End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules Detlev Koch-Ospelt, Head Oerlikon Solar June 13, 2007.

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Presentation transcript:

End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules Detlev Koch-Ospelt, Head Oerlikon Solar June 13, 2007

Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey FAB 1200 - Tailored Configurations Conclusion Page 2 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Lower Cost, High Performance and Good Looking Page 3 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Thin Film and Cell Technologies Module Cross Section Cell n Cell n+1 Cell n+2 TCO TF-Si Glass Pattern 3 Pattern 2 Pattern 1 Back Contact Cell Structure Glass TCO TF-Si B C Lamination Thin Films Page 4 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Technology Roadmap – from Amorph to Micromorph a-Si/µc-Si Micromorph Tandem Cell 0.3 µm a-Si Amorph Page 5 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

The Visible Difference between Amorph and Micromorph Generation 1 Amorph Generation 2 Micromorph Page 6 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Oerlikon Solar Production Technology Clean TCO Laser PECVD Back Contact Assembly Page 7 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Electrical Contact Layers: TCO 1200 TCO back contact TCO: Transparent Conductive Oxides Clean Laser PECVD Assembly TCO TCO Page 8 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

KAI 1200 – Proven Technology for a-Si and mc-Si Plasma Box® for single reactor processing 40 MHz for increased deposition rates Parallel processing (20 reactors) and load lock for high throughput a-Si a-Si/µC-Si Clean TCO Laser Assembly PECVD Page 9 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Laser Scribing: LSS 1200 for Module Patterning Only system qualified for mass production all 3 laser scribing patterns Back Contact (TCO) a-Si:H Glass TCO Pattern 1 Pattern 2 Pattern 3 Clean TCO PECVD Assembly Laser Laser Laser Pattern 1 Pattern 2 Pattern 3 Page 10 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey FAB 1200 - Tailored Configurations Continuous Improvement Program Conclusion Page 11 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Integrated Path to Turnkey KAI 1200 TCO 1200 LSS 1200 Page 12 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Integrated Path to Turnkey Glass Preparation and Cleaning Line Automation Manufacturing Execution System KAI 1200 TCO 1200 LSS 1200 Contacted Tested Device Encapsulation Lamination Assembly Page 13 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Integrated Path to Turnkey Glass Preparation and Cleaning Line Automation Manufacturing Execution System FAB 1200 Contacted Tested Device Encapsulation Lamination Assembly Page 14 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey FAB 1200 - Tailored Configurations Conclusion Page 15 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Tailored Configuration: Fab 1200 Standard Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Turnkey Plus Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Fab 1200 Standard Plus Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Tailored Configuration: Fab 1200 Turnkey Tailored Configuration: Fab 1200 Standard Clean TCO FC Laser PECVD BC Voc Contact White Reflector Flasher Cross Lamination Front-End Back-End Contacted Tested Device Encapsulation-Lamination Line Automation Page 16 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Smallest Line: 20/30 MWp Configuration Page 17 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Agenda Oerlikon Solar Thin Film Technology Integrated Path to Turnkey FAB 1200 - Tailored Configurations Conclusion Page 18 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Customers like ersol Thin Film Page 19 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

and a Strong and Highly Motivated Team Page 20 June 13, 2007 End-to_End Solutions - D. Koch-Ospelt

Thank You for Your Attention