Date of download: 10/8/2017 Copyright © ASME. All rights reserved.

Slides:



Advertisements
Similar presentations
Date of download: 5/30/2016 Copyright © ASME. All rights reserved. From: Introduction of the Element Interaction Technique for Welding Analysis and Simulation.
Advertisements

Date of download: 6/9/2016 Copyright © ASME. All rights reserved. From: Condensation on a Horizontal Wire-Wrapped Tube J. Heat Transfer. 2005;127(11):
Date of download: 6/23/2016 Copyright © ASME. All rights reserved. From: Heat Exchanger Design of Direct Evaporative Cooler Based on Outdoor and Indoor.
Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill J. Electron.
Date of download: 6/25/2016 Copyright © ASME. All rights reserved. From: The Effect of Gas Models on Compressor Efficiency Including Uncertainty J. Eng.
Date of download: 6/27/2016 Copyright © ASME. All rights reserved. From: Optical Microscopy-Aided Indentation Tests J. Eng. Mater. Technol. 2008;130(1):
Date of download: 7/2/2016 Copyright © ASME. All rights reserved. Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe J. Electron.
Date of download: 7/3/2016 Copyright © ASME. All rights reserved. From: Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel.
From: Optimal Shapes of Straight Fins and Finned Heat Sinks
Date of download: 9/27/2017 Copyright © ASME. All rights reserved.
Date of download: 9/27/2017 Copyright © ASME. All rights reserved.
From: Analysis of a Porous Elastic Sheet Damper With a Magnetic Fluid
Date of download: 10/3/2017 Copyright © ASME. All rights reserved.
Date of download: 10/3/2017 Copyright © ASME. All rights reserved.
Date of download: 10/4/2017 Copyright © ASME. All rights reserved.
Date of download: 10/5/2017 Copyright © ASME. All rights reserved.
Date of download: 10/6/2017 Copyright © ASME. All rights reserved.
From: A Stepped-Bar Apparatus for Thermal Resistance Measurements
Date of download: 10/7/2017 Copyright © ASME. All rights reserved.
Date of download: 10/9/2017 Copyright © ASME. All rights reserved.
From: Pressure Surge During Cryogenic Feedline Chilldown Process
Date of download: 10/10/2017 Copyright © ASME. All rights reserved.
Date of download: 10/12/2017 Copyright © ASME. All rights reserved.
Date of download: 10/12/2017 Copyright © ASME. All rights reserved.
Date of download: 10/13/2017 Copyright © ASME. All rights reserved.
Date of download: 10/15/2017 Copyright © ASME. All rights reserved.
Date of download: 10/16/2017 Copyright © ASME. All rights reserved.
Date of download: 10/19/2017 Copyright © ASME. All rights reserved.
Date of download: 10/20/2017 Copyright © ASME. All rights reserved.
Date of download: 10/20/2017 Copyright © ASME. All rights reserved.
Date of download: 10/20/2017 Copyright © ASME. All rights reserved.
Date of download: 10/22/2017 Copyright © ASME. All rights reserved.
Date of download: 10/23/2017 Copyright © ASME. All rights reserved.
Date of download: 10/23/2017 Copyright © ASME. All rights reserved.
Date of download: 10/24/2017 Copyright © ASME. All rights reserved.
Date of download: 10/25/2017 Copyright © ASME. All rights reserved.
Date of download: 10/25/2017 Copyright © ASME. All rights reserved.
Date of download: 10/28/2017 Copyright © ASME. All rights reserved.
Date of download: 10/28/2017 Copyright © ASME. All rights reserved.
Date of download: 10/28/2017 Copyright © ASME. All rights reserved.
Date of download: 10/29/2017 Copyright © ASME. All rights reserved.
Date of download: 10/30/2017 Copyright © ASME. All rights reserved.
Date of download: 11/1/2017 Copyright © ASME. All rights reserved.
From: Galerkin Solution of Stochastic Reaction-Diffusion Problems
Date of download: 11/1/2017 Copyright © ASME. All rights reserved.
From: Heat Exchanger Efficiency
Date of download: 11/2/2017 Copyright © ASME. All rights reserved.
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
From: Numerical Optimization of the Thermoelectric Cooling Devices
Date of download: 11/7/2017 Copyright © ASME. All rights reserved.
Date of download: 11/8/2017 Copyright © ASME. All rights reserved.
Date of download: 11/8/2017 Copyright © ASME. All rights reserved.
Date of download: 11/8/2017 Copyright © ASME. All rights reserved.
Date of download: 11/12/2017 Copyright © ASME. All rights reserved.
Date of download: 11/12/2017 Copyright © ASME. All rights reserved.
Date of download: 11/13/2017 Copyright © ASME. All rights reserved.
Date of download: 11/15/2017 Copyright © ASME. All rights reserved.
Date of download: 12/21/2017 Copyright © ASME. All rights reserved.
Date of download: 12/22/2017 Copyright © ASME. All rights reserved.
From: A Damage-Mechanics-Based Constitutive Model for Solder Joints
Date of download: 12/24/2017 Copyright © ASME. All rights reserved.
Date of download: 12/24/2017 Copyright © ASME. All rights reserved.
From: Modeling a Phase Change Thermal Storage Device
Date of download: 12/25/2017 Copyright © ASME. All rights reserved.
Date of download: 12/26/2017 Copyright © ASME. All rights reserved.
Date of download: 12/26/2017 Copyright © ASME. All rights reserved.
Date of download: 12/31/2017 Copyright © ASME. All rights reserved.
Date of download: 1/2/2018 Copyright © ASME. All rights reserved.
Date of download: 1/2/2018 Copyright © ASME. All rights reserved.
Presentation transcript:

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Saturated moisture concentration as a function of temperature of a BT sample for two different RH levels

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Saturated moisture concentration as a function of temperature for a low-Tg die-attach film at 60%RH level

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Special treatment and constrain equations at a bimaterial interface in the DCA

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Two distinct states of moisture in pores in polymer materials

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Implementation procedures of sequentially-coupled heat transfer/moisture diffusion and vapor pressure modeling for reflow process

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Comparison of moisture concentration between the DCA and analytical solution

Date of download: 10/8/2017 Copyright © ASME. All rights reserved. From: Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation J. Electron. Packag. 2009;131(3):031010-031010-7. doi:10.1115/1.3144147 Figure Legend: Schematic of moisture distribution in bulk and at interface for a bimaterial: (a) unsaturated case and (b) saturated case