Solder Paste Task Group (5-24b) APEX 2016 March 16, 2016 Karen Tellefsen, Alpha, Chair Bev Christian, Blackberry, Vice Chair

Solder Paste Task Group (5-24b) This task group is responsible for J-STD-005A, Requirements for Soldering Pastes.  The TG is presently reviewing test methods used by J-STD-005A, including R&R evaluation. Introductions a. Chair : Karen Tellefsen, Alpha b. Vice-Chair : Beverly Christian, Blackberry c. Attendees Housekeeping -- Copies of these documents are available for those unfamiliar with them. Antitrust Statement Principles of Standardization IPC’s ANSI Patent Policy Apex 2016 Workshop

IPC Anti Trust Statement No commercial topics should be acted upon or even considered at an IPC meeting Should not discuss Price or any element of price or pricing policies Sales or production quotas, territories , allocations, boycotts or market shares Identified company statistics, inventories or merchandising methods Particular competitors or customers Commercial liabilities, warranties, guarantees, or particular terms or conditions of sales, including credit, shipping and transportation arrangements. Anything dealing with arm-twisting, trade abuses or excluding/controlling competition

Principles of Standardization Standards Should Show relationship to DfM & DfE Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feed back system on use and problems in future development Standards Should Not Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannot be defended with data

IPC’s ANSI Patent Policy 16.4.3 Notice - When IPC receives from a patent holder the assurance set forth in 16.4.1 and 16.4.2 the standard shall include a note as follows: Note: The user's attention is called to the possibility that compliance with this standard may require use of an invention covered by patent rights. By publication of this standard, no position is taken with respect to the validity of this claim or of any patent rights in connection therewith. The patent holder has, however, filed a statement of willingness to grant a license under these rights on reasonable and nondiscriminatory terms and conditions to applicants desiring to obtain such a license. Details may be obtained from the standards developer. 16.4.4 Responsibility for Identifying Patents IPC shall not be responsible for identifying all patents for which a license may be required by IPC Standards or for conducting

Agenda History of existing test method revisions to date. TM status. Overview of changes. Powder size discrepancy between J-STD-005 and TM 650 2.2.14 as discovered by Stefan Moser/Bosch. Ingo Lomp / Balverzinn TM 2.4.45 slight dewetting at edge of printed circle with L0 paste. Review of new TM: Parallel plate rheology measurements New business Apex 2016 Workshop

TM Revision – Powder size All TM’s have draft revisions available in KAVI Powder Size: RR testing was done for powder size, we need to find the data. If we can’t find the data, we will need to repeat this. Apex 2016 Workshop

Powder size table Powder size discrepancy between J-STD-005 and TM 650 2.2.14 (1995) as discovered by Stefan Moser/Bosch. From the March 2014 draft of 2.2.14A Apex 2016 Workshop

TM Revision 2.2.20A -- Solder Paste Metal Content by Weight Working draft revised May 2014 Very simple test, do we need RR test? Take vote. 2.4.35 – Solder Paste – Slump A RR test was done before 2013, BUT Kyle Loomis / Kester found IPC’s gerber files did not correspond to the tables given in the test method. The gerber files have been revised to match the tables. There is a working draft revised June 2015 It’s too long in my opinion. Do we need another RR test? Take vote. 2.4.43 -- Solder Paste—Solder Ball Test Working draft revised May 2015, lots of pictures! We need another RR test. Apex 2016 Workshop

TM Revision 2.4.44A – Solder Paste – Tack Working Draft July 2014 Discussed tack on substrates other than glass slides Brook Sandy-Smith may have data We need RR test. 2.4.45A – Solder Paste – Wetting Working Draft October 2014 Cleaning procedure submitted by Cynthia Gomez / Continental Ingo Lomp / Balverzinn thinks that most L0 pastes don’t meet the requirement of wetting out to the edge of the print, and he’d like a slightly softer requirement. See following slide. What does the task group think? Apex 2016 Workshop

Apex 2016 Workshop

TM Revision – Viscosity 2.4.34A – Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipoise) Working draft January 2016 Need RR testing? Ask group. 2.4.34.1 – Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 centipoise) Need RR testing? Ask group. 2.4.34.2 – Solder Paste Viscosity—Spiral Pump Method (Applicable for 50,000 to 1,600,000 centipoise) Combined with 2.4.34.3 Need RR testing Apex 2016 Workshop

RR testing is a pain in the neck. RR testing of TM’s RR testing is a pain in the neck. Have a test plan for three TM’s: Wetting test (TM 2.4.45A) Solder Ball Test (TM 2.4.43) Tack Test. (TM 2.4.44A) Should we revise this to include: Slump? Group vote. Viscosity? Group vote. Where is the powder data? Apex 2016 Workshop

Parallel Plate Rheometer NEW TM: Parallel plate rheology measurements Final draft March 2016 If time permitting, quick review at this meeting. Apex 2016 Workshop

Solder Paste Task Group (5-24b) New Business? Next web meeting: Early April??? Next Face to Face SMTAI Rosemont IL, Wednesday September 28th 8-10 am Apex 2016 Workshop