Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Principal sketch of an air-cooled chassi
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: (a) Sketch of the considered electronic unit and the cooling system and (b) thermal resistance or conductance network
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Offset strip fin insert
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Coordinate system shown on a chip plane
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: x-z plane
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Staggered grid arrangement
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Upper chip plane
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Lower chip plane
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Temperature distribution, upper plane
Date of download: 9/27/2017 Copyright © ASME. All rights reserved. From: Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink J. Electron. Packag. 2014;136(2):024501-024501-5. doi:10.1115/1.4026538 Figure Legend: Temperature distribution, lower plane