

Wireless net. -inductive coupling clustering -optical net. waveguide crossing O/E centralized controller

END