Your Technology Experts…2017 Streamline is UL approved for Lead Free Materials Your Technology Experts…2017

Your Full Service, Time Sensitive, Printed Circuit Board Solution Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. TeleCom Mil / Aerospace DataCom Medical Industrial

Streamline Circuit Corp’s Facility Manufacturing all levels of technology Time sensitive prototyping through production The facility was established in 1982 New management team installed September 2003 75,000 sq. ft. PCB manufacturing facility Complete manufacturing process under one roof 1 mile from the San Jose Airport Delivery convenience for out of state customers Located in Silicon Valley Short car ride away for pick up & deliveries Financially secure in current market conditions Low cost infrastructure Located in Silicon Valley

Management and their Experience Chuck Dimick –CEO / Founder Over 35 years of experience in PCB manufacturing.  Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson – President / Founder Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak – Sr. Vice President of Sales & Marketing / Founder Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Gary Greenberg – VP of Operations Over 31 years of industry experience. Previously VP of West Coast Operations for the EMS Division. Has held roles in Operations, Engineering, and Quality at DDI, Teradyne and Raytheon. Glenn Holland – Director of Quality Over 31 years of Industry experience. Previously held position of Director of Quality at TTM / Via Systems. Has experience in Operations, Assembly, Engineering and Quality. Mike Trammel – Director of Engineering Over 27 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience.

Management and their Experience Cont. JR Ramirez – Production Manager / Founder Over 35 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Louis Oliveira – Pre-Production Engineering Manager Over 28 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits. Phil Ramon – Pre-Production Engineering Supervisor Over 37 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex. 

Customer Service Support Customer Service (24 hours - 7 days a week) Sales, Engineering, Manufacturing and Quality Dedicated customer service readily available-our support group’s located onsite in the facility Quick response to all requests such as: Job status Delivery pull-in Quantity Increases Engineering design modification Inside Sales Customer Support

Proactive Engineering Services Manufacturing Capabilities Prototype though volume All time sensitive builds DFM (Design for Manufacturability) DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System Controlled Impedance Verification Stack up assistance Copper distribution Material verification Cam Valor Stations 4 Laser Direct Imaging units

Controlled Impedance Verification DFM Scan & Report Stack up assistance Copper distribution Material verification Sub Panel /Array Support Go to Pre-Production

Automated Optical Inspection Fusion 22 Quality Reassurance Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers, and SUBs X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification Automated Optical Inspection Fusion 22 In house Mil & deliverable Lab

On Time Delivery Assurance 100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification 10 flying Probe Testers Vacuum Lamination press

Continuous Improvement Programs Working daily on: Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program Management meetings 7 Laser drills

A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex 1 to 70 Layers Plus 28:1 High Aspect Ratio 3.23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. AS9100 Rev. C / ISO 9001 / ISO 13485 Mil-Spec 55110 / ITAR RoHS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24” x 30” Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non- Conductive Filled) 75+ Materials (Hybrid Constructions) Certifications

New Equipment 2016 Fusion 22 AOI (2) SC150XXL Vertical Spray Coater 3x the speed of previous models Resolution down to 25 microns Multi-Image Technology inspects panel multiple times in different lights angles allows errors to be detected across different colors Smart Setup provides automatic generation of all parameters Up to 70% false alarm reduction SC150XXL Vertical Spray Coater Even coating spray process enhances consistency and mfg. Throughput Ink free holes Siemens PLC S7/1200 with Simatic touch screen control panel Easy to program and store necessary production parameters In manual mode each single movement can be performed for maintenance 13

Schmid Material Prep Line Computer driven 1 mil cores OEM Press (3) 4 Total Excellon Cobra Combination Laser Drill 7 on site 5 Yag lasers 2 CO2 Nuvogo 800 LDI Measures down to 18 microns 5 on site

In-Plan Pre-Engineering (Fully integrated) Automated Traveler (Rule based) Material Prediction Software (Improves registration) Frontline DFM Tool (Insight, Genesis) CI Modeling and Verification ±5% 36 Station Automated Cuposit/Electroless ≥29:1 Aspect Ratio Dynamic Scheduling for Multiple Material Types Inspecta X-Ray (2 Machines) Layer to Layer Optimization 3.2 Hole to Copper Optimize Advanced Registration for Drilling

Flying Probe Tester (8 Machines) 16 Head Test Units Soft Touch Capable Fine Pitch .19mm Centers to .003 Pitch ATG’s A7a (2) 8 advanced speed test heads Self-loading automation Automatic adjustment of the vacuum matrix Universal shuttle with tensioning function 4 wire measurement Micro short detection Label printer

Engineering walk through PCB TECHNOLOGY ROADMAP Standard Manufacturing Advanced Manufacturing Emerging Technology Engineering walk through .003” +/-.001” .0038” +/-.001” .002” +/-.00075” .001” +/-.0005” .0005” +/-.00025” Line Width 1. Line and Space Line Space Tolerance Drill Size .008” +.010” 28:1 .004” +.008” 20:1 .003” +.006” 20:1 .003” +.002” 28:1 2. Drilled Via Size Pad Diam Aspect Ratio Up to 36 Up to .187” <16”X22” 36 to 48 Up to .300” <19”X22” 48 to 60 Up to .350” <22X28 >.350 Layer Count 3. Misc. Attributes Thickness Board Size FR4 Polyimide PTFE HC (Rogers) Interposer Substates UTR’s Next Generation HSD Advanced Interposers Nano Foils Alternative Resin Systems Change drill to current – mat page 4. Laminate Materials Rigid Flex Rigid Flex FR4 Stiffeners EMI Shield Conductive Bond Ply Thin Flex UL Approved High Speed Flex High Reliability Flex Data Security UL Multilayers Flex *UTR = Ultra Thin Rigid 17 http://streamlinecircuits.com/high-speed-materials/ 17

TECHNOLOGY ROAD MAP CONTINUED Emerging Technology Standard Manufacturing Advanced Manufacturing Engineering Walk through Via Size .004” +.005” .6:1 .003” +.004” 1:1 .002” +.004” 2:1 .001” +.003” 3:1 5. Micro Via Size Pad Dam Aspect Ratio HASL Entek Imm Silver ENIG ENEPIG LF HASL Eless Au Sel Solder Imm tin Solder Bump TBD 6. Surface Finishes +/-.003” .006” +/-.002” .003” +/-.001” .002” Tangency Registration 7. LDI Soldermask Min opening Min hole .012” 8:1 .010” 12:1 .008” 18:1 <.008 20:1 8. Conductive and Non-Conductive Via Fill Aspect Ratio 18 18

Nadcap ISO 9001:2000 IPC 6012,13,15,16,18 Class 3 ITAR AS9100 Rev C Mil-Spec 31032 in process

Total Quality Management Q-Pulse Total Quality Management Quality Assurance Systems Q-Pulse Quality System NCMR’s and Corrective Actions Audits Training Equipment Calibrations BACK

Streamline’s Capital Expenditures Use advanced equipment technologies to manufacture today's printed circuit board requirements The future in PCB manufacturing is about technology and automation Hire and Train equipment operators High percentage engineering personnel and staff Laser Direct Imaging Nuvogo 800 LDI Cuposit & Electroless Line DES Inner Layer Stripline

Resin fill/stacked Vias Design Strategies Epoxy fill with copper Vias Resin Fill off set Vias Resin fill/stacked Vias All Copper Fill process

V-Stacks: Patented MicroVia technology that will change everything A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology is a cost effective route for advanced technology.

IPC Manufacturing Class & Industries

Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex 8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

Registration and Micro Via’s PCB Equipment Needed for the Future Pre Production Engineering LDI Image Processing Develop Etch Strip Registration and Micro Via’s Laser Drilling Electroless Technology Solder Mask Silkscreen Test Product Integrity Quality Verification Streamline is UL approved for Lead Free Materials Off-Shore Solution Test Cases Flex / Rigid-Flex Back

Flex / Rigid-Flex

Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex 8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

Flex Capabilities Standard Advanced Layer Count 1L to 6L 8L to 10L Maximum Panel Size 10”x16” (250x406mm) 10”x35” (250x889mm) Min. Line/Space (H & ⅓ oz) 0.004" (0.10mm) 0.003" (0.076mm) Outline Tolerance +/-.004” (0.10mm) +/-.002” (0.05mm) by laser Stiffener Types PI, FR4+PSA PI, FR4, Steel, Alum Polyimide Thickness 0.5, 1 mil (12.5, 25um) 2, 3, 4 mils (50, 75, 100um) Base Copper Thickness 0.5, 1 oz (17.5, 35um) ¼ to 2 oz (9 to 70um) HDI Microvias Yes Adhesiveless Materials Flexible Soldermask White Coverlay RA Copper

Base Material Flex and Rigid Flex Other Material Flex and Flex-Rigid Name Manufacture Material Name Conductive Silver Ink DuPont CB028 Flex LPI Solder Mask Taiyo PSR-9000FXT, PSR-900 Rogers RFLEX 8080 Liquid Coverlay Kapton/Polyimide Stiffener DuPont Pyralux, FR, Pyralux FR4 Stiffener Isola FR406, FR408, 370 Grace GA-170LL Polyimide Stiffener Arlon 35N Aluminum Stiffener Pressure Sensitive Adhesive 3M 467MP, F9469PC, F9460PC Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black IPC- Manufacturer Material Name 4202/1 DuPont Pyralux FR 4203/1 DuPont Pyralux FR 4203/18 DuPont Pyralux FR, Pyralux 4204/1 DuPont Pyralux FR, Pyralux 4204/11 DuPont Pyralux AP 4101/21 Isola FR406, FR408, 370 4101/24 Isola FR406, FR408, 370 Arlon PrePreg 49N 4101B/124 Arlon PrePreg 51N 4101/26 Isola FR406, FR408, 370 Isola Prepreg FR406N Grace GA-170LL 4101/41 Arlon 35N Isola Prepreg P26 4101/42 Arlon PrePreg 38N 4101/99 Isola 370HR Note: Other materials available and have been manufactured, but non standard on per customer request.

2016 Off-Shore Solution

One Stop PCB Solution 3 million square feet manufacturing Space QTA 15-20 days ( based on technology) Local Team Support ( US and China) 24 hours 7 days a week technical support Focused Facilities based on Technology & Quantities

Complete Tooling Package “Build Exact”

Integration-Domestic/Offshore “Build Exact”

Time To Market “Build Exact” The following slides show several examples of timelines using SmartArt graphics. Include a timeline for the project, clearly marking milestones, important dates, and highlight where the project is now. “Build Exact”

Intellectual Property The implementation of strict protection for intellectual property of customers, other than the traditional encryption and decryption. We provide rigorous authorization and detailed access logs to our employees, in order to control the exchange information. Move Customers' Logo off and destroy the unusable boards completely. ……

Go to Slide 1 BACK Beijing KaiserstraBe, Germany EUROPE N. AMERICA ASIA Oregon Utah California Chongqing Shanghai Florida Texas Shenzhen, Guangdong Zhuhai AFRICA Hangzhou S. AMERICA OCEANIA Headquarter Plants Go to Slide 1 Offices BACK

PCB Capabilities Standard Advanced Maximum Layer Count 36L 40L Maximum Panel Size 21”x24” (533x610mm) 24”x42” (610x1067mm) Maximum Finished Thickness 0.126" (3.2mm) 0.256" (6.5mm) Minimum Finished Thickness 0.006" (0.15mm) 0.004" (0.10mm) Minimum Core Thickness 0.002” (50um) .0015” (38um) Trace/Space (H oz) 0.003” .0025” Maximum Aspect Ratio 14:1 25:1 Minimum Mechanical Drill 0.008" (0.20mm) Minimum Laser Drill 0.003" (0.076mm) Min. Soldermask Dam 0.003" (76um) 0.0025" (64um) Max. Base Copper Thickness 5 oz (75um) 6 oz (210um) Impedance Control +/- 8% +/- 5%

Technology Development Filled Buried Vias Continual development of new Technologies, Processes, and Materials Low Dk/Df, Low CTE, CAF resistant, and Halogen Free FR-4 High Aspect Ratio Plating (25:1 and 30:1) Advanced plating and photo lithography processes Advanced tooling systems for registration High Technology Radio Frequency (RF) PCB’s Metal Backed and Thermal Management PCB’s Solid Copper Plating for Through Vias Deep Blind Vias and Deep Stacked Microvias Embedded Capacitance & Resistance (2015) Embedded Heater Circuits (2015) Stacked Microvias

Manufacturing Capabilities STANDARD ADVANCED   Single-Side Flexible Panel Size 12"x18" 18"x24" 20"x26" 24"x36" Double-Side Flexible Panel Size 12"x18" 18"x24" and Up Mulilayer Flexible Panel Size Layer Count 3 to 12 13+ RIGID FLEX PANEL SIZE 2 to 28 28+ Multiple Lamination Copper Foil Weights Internal/External 1/4 to 2 ounce Up to 3 ounce Kapton Polyimide Stiffener .001" to .007" .008" and Up FR4 Stiffener .003" to .062" .063" and Up Polyimide Rigid Stiffener Lines, spaces & pad diameters Internal Line Width .0035" .001" Internal Spacing External Line Width External Spacing SMT Pitch .010" Controlled Impedance 10% 5% Via hole Finish STANDARD ADVANCED Laser Micro Vias .004" .002" Blind/buried Vias Laser Pads Minimum Drilled Hole Size .012" .0079" Drilled Hole to Copper .008" .007" Castellation Yes   Finish surface Tin Lead Plating Thickness .0003" to .0005" Less .0005" Tin Nickel Plating Thickness 150 Micro Inches 250 Micro Inches Low Stress Nickel 100 Micro Inches Gold Plating Thickness 30 Micro Inches As Specified Electroless Nickel/Immersion Gold Immersion Gold Immersion Silver Entek 106A HT HASL TOLERANCES Plated Hole Tolerances (+/-) .001" Non-Plated Hole Tolerances (+/-) Fabrication Tolerance (+/-) .005" .003" Vision Rout (+/-) Laser Rout (+/-)

Our products are used in Communication Infrastructure IT Terminal Industrial Equipment Other Products: Consumer/ Office Facilities/ Military/ Vehicle/ Our products are used in 于 Automobile electronic

Product Mix Complete PCB Solutions

Certifications F1 F2 F3 F4 F5 F6 Plant ISO9001 TS16949 ISO14001 QC080000 OHSAS18001 GJB9001 TL9000 AS9100 ISO27001 F1 Certified F2 F3 F4 F5 On-going F6

Materials Material Type Supplier Product Tg (°C) High-Tg FR-4 ShengYi S1000-2 175 ITEQ IT180A ISOLA 370HR Mid-Tg FR-4 S1000 150 Low-Tg FR-4 S1141 140 IT-140TC NanYa NY1140 Halogen-Free FR-4 S1155 130 S1165 170 High Speed
 Low Loss Materials FR408, FR408HR, IS420, IS620, GETEK Nelco N4000-13, -13EP/SI, N4000-29 Panasonic Megtron4, Megtron6 Rogers RO3003, RO3006, RO3010, RO4003C, RO4350B Arlon / Taconic PTFE (RF35, TLX, TLY) Aluminum Yugu YGA Series Flex Polyimide SY/Taiflex/Panasonic ½, 1 mil, 2 mil PI Rigid Polyimide Ventec VT901 250 Additional Materials are available.

Zeta Certified Revolutionary ZETA® Material Sunshine is a ZETA® Certified Fabricator Glass-free Polyimide Film, 13/25 um [0.5/1 mil] Low Dk (3.0-3.4) and low Df (.005-.010) Ideal for HDI and High Speed Applications High peel strength after multiple lam cycles Lead-free compatible and Halogen free High dielectric strength Eliminates Pad Cratering Copper B-Stage Epoxy C-Stage Polyimide Zeta® Cap Zeta® Bond SE Zeta® Lam Graphics provided by Integral Technology

Product Showcase High Speed Board 10 Layer HDI N4000-13EP 119x112mm [4.7”x4.4”] Thickness 1.6mm [.062”] Construction 1+8+1 Aspect Ratio 10:1 Via-in-Pad (VIPPO) Min L/S .10 mm [.004”] Drill/Pad .006”/.016” ENIG Finish Application: GPS Receiver, Satellite Positioning System

Product Showcase Telecom Linecard 16 Layer HDI 370HR 376x272mm [14.8”x10.7”] Thickness 2.21mm [.087”] Construction 1+14+1 Aspect Ratio 11:1 Via-in-Pad (VIPPO) Min L/S .10mm [.004”] Drill/Pad .008”/.018” Controlled impedance ENIG Finish Application: Data Server, Communications

Product Showcase High Layer Count Board 30 Layers S1000-2 (Hi-Tg FR4) 7.0” x 7.0” Thickness 3.81mm [.150”] 25:1 Aspect Ratio with 25 um [1.0 mils] plating required in vias Smallest drill .006” on .012” pads Via-in-Pad (VIPPO) with maximum dimple 12.5 um [0.5 mils] Full body nickel/gold Minimum line/space .10 mm [4 mils] BGA mounting device positional accuracy requirement Fabrication rout tolerance of +/- 0.20 mm [.008”]

Product Showcase ATE Board 34 Layers S1000-2 (Hi-Tg FR4) 368x368mm (14.5”x14.5”) Thickness 4.6mm (.180”) 18:1 Aspect Ratio Blind vias from L32-34 Via-in-Pad (VIPPO) Internal Cu: 1 & 2 oz Minimum L/S 4 mils Drill/Pad .010”/.016” Over 20 impedance controlled lines (SE/Diff) Countersink holes For semiconductor testing

Product Showcase Rigid-Flex 14 Layer HDI Rigid-Flex Construction: 14R – 2F – 14R Min L/S: .10 mm [4 mils] Thickness: 1.6 mm [.062”] Application: Medical 8 Layer Rigid-Flex Construction: 3R – 2F – 3R Min L/S: .13 mm [5 mils] Thickness: 1.0 mm [.040”] Application: Industrial

Product Showcase RF (Radio Frequency) Layer Count: 2L to 10L boards Mat’l Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX, TLY) Hybrid Option: RO4350B + FR4 Finishes: ENIG, Thick Wire Bondable Gold, Flash Gold Special Process: Selective plating and etching Applications: Radio Trans-receivers, Antennas, Power Amplifiers RF = Radio Frequency

Comprehensive Quality System Structure Regular Reliability Test In Process Quality Control TQM Activities (Continuous Improvement) Outgoing Incoming Panel Control (Traceability) Quality Assurance

Implemented Routine Reliability Tests(1) No Description Test Parameter Method Reference Frequency 1 Cross Section Microscope inspection IPC-TM-650 2.1.1 per Lot 2 Solderability Preconditioning with 2X IR Reflow; Solder Pot Temp.:232±6 oC, 2-3 sec (Solder Dip) IPC-TM-650 2.4.12 3 Thermal Stress, PTH Temp 288±5 oC, Cycle Time: 10+1/-0 sec, Solder Float X5 Cycles; IPC-TM-650 2.6.8 4 Peel Strength 1oz copper foil, 25mm sample width, vertical pulling @ 50 mm/min for min. 30 mm distance IPC-TM-650 2.4.8.4 weekly 5 Dielectric Withstanding Voltage Finished PCB, 500 +15/-0V, 150V/s, for 30+3/-0 sec IPC-TM-650 2.5.7 6 Liquid to Liquid Thermal Cycling -55 to 125oC, 15 min. dwell and ramp time, 200 cycles IPC-TM-650 2.5.32 monthly 7 Tensile Strength & Elongation Plated thickness of 0.05 mm to 0.1 mm; gage length 50 mm; cross head speed 1.2 mm/min; chart speed 500 mm/min IPC-TM-650 2.4.18.1

Implemented Routine Reliability Tests(2) No Description Test Parameter Method Reference Frequency 8 CAF Testing 65±2℃, 87+3/-2 %RH, 100V bias, 500 hrs IPC-TM-650 2.6.3 monthly 9 Surface Finish Thickness Metal thickness on the pad at four corners and center of the board IPC-TM-650 2.4.15 per Lot 10 Solvent Extracted Contamination (SEC) 75% v/v 2-propanol/water; run time: 30 minutes IPC-TM-650 2.3.25 per day 11 IR Reflow Simulation Lead: 230±5℃ @ 20-30 sec; Lead free: 260±5℃ @ 20-30 sec J-STD-020 12 Soldermask Adhesion 3M Brand 600 ½” wide; min. 50 mm in length; perpendicular pulling Per IPC-TM-650 2.4.1 13 Interconnect Stress Test (IST)) Ambient temperature to 150 oC, min. 300 cycles IPC-TM-650 2.6.26 14 Material Stability Tg/∆Tg, CTE, T260. Sample is heated at a rate of 5oC/min until all desired transitions have been completed IPC-TM-650 2.4.24

State of the Art Facilities

Facilities Summary •25 years of PCB fabrication experience in China •Strong financial backing •Market/Product focused factories •State of the art equipment and processes •QTA/NPI to volume production capabilities •No constraints on expansion •Dedicated research and development institute •Commitment to be the technology leader

Technology Process

Pre-Production Engineering Services “In Plan” planning software Customer Specific Rules Based Automation Valor front end CAM (Unlimited Seats) Industry Standard for front end engineering Stack up consultations, Service Offered No Charge $ Insight Frontline DFM’s, Service Offered No Charge $ Tech Seminars /Webinars Material Science, Latest in Laminates and Pre Preg’s R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready! Go to slide 8

Hybrid Construction for low cost (Meg 6 combined with low cost material for power layer)

High Speed Materials Website Page

DFM Report

Graphical DFM report BACK Go to slide 8

Imaging System

LDI (Laser Direct Imaging) Orbotech Paragon SM20

LDI Imaging Systems 100% Laser Direct Imaging (LDI) Repeatable process, computer controlled 24/7 consistent imaging regardless of shift No film means lower tooling costs No repeating defects Consistent trace width Tighter impedance control (+/- 5 %) ¼ Mil Accuracy .0008 Min Line/.0005 Space Layer to layer registration within .0004” No film growth due to heat expansion BACK

SCHMID Precision DES Line (Develop – Etch – Strip)

Inner Layer Develop Etch Strip January 2012 State of the art Schmid DES line Installed Computer controlled for consistent product Full automation removes human element 2 Micron variation over panel 1 mil core capability for substrate, HDI, and Rigid flex 4,000 Cores per day capacity based on current copper mix Tripled capacity upon installation Positions Streamline for future technologies BACK

Precision Laser Drilling 6 High Speed Laser Drills

Laser Drilling 6 Laser drills in house (7th has been purchased) Daily processing 4-N-4 of means experience Higher stacks available .0014” Hole, .004” Pad advances technology window Aspect Ratio: 3:1 Positional Accuracy for Hole Location +/- .0005”

Via formation, Aspect Ratios and Stacked Vias for Increased Densities BACK

Electroless Processing Completely Automated Line installed January 2012 Industry leading 28:1 Aspect Ratio: allows for higher density designs Bar coded processing removes operator errors Dwell times established in planning for speed & efficiency, translating to consistent product Ultrasonic, knife edge agitation, vibration & thumper 36 stations, Oversized tanks (24”x 30” Panels) High volume throughput capability BACK

IPS Automatic Electroless Plating Line

Test Capabilities: 100% Flying probe testing (8 Systems) Flexibility, no fixtures, less cost Allows for testing sub chapters before final book Everett Charles Eliminator for faster testing Every board 100% Net List Tested BACK

ATG Flying Probe Testing (8) 16 Head Test Units Soft Touch Capable Fine Pitch .19mm Centers to .003 Pitch ATG’s A7a (2) 8 advanced speed test heads Self-loading automation Automatic adjustment of the vacuum matrix Universal shuttle with tensioning function 4 wire measurement Micro short detection Label printer

Pluritec Inspecta X-ray Registration System

Internal Registration In unison with “Xact Software” for scaling Internal Registration is one of the key attributes in being successful X-Ray allows verification in real time X-Sections Verify X-Ray

Xact Scaling Report

Non Conductive Filled Via Wrap Per IPC 6012 Class III Electroless Wrap Smooth Copper Dendrites (Teeth)

Copper Fill Laser Vias & Through Hole Solid Copper Vias Thermal Via Farms for Thermal Management BACK

Chip Scale Packaging Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI

LSMDP Laser Solder Mask Defined Pad Using the LDI’s Precise Imaging to .0005” clearance Allows reduced solder mask clearance sizes May reduce layer count Maximize geometry Using laser solder mask defined pad (LSMDP) You can define a “Pad” on top of a pad

LSMDP (Laser Solder Mask Defined Pad)

Ink Jet Silkscreen Orbotech Sprint-8TM

“Now Engineers can actually read to debug!” Ink Jet Silkscreen “Now Engineers can actually read to debug!” Ultra Fine Crisp Lines, Down to 3 mil Serialization on the fly, BAR Code & QR codes Applied over partially cured mask providing for the mask and legend to be cure simultaneously to reduce cycle time Combination inkjet and laser technology Dry's the ink as it’s applied BACK

Quality Verification Verify Expected Results 2 X-Section labs on site 200 plus sections per day Wet processing lab onsite CMM For critical measurement reporting Two TDR’s for impedance verification Single ended & diff pairs (Separate testing for accuracy) Ionic contamination testing In process lamination X-ray verification XRF Gold thickness verification X-Ray

Total Quality Management Q-Pulse Total Quality Management Quality Assurance Systems Q-Pulse Quality System NCMR’s and Corrective Actions Audits Training Equipment Calibrations Quality Certifications IPC Certified Trainers 6012, 13,15,18 ISO 9001 AS9100C ITAR MIL-P-55110 Mil-P-31032 In Process BACK

Future Investments New Schmid outer layer etcher 2 Orbotech AOI systems with .0005” (1/2 mil) capability New Electroless Gold line (Enepig) 2 Additional LDI systems New Photo plotter for button and silkscreen film Additional OEM Press Facility Growth Expansion BACK

Sample Case #1 Equipment Set: Highlights: LDI, DES 1/1 Trace Space Laser, Inspecta, LDI LDI, Inspecta, LDI S/M LDI, Laser, Electroless LDI, DES, Inspecta Flying Probe Highlights: 1/1 Trace Space 4 N 4 Stacked Micro Vias .225 mm 1300 Pin BGA 1.6 Mil Via – 4 Mil Pad .020 Thick Sub Panel Test

Sample Case #2 Speed Test: 800ea 10 layers 2 Lamination cycles Buried vias, 2-9 Laser Micro Blind 2-3, 8-9 Laser Micro Blind 1-2, 9- 10 with via in pad 3/3 trace and space 6.5 PTH to Copper Delivered in 4 Days

Sample Case #3 Extremely Thin 4 Layer Buried vias 2 -3 2 Lamination cycles Laser Micro Blind 1-2, 3-4 Finished thickness .0054 Equipment set BACK