SAE International Standards- G24 Pb-free Risk Mitigation for ADHP July 2017 Anduin E. Touw Chair, G24

G24 Scope Pb-free Risk Management for ADHP Committee develops standards and specifications for Pb-free electronics risk management for the aerospace, defense and high performance electronics industries. The committee also provides input to government and other industry standards related to Pb-free electronics risk management. It does not develop or revise workmanship and manufacturing standards. Objectives Develop and maintain standards, handbooks, and guidance documents for managing risk associated with Pb-free electronics; Provide recommendations to government and other industry activities regarding standards that include Pb-free risk management clauses; Coordinate activities with the IPC PERM Council, other SAE committees (including SSTC APMC, SSTC G-12, and SSTC G-11), and International Electrotechnical Commission (IEC) Technical Committee 107. G24 Pb-free Risk Management for ADHP

Current G24 Voting Members Jay Brusse (NASA) David Burdick (Boeing) Minerva Cruz (Six Sigma) Steven Davidson (Northrop Grumman) Dennis Fritz (SAIC) Ben Gumpert (Lockheed Martin) Joel Heebink (Honeywell) David Hillman (Rockwell Collins) Joseph Juarez (Honeywell) Milea Kammer (Honeywell Jeff Kennedy (Celestica) Andrew Kostic (Aerospace Corp) Jayanth Kygonhali (BGA Test & Technology) David Locker (US Army) Stephan Meschter (BAE) Mick Miller (US Navy) Catherine Munier (Airbus) David Pinsky (Raytheon) Anthony Rafanelli (Raytheon) David Redman (AVSI) Robert Ricco (Northrop Grumman) Stephen Ring (Forsite) Alexandre Santos (Embraer) William Scofield (Boeing) Robert Tipton (Wyle) Anduin Touw (Boeing) Don Tyler (Corfin) Linda Woody (Consultant) Joe Zaccari (Zaccordix) 29 voting members. >=15 participating for quorum. G24 Pb-free Risk Management for ADHP

Current WIP Status GEIAHB0005_1A Program Management/Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics Feb 24, 2016 Revised GEIAHB0005_2 Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes Jun 17, 2016 Reaffirmed GEIAHB0005_3 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems Sep 17, 2015 GEIASTD0005_1A Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder Mar 01, 2012 GEIASTD0005_2A Standard for Mitigating the Effects of Tin Whishers in Aerospace and High Performance Electronic Systems May 01, 2012 GEIASTD0005_3A Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes Dec 01, 2012 GEIASTD0006A Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts G24 Pb-free Risk Management for ADHP

GEIA-STD-0005-1: Revision Team Leads: Joe Zaccari, Milea Kammer, Gary Latta (roles TBD) Intent of Revision Restructure/Clarify Allow users to tailor Define 3 unique sections Tin Whiskers Pb-free Solder Alloys Commercial Off the Shelf (COTS) Assemblies Stream line What (Standard) vs. How (Handbook) Review Shall Statements Intent? Actionable? Auditable? NOTE: It should be the goal of the team to align the content of the -1 standard with that of the -1 handbook (May want to consider simultaneous or back-to-back revisions) G24 Pb-free Risk Management for ADHP

GEIA-STD-0005-1: Suggestions from PERM 31 Change title to: Standard for Managing the Risks of Solders and Finishes in ADHP Electronic Systems Use LFRMP (Lead Free Risk Management Plan) instead of LFCP (Leaf Free Control Plan) Eliminate “Shalls” in scope Create an applicability matrix for: Tin Lead Lead Free Mixed alloys Other planned actions Revise Scope Review verification matrix G24 Pb-free Risk Management for ADHP

GEIA-STD-0005-1: Technical Items Not Address in REV A Qualification by similarity What are the criteria for similarity? How to do LFCP if Pb-free is restricted or prohibited? Beef-up COTS section G24 Pb-free Risk Management for ADHP

GEIA-STD-0005-2: Revision Team Lead: Anduin Touw Intent of Revision Address Technical Gaps / New Information Conformal Coat studies Potting and encapsulation “Self Mitigation” / Pb poisoning Beef up COTS section Streamline / Readability Plan on having Thursday meeting starting in Sept, once or twice a month Please contact Anduin if interested in participating G24 Pb-free Risk Management for ADHP

ARP6415: Reballing vs. Mixed Alloy Team Lead: Ben Gumpert Intent: Overall approach for use of Pb-free BGAs Guidance document Awareness for general processes and risks Guidance steps to evaluate approach Status Completed detailed outline Defined intent and flow of document Current Activity Working on rough draft text G24 Pb-free Risk Management for ADHP

ARP6537: Pb-free Solder Bumps & Other Part Level Pb-free Uses Team Lead: Anduin Touw & Paul Nixon Intent: Beginning with use of Pb-free solder bumps, develop appropriate mitigations, tests, and screens to determine if specific uses of Pb-free solders within piece parts pose a risk to mil-aero applications Create criteria for accepting Pb-free solders inside piece parts Provide guidance to DLA on modifications to requirements in MIL-PRF-38535 and other part level mil specs with regards to use of Pb-free solder Status Have held 3 telecons Current Activity Gathering data on technical issues Meeting monthly on Thursday near end of month (looks like we are setting on 10am pacific, 1pm eastern) G24 Pb-free Risk Management for ADHP

ARP6537: Specific Technical Concerns 2 Areas of Concern for Pb-free Solders Risk of tin whiskers Durability of the solder in applications Each of these areas need to be addressed in any criteria for use of Pb-free solders in piece parts Plan on using Pb-free solder bumps as the initial case study but may have implications for other uses of Pb- free solders G24 Pb-free Risk Management for ADHP

ARP6537: Tin Whiskers & Underfill Concerns for underfill How do we determine if underfill material is hard enough to encapsulate whiskers? How do we determine if underfill material will maintain this property over aging? How do we evaluate the underfill process / outcome to make sure there are not significant voids that would allow whiskers to grow between bumps? How do we make sure the underfill “does no harm”? G24 Pb-free Risk Management for ADHP

ARP6537: Durability There have been issues with BGA balls and other solder joints cracking or showing early wear-out in TC or vibe The concern is that solder bumps may show the same behavior Should be lower risk due to smaller masses but still needs to be investigated Approach may be to determine appropriate qual test to evaluate design and process What tests would be appropriate? How would normal part level test qualifications (like test methods in 883) need to be adjusted for Pb-free solder? G24 Pb-free Risk Management for ADHP

Other Document Status GEIA-STD-0005-3 (Test Doc) hits its 5-year review at the end of this year Will we have bandwidth to work on that document once the IPC Design Guide is balloted? Should GEIA-HB-0005-1 (Program Manager’s Guide) be reviewed in parallel to GEIA-STD-0005-1? GEIA-HB-0005-2 (Technical Guide) is very out of date. We reaffirmed it last year to “put on hold” but we need to revisit it Need lead with bandwidth to start looking at this, preferably before end of 2017 or early 2018 G24 Pb-free Risk Management for ADHP

New Business / Future Work Ideas Manager friendly document on advantages and disadvantages of tin mitigations Position on when to do life testing on GEIA-STD-0006 Pb-free assembly risk decision matrix (Steph) Design guide? Program Manager’s guide? New document? Training needs – work as we revise documents?

Questions? Anduin E. Touw Chair, G24 anduin.e.touw@boeing.com 703-455-6865 / 310-503-7827