Introduction SISSI: Simulator for Integrated Structures by Simultaneous Iteration Experimental software package on top of a particular design kit within Cadence Opus Tools of our own development: THERMODEL, TRANS-TRAN, THERMAN Glued by scripts in the SKILL language of Cadence Opus Schematic entry, layout extraction, results visualization - system services of Opus Benchmark problems simulated with success Results reported at THERMINIC and in different papers The package became obsolete since the design kit was abandoned

The complete thermal model Each element of the matrix of thermal couplings can be described as presented If the electronic circuit contains N thermally coupled (dissipative and/or temperature sensitive) components, N2 ladders are needed. For N=2:

Electro-thermal device models A basic set of electro-thermal device model has been implemented Need for advanced models - we are working on implementation of an electro-thermal EKV MOS model

The general flowchart

Design flows Schematic entry + draft layout: Simultaneous editing of schematics and layout (for components relevant from thermal point of view)

Design flows Schematic entry + draft layout:

Design flows Layout-based electro-thermal simulation:

Design flows Layout-based electro-thermal simulation: layout extractor

Layout extractor Techno file editing:

Layout extractor Defining the include mask: SIAL layer: for extracting Si-Al contacts to consider the Seebeck-effect if needed

Layout extractor Result: layout of dissipating & temperature sensitive elements (THERMAN & CIF formats)

Presentation of the results Nodal voltages, device temperatures, Device dissipations, Function plots: transient, transfer Bode Temperature maps 2D or axonometric profile cross-sections

Presentation of the results

Experiences: CMOS OpAmp DC simulation; good agreement between simulation and measurement

Experiences: micro-thermostat Tight thermal coupling, effect of the encapsulation. Good agreement between simulation and measurement

Experiences: thermal delay line Transient electro-thermal simulation; good agreement between simulation and measurement