Developing Radiation Hard Silicon for the Vertex Locator

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Presentation transcript:

Developing Radiation Hard Silicon for the Vertex Locator Chris Parkes Introducing VELO Sensor Design Radiation Environment Upgrade ? On behalf of LHCb VELO: CERN (Geneva), EPFL (Lausanne), NIKHEF (Amsterdam), University of Glasgow, University of Heidelberg, University of Liverpool RESMDD,Florence, October 2004

LHCb Full spectrum of B hadrons: Bs system Dedicated B system CP violation Experiment Full spectrum of B hadrons: Bs system All angles, sides of both CKM s Lots of events ! LHCb single arm spectrometer 15-300mrad angular acceptance recently optimised to minimise material and improve triggering Vertex Locator

Velo Rôles Primary / b decay Vertex reconstruction Stand alone Tracking A principle tracking device for the experiment Second Level Trigger Fast tracking 1m In vacuum Retract each fill Align each fill One set of half disks

Design VELO sensors as close as possible to beam no beam pipe, sensors ~7mm away from beam BUT Injection: retraction by 30mm Protect sensors against RF pickup from LHC beam Protect LHC Vacuum from possible out-gassing of detector modules Place sensors in a secondary vacuum in Roman pots

Secondary Vacuum – RF Foil Made from 250mm thick Al Inner corrugations : Minimal material before the first sensor is hit Outer corrugations: allow for overlap of detector halves for full azimuthal coverage and for alignment Prototyping at NIKHEF method: Hot gas Forming full size foil vacuum tight and stiff outer corrugations beam inner corrugations F sensors R sensors

A few microns in a few minutes Need alignment for displaced vertex trigger Detector resolution 4um series of discs Detectors separated 6cm during injection small overlap Use computing power of online / trigger farm 10cm

Sensor Design R & Phi sensors Baseline design of sensors: R-measuring sensor: (concentric strips) F–measuring sensor: (Radial strips with a stereo angle) R & Phi sensors Fast stand-alone tracking and vertexing for trigger Design allows to optimise resolution vs. number of channels Baseline design of sensors: Active area 8mm to 42 mm Smooth pitch variation from inner (40m) to outer radii (100m) 2nd metal layer to route signal to chips n+-on-n DOFZ Analogue readout 40MHz

Module Double Sided Modules: mechanically stable low material cooling connection Double Sided Modules: Single Sided Silicon sensors thin kapton flex circuit laminated onto carbon fibre/ TPG composite cooling block low mass carbon fibre paddle precision aluminium base plate

Extreme Radiation Environment Maximum Fluence 1.3x1014 1MeV neq/cm2/year Strongly non-uniform dependence on 1/r2 and station (z) Maintain a good S/N performance for several years (replacement) Extensive R&D program to select Sensor and Front-End chip LHCb VELO will be HOT! Middle station Far station

spillover: signal at 25ns after peak in % of the peak signal May 2004 test beam results 300mm n+-on-n R sensor 300mm S:N =18:1 200mm S:N =12:1 16 readout chips (Beetle 1.3) Prototype hybrid (K03) time/ns Pulse shape spillover: signal at 25ns after peak in % of the peak signal 30% (100V bias) (30% is the maximum before displaced vertex trigger performance degraded.) signal

Performance S/N and Spillover for a set of FE chip (Beetle) bias settings Minimum requirement for Trigger Minimum at LHCb startup 300mm extrapolation 200mm measurement spillover: signal at 25ns after peak in % of the peak signal Maximum requirement from Trigger have to find a compromise S/N for 200mm at the lower side

Velo Upgrade? First upgrade at LHC? Radiation Tolerance Low Material Sensors expected to survive 3 years, so 2010… Radiation Tolerance 3.3x 1014 neq/cm2/year at 5mm Edgeless technology, save guard ring space 7mm rather than 8mm 10% better impact parameter resolution Low Material Keep electronics, cooling mostly outside acceptance Laser cut Velo sensor 19 % X0 (4% before first hit)

Strip Technology Options R/Phi Strip geometry has advantages fast tracking for trigger matches occupancy minimal material in acceptance Strip Technology Options 3D Holes Aspect Ratio 40:1 Join holes with strips n+-on-p (GianLuigi), MCz…

Many thanks to Jaako Harkonen, HIP for the MCz detector MCz test beam results Test beam at the CERN SPS of a MCz detector p+-on-n MCz material, 6.1cm x 1.92 cm, 380 mm thick, 50 mm pitch, with LHC electronics Signal [ADC Counts] Signal [ADC Counts] Bias Voltage [V]] Bias Voltage [V]] Depleted the detector (~550 V) (CV measured Vdep ~ 420 V) 1.3 x 1014 24 GeV p/cm2 S/N = 15 4.3 x 1014 24 GeV p/cm2 S/N = 11 (under depleted) 7.0 x 1014 24 GeV p/cm2 S/N = 7 (under depleted) S / N > 23.5 + 2.5 (380 mm thick)

Status & Conclusions VELO moving from last prototype testing to sensor production first pre-production sensors arriving now test beam of final module configuration in November 20004 R&D for possible upgrades started first operation of full size MCz sensor with LHC speed electronics in test beam further studies planned