“Test vehicle” in 130nm TSMC for CMS HGCAL

Slides:



Advertisements
Similar presentations
R&D for ECAL VFE technology prototype -Gerard Bohner -Jacques Lecoq -Samuel Manen LPC Clermond-Ferrand, Fr -Christophe de La Taille -Julien Fleury -Gisèle.
Advertisements

SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
August SGSS front end, Summary August 2008 Edwin Spencer, SCIPP1 SGST Preview SCIPP, UC Santa Cruz Andrey Martchovsky Gregory Horn Edwin Spencer.
5ns Peaking Time Transimpedance Front End Amplifier for the Silicon Pixel Detector in the NA62 Gigatracker E. Martin a,b J. Kaplon b, A. Ceccucci b, P.
NA62 front end Layout in DM option Jan Kaplon/Pierre Jarron.
NA62 front end architecture and performance Jan Kaplon/Pierre Jarron.
1 SciFi electronics meeting – CERN– June 20 th 2011 Some ideas about a FE for a SciFi tracker based on SiPM A. Comerma, D. Gascón Universitat de Barcelona.
Calorimeter upgrade meeting – CERN – October 5 th 2010 Analog FE ASIC: first prototype Upgrade of the front end electronics of the LHCb calorimeter E.
Preliminary Design of Calorimeter Electronics Shudi Gu June 2002.
L.Royer– Calice DESY – July 2010 Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand R&D LPC Clermont-Fd dedicated to the.
L.Royer– TWEPP – 22 Sept Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand Signal processing for High Granularity Calorimeter: Amplification,
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
Building blocks 0.18 µm XFAB SOI Calice Meeting - Argonne 2014 CALIIMAX-HEP 18/03/2014 Jean-Baptiste Cizel - Calice meeting Argonne 1.
Progress on STS CSA chip development E. Atkin Department of Electronics, MEPhI A.Voronin SINP, MSU.
L.ROYER – TWEPP Oxford – Sept The chip Signal processing for High Granularity Calorimeter (Si-W ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy.
Hold signal Variable Gain Preamp. Variable Slow Shaper S&H Bipolar Fast Shaper 64Trigger outputs Gain correction (6 bits/channel) discriminator threshold.
1 G.Pessina, RICH Elec Upg, 11 April 2010 Analog Channels per chip4 to 8 Digital channel per chip4 to 8 Wire-bond pitch (input channels) Input capacitance.
65 nm CMOS analog front-end for pixel detectors at the HL-LHC
1 Luciano Musa, Gerd Trampitsch A General Purpose Charge Readout Chip for TPC Applications Munich, 19 October 2006 Luciano Musa Gerd Trampitsch.
SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.
BeamCal Electronics Status FCAL Collaboration Meeting LAL-Orsay, October 5 th, 2007 Gunther Haller, Dietrich Freytag, Martin Breidenbach and Angel Abusleme.
Readout Architecture for MuCh Introduction of MuCh Layout of Much ( proposed several schemes) Read ASIC’s Key features Basic Readout chain ROC Block Diagram.
S. Bota – Calorimeter Electronics overview - July 2002 Status of SPD electronics Very Front End Review of ASIC runs What’s new: RUN 4 and 5 Next Actions.
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
Front-End electronics for Future Linear Collider W-Si calorimeter physics prototype B. Bouquet, J. Fleury, C. de La Taille, G. Martin-Chassard LAL Orsay.
CERN PH MIC group P. Jarron 07 November 06 GIGATRACKER Meeting Gigatracker Front end based on ultra fast NINO circuit P. Jarron, G. Anelli, F. Anghinolfi,
1 Front-end electronic for Si-W calorimeter Sylvie Bondil Julien Fleury Christophe de La Taille Gisèle Martin Ludovic Raux.
PArISROC Photomultiplier Array Integrated in Sige Read Out Chip Selma Conforti Frédéric Dulucq Christophe de La Taille Gisèle Martin-Chassard Wei
H.Mathez– VLSI-FPGA-PCB Lyon– June , 2012 CSA avec reset pour s-CMS, bruit en temporel (Up-Grade TRACKER) (Asic R&D Version 1)
TIMEPIX2 FE STUDIES X. Llopart. Summary of work done During summer I have been looking at a possible front end for Timepix2 The baseline schematic is.
Front-end Electronic for the CALICE ECAL Physic Prototype Christophe de La Taille Julien Fleury Gisèle Martin-Chassard Front-end Electronic for the CALICE.
Overview of TPC Front-end electronics I.Konorov Outline:  TPC prototype development  Readout scheme of the final TPC detector and further developments.
Analog Front End For outer Layers of SVT (L.4 & L.5) Team:Luca BombelliPost Doc. Bayan NasriPh.D. Student Paolo TrigilioMaster student Carlo FioriniProfessor.
SKIROC2–CMS for the CMS HGCAL
CEA DSM Irfu IDeF-X HD Imaging Detector Front-end for X-ray with High Dynamic range Alicja Michalowska, CEA-IRFU 1 Journées VLSI June 2010.
Organization for Micro-Electronics desiGn and Applications HGCAL Front-End Electronics Christophe de LA TAILLE, Marcello MANNELLI sept 2015.
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I Pavia, Italy.
Status of front-end electronics for the OPERA Target Tracker
STATUS OF SPIROC measurement
M. Manghisoni, L. Ratti Università degli Studi di Pavia INFN Pavia
Valerio Re Università di Bergamo and INFN, Pavia, Italy
KLOE II Inner Tracker FEE
Pixel front-end development
Journées VLSI-FPGA-PCB Juin 2010 Xiaochao Fang
A General Purpose Charge Readout Chip for TPC Applications
Charge sensitive amplifier
ECAL front-end electronic status
Calorimeter Mu2e Development electronics Front-end Review
ASIC PMm2 Pierre BARRILLON, Sylvie BLIN, Selma CONFORTI,
Results achieved so far to improve the RPC rate capability
INFN Pavia and University of Bergamo
R&D activity dedicated to the VFE of the Si-W Ecal
L. Ratti, M. Manghisoni Università degli Studi di Pavia INFN Pavia
A Readout Electronics System for GEM Detectors
TDC at OMEGA I will talk about SPACIROC asic
CALICE COLLABORATION LPC Clermont LAL Orsay Samuel MANEN Julien FLEURY
A Low Power Readout ASIC for Time Projection Chambers in 65nm CMOS
A Fast Binary Front - End using a Novel Current-Mode Technique
LHCb calorimeter main features
Status of n-XYTER read-out chain at GSI
02 / 02 / HGCAL - Calice Workshop
STATUS OF SKIROC and ECAL FE PCB
SPIROC Status : Last developments for SPIROC
ECAL Electronics Status
BESIII EMC electronics
Status of the CARIOCA project
HARDROC STATUS 17 mar 2008.
OmegaPix 3D IC prototype for the ATLAS upgrade SLHC pixel project 3D Meeting 19th March, 2010 A. Lounis, C. de La Taille, N. Seguin-Moreau, G.
Signal processing for High Granularity Calorimeter
Presented by T. Suomijärvi
Presentation transcript:

“Test vehicle” in 130nm TSMC for CMS HGCAL Ludovic Raux June 1st, 2016

CMS Phase-II upgrades New Tracker New Endcap Calorimeters Barrel EM calorimeter New FE/BE electronics with improved time resolution Lower operating temperature (8∘) Trigger/HLT/DAQ Track information in Trigger (hardware) Trigger latency 12.5 µs - output rate 750 kHz HLT output 7.5 kHz Muon systems New DT & CSC FE/BE electronics Complete RPC coverage 1.6 < η < 2.4 Muon tagging 2.4 < η < 3 New Tracker Rad. tolerant - increased granularity - lighter 40 MHz selective readout in Outer Tracker for Trigger Extended coverage to η ≃ 3.8 New Endcap Calorimeters Rad. tolerant High Granularity: increased transverse and longitudinal segmentation precise timing capability Two major motivations for the upgrade Unprecedented radiation dose => replace End Cap Calorimeters Much higher data flows => replace most of the readout systems (5-10 Gb/s) CMS HGCAL - June 3, 2016

Modules, Cassettes and Mechanics (technical proposal) With 2x 6 - 8” Hexagonal Si sensors, PCB, FE chip, on W/Cu baseplate Modules mounted on Cu Cooling plate with embedded pipe => Cassettes Cassette inserted in mechanical structure (containing absorber) Replaced EndCap (maintained at -30°C 12 Cassettes mounted together to form the ECAL (EE) and Front HCal (FH) 3 sensor active thicknesses 100-200-300 µm 0.5(1) cm2 pads for 100(200/300) µm CMS HGCAL - June 3, 2016

Stringent requirements for Front-End Electronics Specifications Stringent requirements for Front-End Electronics Low power (~5 mW for analogue channel) Low noise: <2000 e- (0,32 fC) MIP: 10k – 20k e- (1,5 – 3 fC) Dynamic range up to 2000 MIP (10 pC), 17 bits required with 0,1 fC resolution High radiation (200 Mrad, 1016 N) Detector capacitance 40-60pF Detector leakage: up to 10 µA System on chip (digitization, processing…) High speed readout ~ 92,000 FE chips (~6M channels) CMS HGCAL - June 3, 2016

Baseline architecture (Technical Proposal) PA+ToT (CERN J.Kaplon) Preamplifier and shaper DC coupled to detector, no reset, fast shaping (15ns peaking time) Analog gain around 25mV/fC (quantization noise negligible) Preamplifier linear range 100 fC => ADC conversion Above 80fC and after preamp saturation => ToT conversion RtR output linearity (up to 100fC) RtR output ToT (up to 10pC) Preamp output RtR output CMS HGCAL - June 3, 2016

ToT problematic High crosstalk when preamplifier is saturating Long dead time due to ToT. It depends of preamplifier feedback resistance There is never a good overlap between low gain and ToT, precise characterization is needed. It is due to the non-linear behavior when preamplifier pass through from the non-saturation mode to the saturation mode The system has to manage with ADC data (mV) and ToT data (ns) and with a non-linear ToT behavior at the first. The ToT data have to be linearized. Preamplifier input Preamplifier output Shaper output Transient signals for 100, 1000 and 10000 fC injected charge CMS HGCAL - June 3, 2016

Milestones for electronics 15-Feb-16 Submit v0 FE chip (SKIROC2-CMS) in 0,35 µm Mid-May-16 Submit FE test vehicles in TSMC130 nm technology 1-Jun-16 1st Comprehensive Review 30-Sep-16 1st results from FE test vehicles and second test vehicle submission 31-Oct-16 Confirm choice of front-end electronics (130 nm) 15-Dec-16 Define architecture & specs for LV/HV supply Define location of DC-DC converters Define location of electrical/optical links 31-Mar-17 Submit V1 ASIC Choice of Si sensors type: all n-on-p or mixed (i.e. n-on-p and p-on-n) 1-Jun-17 2nd Comprehensive Review 30-Sep-17 1st results from tests of V1 ASIC 1-Nov-17 Submit TDR 30-Jun-18 Submit V2 ASIC  First 32/64 ch ASIC with full functionnality CMS HGCAL - June 3, 2016

Test vehicle floorplan: 130nm TSMC 1,36mm Area: 2,2x1,36 mm² 101 PADs, 100μm pitch Power supply: 1,2 – 1,5 V Submission date: mid-may 2016 Floorplan (1) positive input preamps x6 (2) negative input preamps x6 (3) baseline channel (CERN) x1 (4) discriminators x4 (5) CRRC shapers: HG and LG (6) digital part Available outputs Direct preamp output Preamp after shaper Preamp after discriminator Dedicated PAD available to characterize the shapers or the discriminators All bias can be externally tuned (1) (4) (6) 2,2mm (3) (2) (5) CMS HGCAL - June 3, 2016

(1) Input NMOS transistor preamplifier for positive signal 6 different preamps for positive signals Based on a cascode architecture with NMOS transistor Used different NMOS sizes (1200μ, 2400μ, 3600μ) and transistor flavors proposed by the technology (“normal”, “HiVt”, “LoVt”) Variable Cf from 100fF to 1,5pF step 100fF Variable Rf: 20k, 200k and 1MΩ Optimize to get open loop gain above 60dB and minimize noise Power consumption: ~2mW Qinj=100fC; Cd=50pF; Cf=1pF; Rf=20k CMS HGCAL - June 3, 2016

Input NMOS transistor preamplifier for positive signal Qinj=100fC; Cd=50pF; Cf=0,5pF; Rf=20k Voltage swing : 800mV Good linearity = +/-0,2% until 600f OMEGA - test vehicles

Input NMOS transistor preamplifier for positive signal en2*Cd2/Cf2 en=0,4nV/sqrt(Hz) RMS noise=210uV After a 25ns shaper, ENC~1.3ke- OMEGA - test vehicles

(2) Input NMOS transistor preamplifier for negative signal 6 different preamps for negative signals Used different NMOS sizes and architectures Variable Cf from 100fF to 1,5pF step 100fF Variable Rf: 20k, 200k and 1MΩ Input stage: cascode with NMOS input transistor Output buffer: source follower with NMOS native transistor biased with 100μA 62 dB open loop gain; 2,4 GHz GBP; Input impedance: 16Ω (50Ω @ 50MHz) Power consumption: 2,4 mW (@ 1,5V) Three sizes of input NMOS transistors Input stage: regulated cascode with NMOS input transistor Output buffer: source follower with NMOS native transistor biased with 100μA 94 dB open loop gain; 3,5 GHz GBP; Input impedance: 0,5Ω (43Ω @ 50MHz) Power consumption: 2,85 mW (@ 1,5V) Well suited for high loop gain preamp (0,2pF Cf) Three sizes of input NMOS transistors CMS HGCAL - June 3, 2016

(2) signal shaper vs. Cdet 60dB architecture 90dB architecture 13Ω Zin Input impedance, Rf=20k, Cf=0,5pF ENC (electrons) 60dB negative preamp 90dB negative preamp 0pF Cdet, current sensitive 644 476 30pF Cdet, current sensitive 1058 910 60pF Cdet, current sensitive 1400 1320 0pF Cdet, charge sensitive 658 480 30pF Cdet, charge sensitive 959 844 60pF Cdet, charge sensitive 1200 1140 CMS HGCAL - June 3, 2016

(5) CRRC shapers Rail-to-Rail class AB operational amplifier 2 shapers Cascode-miller compensation tunable on 5 bits 2 shapers Gain 1 and gain 10 Variable shaping time: global 4 bits, from 5ns to 75ns Based on Rail-to-Rail amplifier CMS HGCAL - June 3, 2016

(5) Preamplifier and shapers linearities Preamplifier output Negative: +/- 0,5% linear up to 900fC Positive: +/-0,5% linear up to 800fC Shaper output High gain: +/- 1% linear from 0 to 400fC Low gain: +/-1% linear up to 900fC Lack of linearity for both low gain and ToT between 800fC to 1pC CMS HGCAL - June 3, 2016

(4) Discriminators 4 fast discriminators designed (2 designs for each polarity) for ToA, ToT and ADC Power consumption: ~750uW Offset: 3,5mV rms Time Walk 6ns @ 20fC (~7 – 14 MIP) 1,5ns @ 100fC (~30 – 60 MIP) ToT Linear from 1pC to 10pC Jitter Without detector capacitance: 60ps rms @ 10fC (~3 - 6 MIP) With 50pF detector capacitance: 400 ps rms @ 10fC (~3 - 6 MIP), 50 ps rms @ 100 fC (~30 - 60 MIP) Jitter performances should be improved with a fast and high gain shaper after preamplifier CMS HGCAL - June 3, 2016

Packaging Packaging issues Wire bond angles between chip pads and package plots cannot be higher than 20° Wire bond length issue Finally enlarged pad ring => 2x4mm single in-line 2 mm 1,36 mm 4 mm 2,2 mm CMS HGCAL - June 3, 2016

What do we plan to submit in TV2 ? Full analogue channel Preamplifiers, shapers, comparators, input DAC (leakage compensation) 10-bit ADC, 12-bit TDC Digital sum for trigger path Linearization ToT @ 40 MHz Digital sum: 2x2 cluster L1 buffer for 1 MHz readout Common services 10-bit DAC, bandgap, LVDS, PLL and DLL September 2016 CMS HGCAL - June 3, 2016

“test vehicles” submitted in TSMC 130nm (May 2016) Preamplifiers Conclusion “test vehicles” submitted in TSMC 130nm (May 2016) Preamplifiers Two polarities 0.1, 0.5, 1, 3 pF Cf 10k, 20k, 100k, 1M Rf RtR Shapers Fast discriminator for ToA Simulations are encouraging OMEGA - test vehicles

Digital block: 1MHz readout architecture / trigger sums Paul slides @ TPG-BE electronics (26 April 2016) Study 2x2 linearization to be ready for 2nd TV: ADC data TOT without non-linear region Focusing on “method 3” Solution applicable for baseline or bi-gain PA Analog front-end ADC Local digital processing Global digital readout CMS HGCAL - June 3, 2016