EFFECTS OF PRIMERS CONTAINING SULFUR AND PHOSPHATE MONOMERS ON BONDING TYPE IV GOLD ALLOY Yohsuke Taira, Kohji Kamada Department of Applied Prosthodontics,

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EFFECTS OF PRIMERS CONTAINING SULFUR AND PHOSPHATE MONOMERS ON BONDING TYPE IV GOLD ALLOY Yohsuke Taira, Kohji Kamada Department of Applied Prosthodontics, Graduate School of Biomedical Sciences, Nagasaki University, Sakamoto, Nagasaki , Japan Journal of Dentistry,Volume 36,Issue 8, August &_user= &_rdoc=1&_fmt=&_orig=search&_sort=d&view=c&_acct=C &_version=1&_urlVersion=0&_userid= &md5=1402fc035d b9ea53faa0c836a

Resin-bonded fixed partial denture Suitable biocompatibility Excellent corrosion resistance Easy procedure Au-Cu-Ag

five primers two sulfur one phosphate two sulfur–phosphate dual-function primers Au-Cu-Ag primer

Key factor to promoting adhesive bonding Au-Cu-Ag primerLuting agent Phosphate monomers Carboxylic monomer Silane-coupling agents Base metal alloy Sulfur monomers Gold alloy

Sulfur monomers Phosphate monomers

five primers two sulfur V-Primer Metaltite one phosphate Epricord two sulfur–phosphate dual-function primers Alloy Primer Metaltite/Epricord

Shear bond test X-ray photoelectron spectroscopy (XPS) analysis

Methods 10 mm. 2.5 mm. Au-Cu-Ag Shear bond test

Au-Cu-Ag alumina Au-Cu-Ag

primerLuting agent Acrylic rod 1.No primer 2.Metaltite 3.Epricord 4.V-Primer 5.Alloy Primer 6.Metaltite/Epricord X12 = 72 disk

Shear bond test Au-Cu-Ag Room temp 60 min 37’ water 24 h. thermocycled 0 Test tensile strength 6 sets of 6 specimens Au-Cu-Ag thermocycling Au-Cu-Ag thermocycled 5000 Test tensile strength 6 sets of 6 specimens

Results Au-Cu-Ag primerLuting agent Acrylic rod

Methods 10 mm. 2.5 mm. Au-Cu-Ag X-ray photoelectron spectroscopy (XPS) analysis

Au-Cu-Ag alumina Au-Cu-Ag

10 kV, 15 mA. Magnesium 6 mmØ X-ray source : 10kV 15 mA. Take off angle 45 Detection depth and energy resolution : 0.5-3nm and 0.9 eV

Result Ag2O eV, AgO eV, Cu2O eV, CuO eV Au 84 eV, Au 2 O eV

Discussion success of the dental treatment with resin- bonded prostheses is related to the durability of adhesive bonding the greatest bond strength after thermocycling was achieved with Alloy Primer or Metaltite/Epricord

Discussion to evaluate the effect of functional monomers dissolved in primers, MMA- TBB resin that contains no functional monomer was used as a luting agent The base metals are characterized oxide layer on the metal surface Little oxide layer is created on pure noble metals without artificial surface treatment

Discussion V-Primer VBATDT Epricord MDP Alloy Primer VBATDT+MDP combined use of VBATDT with MDP is advantageous to bonding durability compared to the use of only VBATDT or MDP VBATDT is chemisorbed via sulfur atom on Au, Ag, and Cu. MDP has an affinity to the oxide layer generated on a base metal alloy

Discussion Metaltite MTU-6 Met/Epr TMU-6/MDP Epricord MDP Metaltite/Epricord group, combined use of MTU-6 with MDP promotes high bond strength The chemical interaction between MTU-6 and the alumina- blasted Au–Cu–Ag alloy may be similar to that of VBATDT

Discussion thermocycling test resulted in decreased bond strength, and the relationship between primer type and bond strength Thermal stress,such as mechanical stress, hydrolysis of resin, water diffusion into the bonded interface, and corrosion of substrate materials, as well as can clinically affect bonding durability

Discussion Met/Epr TMU-6/MDP V-Primer VBATDT Epricord MDP Alloy Primer VBATDT+MDP Metaltite TMU-6 “ pay attention to the types of functional monomer when selecting an appropriate primer to bond Au–Cu–Ag alloy retainers ”

Conclusion the primers (Metaltite/Epricord and Alloy Primer) containing a sulfur monomer with a phosphate monomer significantly improved the bond strength after 5000 thermocycles between a self- curing resin and Au–Cu–Ag alloy. No significant difference was found between Metaltite/Epricord and Alloy Primer.

X-ray Photoelectron Spectroscopy/Electron Spectroscopy for Chemical Analysis (XPS/ESCA)X- ray Photoelectron Spectroscopy (XPS), also known as Electron Spectroscopy for Chemical Analysis (ESCA), is used to determine quantitative atomic composition and chemistry. It is a surface analysis technique with a sampling volume that extends from the surface to a depth of approximately Angstroms. Alternatively, XPS can be utilized for sputter depth profiling to characterize thin films by quantifying matrix-level elements as a function of depth. XPS is an elemental analysis technique that is unique in providing chemical state information of the detected elements, such as distinguishing between sulfate and sulfide forms of the element sulfur. The process works by irradiating a sample with monochromatic x-rays, resulting in the emission of photoelectrons whose energies are characteristic of the elements within the sampling volume. Evans Analytical Group® (EAG) uses this technique in a variety of applications to help customers, across a range of industries, with R&D, as well as process development/improvement. Examples include: Identifying stains and discolorations Characterizing cleaning processes Analyzing the composition of powders and debris Determining contaminant sources Examining polymer functionality before and after processing to identify and quantify surface changes Measuring lube thickness on hard disks Obtaining depth profiles of thin film stacks (both conducting and non-conducting) for matrix level constituents Assessing the differences in oxide thickness between samples These insights into a product’s chemical makeup allow you to make product and process improvements more quickly, enabling you to reduce cycle time and save money. With EAG, you also have access to the best facilities, instruments, and scientists available for performing an XPS analysis. We handle many different materials from multiple industries, giving us a wide variety of experience. Plus, our person-to-person service ensures that you will receive answers to all of your questions.