Development of N-in-P Silicon Strip and Pixel sensors for very high radiation environments Y. Unno For the Collaboration of KEK, Univ. Tsukuba and Hamamatsu.

Slides:



Advertisements
Similar presentations
Study of Behaviour of Silicon Sensor Structures, Before and After Irradiation Y. Unno, S. Mitusi, Y. Ikegami, S. Terada (KEK) O. Jinnouchi, R. Nagai (Tokyo.
Advertisements

Development of novel KEK/HPK n + -in-p silicon sensors and evaluation of performance after irradiation Y. Unno a, S. Mitsui a, R. Hori a, R. Nagai g, O.
Slim Edges from Cleaving and ALD Sidewall Passivation Vitaliy Fadeyev, Hartmut F.-W. Sadrozinski, John Wright Santa Cruz Institute for Particle Physics,
Pixel Sensors for ATLAS Sally Seidel University of New Mexico Pixel ‘98 8 May 1998.
1 Irradiation Study of n-on-P Strip Sensors K. Hara, K. Inoue, A. Mochizuki (Univ. of Tsukuba) Y. Unno, S. Terada, T. Kohriki, Y. Ikegami (KEK) K. Yamamura,
TCAD Simulations of Silicon Strip and Pixel Sensor Optimization
Characterization of 150  m thick epitaxial silicon pad detectors from different producers after 24 GeV/c proton irradiation Herbert Hoedlmoser (1), Michael.
Haga clic para modificar el estilo de texto del patrón Progress on p-type isolation technology M. Lozano, F. Campabadal, C. Fleta, S. Martí *, M. Miñano.
Study of Behaviour of n-in-p Silicon Sensor Structures Before and After Irradiation Y. Unno, S. Mitsui, Y. Ikegami, S. Terada, K. Nakamura (KEK), O. Jinnouchi,
Medipix sensors included in MP wafers 2 To achieve good spatial resolution through efficient charge collection: Produced by Micron Semiconductor on n-in-p.
Y. Unno for the ATLAS12 sensor community and Hamamatsu Photonics K.K.
Development of n-in-p planar pixel sensors with active edge for the ATLAS High-Luminosity Upgrade L. Bosisio* Università degli Studi di Trieste & INFN.
QA Workshop at CERN 3-4 November Hamamatsu silicon detectors for high energy physics experiments Kazuhisa Yamamura*, Shintaro Kamada.
SILICON DETECTORS PART I Characteristics on semiconductors.
M. Lozano, C. Fleta*, G. Pellegrini, M. Ullán, F. Campabadal, J. M. Rafí CNM-IMB (CSIC), Barcelona, Spain (*) Currently at University of Glasgow, UK S.
Planar P-type Pixel and Strip Sensors Development for HL-LHC in Japan Y. Unno (KEK) for ATLAS-Japan Silicon Collaboration and Hamamatsu Photonics K.K.
Planar Pixels Sensors Activities in France. Phase-2 and core R&D activities in France -Development of sensor simulations models -Sensor technology Edgeless/active.
Silicon detector processing and technology: Part II
US ATLAS Upgrade Strip Meeting, Hartmut F.-W. Sadrozinski, SCIPP 1 Upgrade Silicon Strip Detectors (SSD) Hartmut F.-W. Sadrozinski SCIPP, UC Santa Cruz.
Status of Hamamatsu Silicon Sensors K. Hara (Univ of Tsukuba) Delivery leakage current at 150V & 350V number of defect channels wafer thickness & full.
Development of KEK/HPK n+-in-p Pixel Sensor Modules and Understanding Their Performance with TCAD Simulations Y. Unno (KEK) for ATLAS-Japan Silicon Collaboration.
Development of n+-in-p planar pixel sensors for very high radiation environments, designed to retain high efficiency after irradiation Y. Unno (KEK) for.
CERN, November 2005 Claudio Piemonte RD50 workshop Claudio Piemonte a, Maurizio Boscardin a, Alberto Pozza a, Sabina Ronchin a, Nicola Zorzi a, Gian-Franco.
N. Zorzi Trento, Feb 28 – Mar 1, 2005 Workshop on p-type detectors Characterization of n-on-p devices fabricated at ITC-irst Nicola Zorzi ITC-irst - Trento.
H.-G. Moser Semiconductor Laboratory MPI for Physics, Munich 11th RD50 Workshop CERN Nov Thin planar pixel detectors for highest radiation levels.
A. Macchiolo, 13 th RD50 Workshop, CERN 11 th November Anna Macchiolo - MPP Munich N-in-n and n-in-p Pixel Sensor Production at CiS  Investigation.
1/14 Characterization of P-type Silicon Detectors Irradiated with Neutrons M.Miñano 1, J.P.Balbuena 2, C. García 1, S.González 1, C.Lacasta 1, V.Lacuesta.
9 th “Trento” Workshop on Advanced Silicon Radiation Detectors Genova, February 26-28, 2014 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica.
Y.Unno, 4th Workshop on Advanced Silicon Radiation Detectors, Trento, Italy, Feb., Development of Radiation- tolerant p-type Silicon Microstrip.
TCT measurements with SCP slim edge strip detectors Igor Mandić 1, Vladimir Cindro 1, Andrej Gorišek 1, Gregor Kramberger 1, Marko Milovanović 1, Marko.
Defect Engineering and Pad Detector Characterization Defect engineering: Search for hydrogen enrichment in silicon is still ongoing but takes time High.
Evaluation of novel n + -in-p pixel and strip sensors for very high radiation environment Y. Unno a, S. Mitsui a, R. Hori a, R. Nagai g, O. Jinnouchi g,
Maria Rita Coluccia Simon Kwan Fermi National Accelerator Laboratory
Jaakko Härkönen, 6th "Hiroshima" Symposium, Carmel, California, September Magnetic Czochralski silicon as detector material J. Härkönen, E. Tuovinen,
Punch through protection and p-stop ion concentration in HPK strip mini-sensors Jan Bohm, Institute of Physics ASCR, Prague Peter Kodys, Pavel Novotny,
The Sixth International "Hiroshima" Symposium Giulio Pellegrini Technology of p-type microstrip detectors with radiation hard p-spray, p-stop and moderate.
Nineth International “Hiroshima” Symposium on the Development and Application of Semiconductor Tracking Detectors International Conference Center Hiroshima,
TCAD Simulation – Semiconductor Technology Computer-Aided Design (TCAD) tool ENEXSS 5.5, developed by SELETE in Japan Device simulation part: HyDeLEOS.
Summary of Liverpool CC(V) Measurements A. Affolder, P. Allport, H. Brown, G. Casse, V. Chmill, D. Forshaw, T. Huse, I. Tsurin, M. Wormold University of.
Giulio Pellegrini 27th RD50 Workshop (CERN) 2-4 December 2015 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona 1 Status of.
Studies on n and p-type MCz and FZ structures of the SMART Collaboration irradiated at fluences from 1.0 E+14 to 5.6E+15 p cm -2 RD50 Trento Workshop ITC-IRST.
Claudio Piemonte Firenze, oct RESMDD 04 Simulation, design, and manufacturing tests of single-type column 3D silicon detectors Claudio Piemonte.
P. Fernández-Martínez – Optimized LGAD PeripheryRESMDD14, Firenze 8-10 October Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de.
Latest news on 3D detectors IRST CNM IceMos. CNM 2 wafers fabricated Double side processing with holes not all the way through, (aka Irst) n-type bulk.
Trench detectors for enhanced charge multiplication G. Casse, D. Forshaw, M. Lozano, G. Pellegrini G. Casse, 7th Trento Meeting - 29/02 Ljubljana1.
TCAD Simulation for SOI Pixel Detectors October 31, 2006 Hirokazu Hayashi, Hirotaka Komatsubara (Oki Elec. Ind. Co.), Masashi Hazumi (KEK) for the SOIPIX.
Giulio Pellegrini Actividades 3D G. Pellegrini, C. Fleta, D. Quirion, JP Balbuena, D. Bassignana.
R. Bradford 3 February,  BNL offered to share 4” wafer. We purchased ¼ of the wafer with the remainder being used for silicon drift detectors for.
Development of SOI pixel sensor 28 Sep., 2006 Hirokazu Ishino (Tokyo Institute of Technology) for SOIPIX group.
Latest Development of n + -in-p KEK/HPK planar pixel sensors for very high radiation environments Y. Unno (KEK) for ATLAS-Japan Silicon Collaboration and.
Development of novel n + -in-p Silicon Planar Pixel Sensors for HL-LHC Y. Unno a, J. Idarraga 1, S. Mitsui a, R. Hori a, R. Nagai g, O. Jinnouchi g, A.
Investigation of the effects of thickness, pitch and manufacturer on charge multiplication properties of highly irradiated n-in-p FZ silicon strips A.
Changes of the particle detection properties of irradiated silicon microstrip sensors after room and elevated temperature annealing G. Casse, A. Affolder,
2nd Institute Of Physics, Georg-August-Universität Göttingen
24/02/2010Richard Bates, 5th Trento workshop, Manchester1 Irradiation studies of CNM double sided 3D detectors a. Richard Bates, C. Parkes, G. Stewart.
Manchester, 24/02/2010 G.-F. Dalla Betta The common floor-plan of the ATLAS IBL 3D sensor prototypes Gian-Franco Dalla Betta (Univ. Trento and INFN) for.
Development of Silicon Microstrip Sensors in 150 mm p-type Wafers
Rint Simulations & Comparison with Measurements
Available detectors in Liverpool
Characterization and modelling of signal dynamics in 3D-DDTC detectors
I. Rashevskaya on behalf of the Slim5 Collaboration, Trieste Group
First production of Ultra-Fast Silicon Detectors at FBK
Development of n-in-p Silicon Planar Pixel Sensors and flip-chip modules for very high radiation environment Y. Unno For Y. Unnoa*, Y. Ikegamia, S. Teradaa,
Sep th Hiroshima Xi’an Test-beam evaluation of newly developed n+-in-p planar pixel sensors aiming for use in high radiation environment.
Workshop on 3D and p-type Sensors
Cint of un-irr./irradiated 200μm devices
Sensor Wafer: Final Layout
Thin Planar Sensors for Future High-Luminosity-LHC Upgrades
Production of 3D silicon pixel sensors at FBK for the ATLAS IBL
Status of Hamamatsu Silicon Sensors
Presentation transcript:

Development of N-in-P Silicon Strip and Pixel sensors for very high radiation environments Y. Unno For the Collaboration of KEK, Univ. Tsukuba and Hamamatsu Photonics K.K. 1Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., 2010

R&D of P-type Silicon Sensor We have been developing a silicon microstrip sensor using 6-inch (150 mm dia.) p-type material – in ATLAS experiment Has fabricated n-in-p 1 cm x 1 cm (miniature) and 9.75 cm x 9.75 cm (main) sensors with Hamamatsu Photonics K.K. (HPK) Results were reported recently in the 7th International “Hiroshima” Symposium…, Hiroshima, 28 Aug. – 1 Sep. 2009, and in this conference, “Surface effect…” by H. Sadrozinski, etc. Achievements, e.g. – Operation up to 1 kV – Radiation damage tested by protons and neutrons up to ~ MeV-neutron equivalent/cm 2 and new results from the R&D wafer by the collaboration in Japan… Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., 20102

New R&D Wafer PTP study – Strips mini – Slim edge study – Diodes – 1-20 Guard ring study – Diodes – HPK 6 inch (150 mm) wafers, p-type and n-type Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., Pixel (1-29) 10.5 mm x 10 mm Strips (30-89) 10 mm x 10 mm Diodes (1-32) 4mm x 4mm

Punch-Through Protection Structure TCAD simulation – P-stop case: 4x10 12 ions/cm 2 N-N gap: 20 µm – P-spray case: 2x10 12 ions/cm 2 N-N gap: 12 µm – Interface charge: positive 0.5x10 12 or 1x10 12 Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., PT voltages – P-stop without Al-extension (P6 20 um) – P-stop with Al-extension (P6 HX2) – P-stop with Al-extension and enhanced interface charge (P6 HX2 1e12) – P-spray (R 12 um)

New PTP Fabrication Bias ring Al extension BZ4B, BZ4C – 1: Up to p-stop – 2: No extension – 3: Over p-stop – 4: Full extension BZ4D – 1: No p-stop – 2: Up to p-stop – 3: No extension – 4: Over p-stop – 5: Full extension Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., 20105

PT Onset Voltages - Measurements Pre-irradiation, P-stop 4x10 12 Distinct groups – With/Without extension – Full extension is the sharpest turn-on Comparison – ATLAS07 S2R2 wafer (P-spray 2x10 12 ) – BZ1 (NN gap= 12µm), Others (NN gap=20 µm) – No difference in onset voltage – Difference in sharpness Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., BZ4D-5 BZ4B-2 BZ4C-2 BZ4D-3 BZ4D-1 BZ4D-2, BZ4C-4

I-V and Onset of Microdischarge New PTP fabrication – 1 cm x 1 cm miniature sensors No onset of microdischarge up to 1,000 V 4 wafers fabricated – Left figure is those on one wafer of the four Looking forward to irradiation with protons, neutrons, and gammas Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., 20107

Slim Edge Study A goal – ATLAS Insertable B- Layer (IBL) 2x1 Planar Pixel Sensor Envelope – Active pixel-dicing edge: 0.45 mm In one of the edge, the distance is varied in diodes Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., 20108

Slim edge - Measurements Results are of N-type wafer – Layout for P-type wafers is found to be defective – Layout for N-type wafer is correct Thickness (as is, thinned) – 320 (W5), 200 (W7,13) µm Edge implantation – N+ or P+ Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., N-sub/N-edge N-sub/P-edge N-sub P+ N+ N+ GR Edge N-sub P+ P+ P+ GR Edge

Slim Edge - Measurement Square root of V_bias is linearly dependent on the edge distance – Reflecting the depletion along the surface Distance can be ≤500 µm for the bias voltage up to 1 kV – (Almost) No safety margin for a thickness of 320 µm – More than a factor of 2 safety margin for a thickness of µm Note: – N-type, FDV ~70 V – P-type, when FDV ~200 V, 40% less distance may be required – After irradiation, N-type ~ P-type FDV, though. Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb.,

Guard Ring Study In order to investigate whether the number of guard rings will help to reduce the edge distance – Variation up to 3 guard rings Note the width of guard rings – Width of Edge-Edge of guard rings are – 1GR-L = 2GR-N – 1GR-M = 2GR-O = 3GR-P Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., STD-K1GR-L1GR-M 2GR-N 2GR-O 3GR-P

Guard Ring Study Tested with N-sub wafer I-V measurement – N-edge could hold 1 kV – P-edge for investigation Systematic onset of leakage current was observed – The best is 2GR-O, i.e., wide- spread 2 guard ring, but… – What is the meaning of the results? Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb.,

Guard Ring Study Horizontal axis: total width of fields without implantation Vertical axis: square root of bias voltage Linear dependence, reflecting the depletion along the surface No difference in the variations of the guard ring Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb.,

Thinned Pixel Sensors Wafer thickness – P-type: 320 µm – N-type: thinned to 200 µm 150 µm possible Excellent I-V performance – ≤1,000 V – Both in the p-type and n-type Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., One of FE-I3 pixel sensor P-type wafer example

New FE-I4 Pixel Sensors HPK 2x1 FE-I4 sensor complying with the "IBL 2-chip planar sensor tile, Rev ", 18.8 mm x 41.3 mm, with the edge space in the longitudinal pixel direction of mm 3 types of isolation (p-stop (common, individual), p-spray) x 1 type of bias (PT) x 2 sensors/type/wafer Normal thickness (320 um) and Thinned (150 um) wafers Others are single-chip FE-I4, single-chip FE-I3 (3 types of isolation x 2 types of bias (PT, PolySi)), 2x2 FE-I3 sensors (3 types of isolation x PT), etc. To be fabricated – Normal thickness: June 2010 – Thinned: July 2010 Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb., Single-chip FE-I3 etc. 2x1 FE-I4 2x2 FE-I3

Summary We have shown – PTP onset voltage, sharpness, limiting resistivity are improved by the new structure with the extended electrode covering the PT gap – The width of the edge can be ≤500 µm (in the N-type wafer, at the moment; P-type to be soon) – No fundamental difference in the number of guard rings in order to reduce the width of the edge better to have a less implant area and a wider non-implant field, thus to have a narrower total edge width for the same bias voltage – Thinned sensors, 200 µm thick, hold 1,000 V Looking forward to the performance after irradiation Y. Unno, 5th "Trento" Workshop, Manchester, UK, Feb.,