Micro Vertex Detector of PANDA Status of Strip BARREL and DISC

Slides:



Advertisements
Similar presentations
Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.
Advertisements

CALICE Dave Bailey. Aims and Objectives Develop the technology to build a high- resolution tracking calorimeter for ILC experiments Main thrusts: –Testbeam.
A. Bross Imperial College – 9/04 Status of VLPC Cryo-Cooler Cryostat Design Russ Rucinski (Alan Bross) Fermilab.
Mechanical Status of ECAL Marc Anduze – 30/10/06.
Status of VLPC Cryo-Cooler Cryostat Design Russ Rucinski (Alan Bross) Fermilab.
HFT PXL Mechanical July 2010 Howard Wieman LBNL 1.
Outer Stave Prototype Update E. Anderssen, M. Cepeda, M. Garcia-Sciveres, M. Gilchriese, N. Hartman, J. Silber LBNL W. Miller, W. Shih Allcomp, Inc ATLAS.
27 January 2010 Immanuel Gfall (HEPHY Vienna) Belle II SVD Mechanics and Cooling DEPFET Meeting Prag.
17/06/2010UK Valencia RAL Petals and Staves Meeting 1 DC-DC for Stave Bus Tapes Roy Wastie Oxford University.
Thomas Jefferson National Accelerator Facility Page 1 IPR October Independent Project Review of 12 GeV Upgrade Jefferson Lab October 18-20,
18 November 2010 Immanuel Gfall (HEPHY Vienna) SVD Mechanics IDM.
26 April 2013 Immanuel Gfall (HEPHY Vienna) Belle II SVD Overview.
ATLAS Upgrade ID Barrel: Services around ‘outer cylinder’ TJF updated According to the drawing ‘Preparation outer cylinder volume reservation’
1 Belle II IR 2 Shuji Tanaka KEK Joint Belle II & superB Background meeting 2012//Feb/ 8-9th 1.
November 16, 2001 C. Newsom BTeV Pixel Modeling, Prototyping and Testing C. Newsom University of Iowa.
20 th June 20111Enrico Da Riva, V. Rao Project Request and Geometry constraints June 20 th 2011 Bdg 298 Enrico Da Riva,Vinod Singh Rao CFD GTK.
Marc Anduze – 09/09/2008 Report on EUDET Mechanics - Global Design and composite structures: Marc Anduze - Integration Slab and thermal measurements: Aboud.
INTEGRATION OF THE CBM SILICON TRACKING SYSTEM U. Frankenfeld for the CBM collaboration supported by BMBF, EU-FP7 HadronPhysics3 and CRISP.
PXL Cable Options LG 1HFT Hardware Meeting 02/11/2010.
Module Development Plan I believe that we are ready to proceed to a program to demonstrate a PS module based on “2.5 D” interconnections. This is based.
BTeV Pixel Substrate C. M. Lei November Design Spec. Exposed to >10 Mrad Radiation Exposed to Operational Temp about –15C Under Ultra-high Vacuum,
JCOV, 25 OCT 2001Thermal screens in ATLAS Inner Detector J.Godlewski EP/ATI  ATLAS Inner Detector layout  Specifications for thermal screens  ANSYS.
2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.
November 12, 2001 C. Newsom BTeV Pixel Modeling, Prototyping and Testing C. Newsom University of Iowa.
Strip Stave cores Stephanie Yang ATLAS upgrade Oxford activities, January 2015.
PHENIX Silicon Vertex Tracker. Mechanical Requirements Stability requirement, short and long25 µm Low radiation length
FVTX Review, November 17th, FVTX Mechanical Status: WBS 1.6 Walter Sondheim - LANL Mechanical Project Engineer; VTX & FVTX.
M. Gilchriese U.S. Pixel Mechanics Overview M. G. D. Gilchriese Lawrence Berkeley National Laboratory April 2000.
LumiCal mechanical & sensors design Wojciech Wierba J.Błocki, E.Kielar, J.Kotuła, K.Oliwa, L.Zawiejski FCAL Workshop, IFJ PAN Cracow,
SVD Mechanics Markus Friedl (HEPHY Vienna) BPAC, 26 October 2015.
The HCAL barrel absorber structure
End-of-stave region. 2 Space Z-dimension is critical –Keep gap small (might help getting rid of stubs) Edge of last barrel silicon (at corner) is 1277.
Jan. 28, 2014W. Bertl, PSI BPIX Cooling Status W. Bertl, PSI.
TC Straw man for ATLAS ID for SLHC This layout is a result of the discussions in the GENOA ID upgrade workshop. Aim is to evolve this to include list of.
March 19, 2013W. Bertl, PSI Status of BPIX Cooling Activities W. Bertl, PSI.
Walter Sondheim 6/9/20081 DOE – Review of VTX upgrade detector for PHENIX Mechanics: Walter Sondheim - LANL.
K.W. Glitza University of Wuppertal IBL Stave (Lessons for Upgrade)
Dec
SiD Hcal structure & 1m² Micromegas chamber prototype CALICE 2009 – LYON – 2009, septembre 17 th.
Cooling of GEM detector CFD _GEM 2012/03/06 E. Da RivaCFD _GEM1.
Technical Design for the Mu3e Detector Dirk Wiedner on behalf of Mu3e February Dirk Wiedner PSI 2/15.
FP420 Hybrid Mechanical Design Ray Thompson / Manchester Manchester Xmas O7 Ray Thompson Julian Freestone, Andy Elvin.
Origami and Cooling 24th September 2012 C. Irmler (HEPHY Vienna) Joint PXD and SVD Meeting Göttingen.
7 February 2012 Annekathrin Frankenberger (HEPHY Vienna) Open CO 2 Cooling System at the beam test Belle II SVD-PXD Meeting.
MVD COOLING STATUS-PAST AND UPDATES PIXEL COOLING PROJECT: -STUDIES and TEST on MATERIALS (Carbon Foam) -THERMAL FEM ANALYSES and TEST on DISKS and STAVES.
MVD COOLING STATUS COOLING PLANT UPDATE: -ADDITION of the NEW CIRCUITS FOR GBT AND DC-DC Converter BOARDS IN THE COOLING PLANT -THERMAL STUDY OF GBT AND.
Marc Anduze first drawings of Ecal eudet module COPIED FROM : Marc Anduze PICTURES FROM : CALICE/EUDET electronic meeting – CERN – 12 July 07.
MVD COOLING STATUS COOLING PLANT: -UPDATE of THE HYDRAULIC SYSTEM -INTEGRATION OF THE MVD COOLING CIRCUIT PATHS INSIDE THE PANDA AREA -DEFINITION OF THE.
13 May 2011 Eddy Jans 0 Plans for the VELOpix-module LHCb-Nikhef discussion some specifications some requirements some ideas about the VELOpix-module some.
EC: 7 DISK concept Preliminary considerations
MVD COOLING STATUS MVD COOLING PROJECT: CHOICE of COOLING FLUID,
GSI, for the CBM Collaboration
Update of MVD services and requests
MVD Mechanics update EXTERNAL FRAME: NEW DESIGN
- STT LAYOUT - SECTOR F SECTOR A SECTOR B SECTOR E SECTOR D SECTOR C
PANDA Yoke of the Magnet
Micro-channel Cooling
Hybrid Pixel R&D and Interconnect Technologies
Micro Vertex Detector of PANDA Strip Detector
WP9 ITS Mechanics and Cooling
ALICE PD group meeting Andrea Francescon.
LumiCal mechanical design, integration with LDC and laser alignment
Adapting the via last Design
WG4 – Progress report R. Santoro and A. Tauro.
Work packages status in Torino and perspectives
Radiation Laboratory Meeting
Mechanics of the MVD Daniela Calvo on behalf of the MVD group
as a prototype for Super c-tau factory
After service guide for changing PCB
PANDA Collaboration Meeting
Presentation transcript:

Micro Vertex Detector of PANDA Status of Strip BARREL and DISC MVD Mechanics GSI 9.12.2013

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Content Technical Design Status of MVD Strip Barrel and Disc Disc Support Design status Barrel Design State status Integration R & D Works and Technical Development Strip Barrel and Disc Heat Transfer (Calculation / Tests) Cooling Calculation and Tests (Flow Rate, Pressure Drop) Production Status Outlook GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Design Strip Barrel and Disc ~315 ~176 ~450 ~267 ~278 ~259 Design State: Dez. 2013 157 141 ~142 ~?? Changes after Bochum meeting (9.9.2013) Disc Concept Chip adaptation mechanical structure Width of 50 mm has been extended to ….. mm Barrel Chip adaptation Flexible Tube diameter enlarged from 4 mm to 6 mm Developing of fixing means Request: Disc and Globel Frame has to been extendet No conflict with other areas GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Current Drawing MVD Design State: Okt. 2013 Draft 265 new Disc > 70 mm Frame Do/Di =282/274 mm Disc Do/Di =265/144 mm Barrel Do/Di = 259/259 mm GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Status of Technical Design Disc Support Design (current work) Disc Concept Mechanical Structure Chip support Sensor and PCB Integration Cable Integration Cooling MVD Integration GSI 9.12.2013

Current Draft MVD Strip Disc Design Status: Dec. 2013 Draft Mechanical Structure (without electronics) Frame Do/Di =282/274 mm Disc Do/Di =265/144 mm width > 70 mm Gap between Disc and Frame 4,5 mm 2*24 Trapezoidal Sensors 2 separate Discs divided into 4 segments Actually the Structure design concept will be revised in collaboration with the Institute of Plastic Processing from the RWTH Aachen min 70 mm min 35 mm GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Current Draft MVD Disc Module Specification Trapezoidal Silicon Sensors Chip Support: HTC Foam Chip design: 2*6Chips 4,2 *5-6mm ~1,8W/cm² Sensor Frame: CRFP Cooling Tube 1 MCC 12*12 mm (dimension are not fixed) Disc structure: CRFP Challenges Bonding procedure Disc Structure Attachment to the Disc structure Cooling connections Electronic connections ( Power, Cable number & dimensions) GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Assembly MVD Strip Disc Study with 6 sensors (4,2*5-6 mm) on each side and 1 MCC ~ 12*12 mm (dimension are not fixed) Specification Disc structure: CRFP Disc Module Chip design: 4,2 *5-6 ~1,8W/cm² Disc structure: CFK and HTC Poco Foam Sensor Frame: CRFP Cooling Tube 1 MCC 12*12 mm (dimension are not fixed) Ro/Ri= 133/67 mm L=> 35 mm GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Status of technical design Strip Barrel 3 & 4 (current work) Cable and PCB and Cooling Integration (new stave concept) removable mounting of Barrel Strips Integration GSI 9.12.2013

Current Draft MVD Strip Barrel No significant changes since the last presentation in Bochum New Stave concept Guiding of the PCB foil around the stave from top to bottom by applied bending Rounding of the edge stiffener Introduction of a cable duct (~2,5*5mm for 30 couples of cables (from 0,1-0,4 mm) Groove (~2,5*2,5mm) Slot Slot too little and 0.3mm cable is not stiff enough to push through Space Ok GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Barrel Strips removable mounting Unresolved Points Example solution saddle ball and barrel bold More solution were carried out in collaboration with the Institute of Plastic Processing from the RWTH Aachen The solution are yet not been rated GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Barrel Strip: Support for Detector Module Beam Strip N4 Actuell Stave design CFRP (2* pre-peg 90° /0° mm, ~0,2 mm ) Foam (Rohacell unpressed =2 mm) POCO HTC ~ 2,8 x ~ 10 mm (scheduled) Tube Do=2 mm Di=1.8 Material: MP35m (1.4571) Chip design: 4,2 *5-6 ~1,8W/cm² MCC~12*12 mm 30 couples of cables (from 0,1-0,4 mm) Unresolved Points Electronic connections (number, dimensions) Bonding procedure, Attachment to structure Material Properties, Layer Thickness PCB (Thin Flex), Glue, GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Assembly MVD Strip Barrel and Disc GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Strip Cooling Lay out Strip Cooling Lay-out Water cycle Barrel ¼ Disc Counter flow exchanger In Out Barrel 3 10 Barrel 4 13 Disc 5 & 6 8 Total 31 Cooling Manifolds Barrel & Disc 62 feedthroughs Torino 29.10.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Experimental setup Pressure range: -0,9 bar … 0 bar 0 bar … 1 bar Volume flow: 15 ml/min … 1000 ml/min Cooling Temperature: 5 °C … 80 °C Thermal investigations Hydraulic investigations Leakage tests ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Turin 29.-30. Oct. 2013

FEM Investigation FEM studies continued to carried out Some examples of FEM studies ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz , IKP A. Cebulla GSI 9.12.2013

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, R & D and Technical Development Strip Disc: optimize components complete with piping and cabling Sensor, Chip, Cable and Cooling Integration Extension the width of the Disc >15 mm, from 50 mm to >70 mm Strip Barrel: Optimization of mechanical support for the integration of the cables and cooling Heat Transfer (Calculation / Tests) FE Calculation Cooling Calculation and Tests (Flow Rate, Pressure Drop) Components and Material selection (Pipes, Fittings, Glue, Foam) Electronic Service lines, additional Lines for electronics, connection and cooling, Chip performance, Electronic connections (number, dimensions), Cable: Cable (dimensions) GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Production Status Prototype Barrel Structure Cylinder (half shells) Test Staves fabrication processing tests quality control cooling behavior Heat transfer 3 D Models (Rapid Prototyping) Barrel and Support, Disc Support Section GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz, Outlook MVD CAD Design optimization , Barrel and Disc (Service lines, additional Lines for electronics and cooling systems, support) Technical Developments optimize components complete with piping and cabling Materials selection Heat Transfer (Calculation / Tests) Cooling part (Pressure Drop, Flow Rate. Calculation / Tests) Hardware Components selection (Pipes, Fittings, Glue, Foam) GSI 9.12.2013 ZEA 1 V. Fracassi, D. Grunwald, E. Rosenthal, R. Schmitz,

Thank you for your attention