Orsay Micro-Electronics Groups Associated P. Barrillon, S. Blin, S Orsay Micro-Electronics Groups Associated P. Barrillon, S. Blin, S. Callier, S. Conforti, F. Dulucq, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, N. Seguin-Moreau, V. Tocut + Xiongbo Yan from IHEP Beijing

Orsay Micro-Electronics Groups Associated A strong team of 10 ASIC designers… = 20% of in2p3 designers = 60% of department research engineers A team with critical mass : pole created in 2007 = OMEGA Expertise in low noise, low power high level of integration ASICs 2 designers/ project 2 projects/designer Regular design meetings …Within an electronics departmt of 50 Support for tests, mesaurements, PCBs… A steady production A strong on-going R&D Building blocks SiGe 0.35µm ASPIC MAROC 2 HARDROC SKIROC SPIROC Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

Orsay micro-electronics team 8 research engineers (1 IR0, 2 IR1, 5 IR2) 1 CDD IR2 EUDET 1 phD student 1 visitor from China IHEP Beijing Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL Recent chips Several chips developped for ATLAS LAr, OPERA, LHCb, CALICE in BiCMOS 0.8µm and installed on experiments Turn to Silicon Germanium 0.35 µm SiGe BiCMOS technology in 2005 Readout for MaPMT and ILC calorimeters Very high level of integration : System on Chip (SoC) Parallel activity of building blocks ASPIC MAROC 2 HARDROC SKIROC SPIROC Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

MAROC : 64 ch MAPMT chip for ATLAS lumi Complete front-end chip for 64 channels multi-anode photomultipliers Auto-trigger on 1/3 p.e. at 10 MHz, 12 bit charge output SiGe 0.35 µm, 12 mm2, Pd = 350mW Hold signal 64 inputs Variable Slow Shaper 20-100 ns S&H Multiplexed Analog charge output S&H 64 Wilkinson 12 bit ADC Photons Multiplexed Digital charge output Variable Gain Preamp. Bipolar Fast Shaper PM 64 channels PMF Unipolar Fast Shaper 80 MHz encoder Gain correction 64*6bits 64 trigger outputs (to FPGA) 3 discris thresholds (3*12 bits) 3 DACs 12 bits LUCID Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL Active board pictures MAROC2 chip bounded at CERN 64 ch PMT MAROC side Lattice side Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

MAROC Efficiency curves Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

ILC Challenges for electronics Requirements for electronics Large dynamic range (15 bits) Auto-trigger on ½ MIP On chip zero suppress Front-end embedded in detector Ultra-low power : («25µW/ch) 108 channels Compactness « Tracker electronics with calorimetric performance » No chip = no detector !! Ultra-low POWER is the KEY issue ASIC Si wafers W layer ILC : 25µW/ch FLC_PHY3 18ch 10*10mm 5mW/ch ATLAS LAr FEB 128ch 400*500mm 1 W/ch Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

CALICE Testbeam at DESY, CERN & FNAL TCMT AHCAL (9 000 ch) W-Si ECAL (9 000 ch) DHCAL slice test HCAL SiPM ASIC Imaging calorimetry Common DAQ 16 000 ch Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

The front-end ASICs : the ROC chips SPIROC Analog HCAL (SiPM) 36 ch. 32mm² June 07 Technological prototypes : full scale modules (~2m) EUDET EU funding (06-09) ECAL, AHCAL, DHCAL SiGe AMS 0.35µm HARDROC Digital HCAL (RPC, µmegas or GEMs) 64 ch. 16mm² Sept 06 SKIROC ECAL (Si PIN diode) 36 ch. 20mm² Nov 06 Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

Second generation chip for SiPM SPIROC : Silicon Photomul. Integrated Readout Chip 36 channels Charge measurement(14bits) Time measurement (<1ns) Autotrigger on MIP or spe Sparsified readout compatible with EUDET 2nd generation DAQ Chips daisy-chained Pulsed power -> 25 µW/ch Fabricated in SiGe AMS 0.35 µm in june 07 Collaboration with DESY Hamburg and Univ Heidelberg Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

Acquisition Channel 0 Conversion ADC + readout Ecriture RAM Channel 1 ValidHoldAnalogb 16 RazRangN Chipsat 16 ReadMesureb 16 Acquisition NoTrig gain Trigger discri Output Wilkinson ADC Discri output ExtSigmaTM (OR36) StartAcqt SlowClock Hit channel register 16 x 36 x 1 bits TM (Discri trigger) 36 BCID 16 x 8 bits Channel 0 gain Trigger discri Output Wilkinson ADC Discri output Conversion ADC + Ecriture RAM StartConvDAQb 36 ValGain (low gain or high Gain) TransmitOn readout RamFull OutSerie 36 EndReadOut EndRamp (Discri ADC Wilkinson) StartReadOut FlagTDC Rstb Channel 1 Clk40MHz ..… ADC ramp Startrampb (wilkinson ramp) RAM OR36 … StartRampTDC TDC ramp ChipID Chip ID register 8 bits 8 ValDimGray DAQ ASIC ValDimGray 12 bits 12 Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL SPIROC performance Good analog performance Single photo-electron/noise = 8 Auto-trigger with good uniformity Complex chip : many more measurements needed Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL 3D technology Increasing integration density, mixing technologies Wafer thinning to <50 µm Minimization of interconnects Large industrial demand Processors, image sensors… ©A. Klumpp (IZM) No side connections Without intervention in IC fabrication Wafer to wafer, Chip to Wafer Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL Next steps Omega will participate to march08 run Aim at studying 3D design for low power, small area pixels Will submit a chip with One analog tier of low power, low noise preamp, low offset discriminator for 50x50µ pixels One digital tier of local memory, sparsification and readout Collaboration with ATLAS pixel group (CPPM, LBL, Bonn) MPI Munchen (HG Moser) FNAL CMS SLHC (R. Yarema) INFN SuperB (V. Re) Sensor layer Pad 50 mm Analogue AOP Digital tier Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

Si-Ge calo upgrade tests 3 preamps designed with various bipolar input transistor sizes in Si-Ge 0.35 µm (AMS) 3 emitter sizes : 3, 30, 300 Super common base config (ǾT like) test benches : noise measurements Monitoring Irradiation at CERN wit 24 GeV/c protons Doses of 0.01,0.1 ,1,10,50 ,100 Mrad (3.7e11, 3.7e12,3.7e13, 3.7e14, 1.88e15, 3.7e15 neq/cm2) Test carried out after each dose Alimentation + pico-ampèremètre Générateur de pulses + oscilloscope Laptop,GPIB+ Labview Chip Si-Ge Carte Test Câble d’alimentation Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL 16

C. de La Taille - microelectronics at OMEGA-LAL SLHC Test card designed according to CERN geometrical specifications (M. Glaser) in fabrication 5/11/2007: (Henry Rosenweig, Gisèle M., A.Lounis) Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL Si-Ge The testboard is held on a shuttle that brings it to Irrad-1 beam Tests are performed outside the beam Testboard must withstand beam environments Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL 18

Irradiation aux neutrons thermique results SBC30 SBC3 SBC30 Irradiation aux neutrons thermique 1e13neq/cm2 Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL 19

C. de La Taille - microelectronics at OMEGA-LAL Si-Ge Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL 20

C. de La Taille - microelectronics at OMEGA-LAL Conclusion Good analog performance of SiGe technology MAROC, HaRDROC, SKIROC, SPIROC : 4 complex ASICs prototyped in 2007 : 2nd generation chips SoC : System on chip (ADC, TDC, DAQ…) : Long and difficult measurements… Use on ATLAS, ILC, neutrino, space experiments Test structures for radiation hardness Super common base preamps (2007) Individual transistors and preamps (2008) Team in Orsay : A. Lounis, M. Benoit, G. Martin-Chassard, F. Wicek Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL

C. de La Taille - microelectronics at OMEGA-LAL Collaborations LSST (2006-2010) with LPNHE ILC Si-W ECAL (2003-2020) with LLR & LPCClermont ILC RPC-Fe DHCAL (2006-) with LLR, IPNL & LAPP ILC Scintillator (SiPM)-Fe AHCAL (2003-) with DESY ILC Scintillator (SiPM)-W ECAL(2005-) with KEK ATLAS luminometer ALFA (2003-2009) with CERN ATLAS luminometer LUCID (2005-2009) with Bologna ATLAS tracker (2007-) with CPPM, Bonn, Munich & LBL Double Chooz (2007-2008) with NEVIS lab PMm² (2007-2010) with IPNO & LAPP SuperNemo Front-end (2008-) with Bordeaux SuperNemo SNATS (2008-) with LPCCaen SymbolX (2008-) with APC North Auger (2004-2007) with IPNO Medical imaging with MaPMT (2007-) with ISS Roma Medical imaging PET with MsiPM (2007-) with INFN Pisa Medical imaging with MaPMT (2007-2009) with IMNC Medical imaging with MaPMT (2008-) with CSNSM Balloon experiment with SiPM (2008-) with Aachen Generic detector R&D (2007-) Space telescope for EECR measurement (2006-) with EHWA Korea FJPPL (2006-) with KEK FCPPL (2007-) with IHEP Beijing Orsay, 19 jan 2009 C. de La Taille - microelectronics at OMEGA-LAL