Electronic Parts for Strategic Systems: Past, Present and Future

Slides:



Advertisements
Similar presentations
©2006 The Aerospace Corporation Activities Associated With Working With Xilinx to Develop A Space Flow for Virtex Family of FPGA’s Larry Harzstark The.
Advertisements

Computer Organization and Architecture
Computer Organization and Architecture
+ CS 325: CS Hardware and Software Organization and Architecture Internal Memory.
Advanced Manufacturing Technologies for Extending Microprocessor Availability Proactive Solution to Military Microprocessor Availability and Affordability.
Turnkey IC and Device Packaging Package Science Services LLC Package design, characterization, simulation, modeling, measurements and analysis.
What is memory? Memory is used to store information within a computer, either programs or data. Programs and data cannot be used directly from a disk or.
1 Highly Accelerated Life Test (HALT) Wayne Bradley 8 April 2014.
1 Characterization and Comparison of New Concepts in Neutron Detection Advisers: Professor Martin E. Nelson – Mechanical Engineering Professor Svetlana.
Natural Fibre Solutions from Source to Shop FELICITY MCDONALD THE MERINO COMPANY (TMC) A UNIQUE BUSINESS MODEL, PROVIDING WOOLGROWERS STABLE AND SUSTAINABLE.
Defense and Aerospace Screening Flows Joe Fabula
Avionics Qualified Electronic Component. AQEC – WHAT IS IT ? A cooperative approach to working with the integrated circuit manufacturers to use their.
Electric Components. Basics 1 Current: electrons moving together in same direction (electrons are always moving in materials like metals but in a random.
Basic Circuits Foundations of Technology Basic Circuits © 2013 International Technology and Engineering Educators Association, STEM  Center for Teaching.
ITRS Factory Integration Difficult Challenges Last Updated: 30 May 2003.
Electricity and Electronics Brad Dearing 108 University High School Normal, IL (309)
JPL’s Commercial Off-The-Shelf (COTS) Program
Mission Success Starts With Safety Michael J. Sampson, Program Manager, Workmanship and EEE Parts Assurance NASA GSFC, Greenbelt, MD Code 306, Systems.
University of Pennsylvania Basic Electronics Things to be covered: What is electricity Voltage, Current, Resistance Ohm’s Law Capacitors, Inductors Semiconductors.
Semiconductor Memory Types
GLAST LAT ProjectCAL Peer Design Review, Mar 17-18, 2003 W. N. Johnson Naval Research Lab Washington DC GLAST Large Area Telescope Calorimeter Subsystem.
Performance Transformation Culture STANDARDIZATION OF ENHANCED PLASTIC MICROCIRCUITS FOR MILITARY APPLICATIONS Thomas Hess DSCC Chief, Active Devices Team.
Computer Architecture Chapter (5): Internal Memory
Concepts of Engineering and Technology Copyright © Texas Education Agency, All rights reserved. 1.
Solving Microelectronic Obsolescence Through Die Reclamation, Re-Assembly & Test A Proven Solution to Provide Management Support for Diminishing Manufacturing.
Power Matters.™ Precision Commercial of the Shelf ( COTS) Oscillators for Space Applications Peter Cash, Mike Silveira and Matt Stanczyk April 13, 2016.
COTS PEMs Procurement & Acquisition Concerns and Issues Dr. Henning W. Leidecker GSFC/Code Nov 2002.
Electrical Fundamentals. Basic Electricity What is Electricity? Electricity is basically a movement of electrons which can be controlled and used to.
Electricity & Magnetism Static, Currents, Circuits Magnetic Fields & Electro Magnets Motors & Generators.
Chapter 5 - Internal Memory 5.1 Semiconductor Main Memory 5.2 Error Correction 5.3 Advanced DRAM Organization.
Purchasing Decisions And Business Strategy
Engineering Requirements for a Tin- Whisker-Risk-Controlling Conformal Coating to be used in a Missile A generic presentation by Bill Rollins, representing.
Comparison Study of Bulk and SOI CMOS Technologies based Rad-hard ADCs in Space Feitao Qi , Tao Liu , Hainan Liu , Chuanbin Zeng , Bo Li , Fazhan Zhao.
CAPT Mark Oesterreich, USN Radiation Hardening and Trust in a COTS Age
Chapter 5 Internal Memory
William Stallings Computer Organization and Architecture 7th Edition
Integrated Circuits.
Rad (radiation) Hard Devices used in Space, Military Applications, Nuclear Power in-situ Instrumentation Savanna Krassau 4/21/2017 Abstract: Environments.
WBS 1.03 Readout Systems Scope, Cost and Schedule
Milano Activities: an update Mauro Citterio On behalf of INFN Milano
Change Management V.N.Bhaskar Rao Engineering & Construction Director Amec Foster Wheeler India Operations.
Microsoft SAM for Hosting (SPLA)
Presentation Title Goes Here
An Introduction to Electricity
William Stallings Computer Organization and Architecture 7th Edition
C100 Activation Status and Projections JLab Ops Staytreat 2016
William Stallings Computer Organization and Architecture 8th Edition
Information Storage and Spintronics 10
A Novel Fault Current Limiter
A Professional Approach for Highly Reliable
William Stallings Computer Organization and Architecture 7th Edition
William Stallings Computer Organization and Architecture 8th Edition
BIC 10503: COMPUTER ARCHITECTURE
What Makes Voltronics Unique
High Efficiency, Low Voltage Output DC-DC Converter Solutions
Design of a ‘Single Event Effect’ Mitigation Technique for Reconfigurable Architectures SAJID BALOCH Prof. Dr. T. Arslan1,2 Dr.Adrian Stoica3.
GLAST Large Area Telescope
Single-Phase Qualification of Microcircuits in ESCC 9000
“Your single source solution to component distribution”
William Stallings Computer Organization and Architecture 8th Edition
Rad Hard Products for Satellites and Space
DLAD Procurement Notes & Tech/Quality Requirements
Sourcing and Qualifications Division DLA Land and Maritime - VQ
FPGAs For High-Reliability Applications
Miniature Automation Controller
Semiconductor memories are classified in different ways. A distinction is made between read-only (ROM) and read-write (RWM) memories. The contents RWMs.
Presentation transcript:

Electronic Parts for Strategic Systems: Past, Present and Future CAPT Mark Oesterreich, USN Commanding Officer NSWC Crane Dr. Brett Seidle, SES Technical Director David Emily 703-966-5483 davidemily@bluemarble.net Electronic Parts for Strategic Systems: Past, Present and Future

Requirements Strategic Weapon Systems electronic parts must meet the most stringent requirements Strategic Radiation Hardness Prompt Dose Rate upset, recovery and survivability Total Ionizing Dose Neutron Displacement Damage Natural Space Heavy-ion and proton single-event effects 30+ year typical system life Submarine, Silo, Bomber, Bunker environments Reliability High availability, short-notice operation Missile launch Shock, vibration, acceleration, pressure, vacuum Trust Counterfeit to sophisticated tampering While maintaining affordability, availability and performance

Declining Rad-Hard Industrial Base Foreign acquisitions and business changes continue to impact the radiation-hardened electronics industrial base - a long-term trend Many rad-hard part manufacturers have exited market Low volumes do not attract additional vendors Natural-space parts do not satisfy Strategic Rad-Hard Requirements Strategic Parts Vendors Year 85 90 10 17 25 Digital 9* 4 2 1 ? Analog 7* 3 1 0** ? Honeywell , BAE – Digital Intersil – Analog * From April 2011 presentation by SP23 to OPNAV N87 ** High Voltage Analog 4

Evolution of Strategic Electronics Strategic electronics have evolved with industrial base Do not typically push leading edge technology Previous Generation 1980s Electronics Technology Predominately Bipolar Technology (I²L, ISL, TTL) 10 MHz 16-bit Processor; 16K Static Random Access Memory Fusible Link program memory; Plated-wire non-volatile memory Captive Line Semiconductors Controlled almost everything Program unique custom requirements Current Generation 2010s Electronics Technology Predominately CMOS; Bipolar for High-voltage analog 100 MHz 32-bit processor; 4M SRAM; 1M Magnetic non-volatile memory Procured to Mil-standards Qualified Manufacturers List (QML) & Qualified Parts List (QPL) Supplemented with program unique requirements testing

Future Strategic Electronics What if we totally lose our traditional (Rad-Hard by Process and Design) strategic rad-hard industrial base ? Alternatives – With increasing risk Strategic Radiation-Hardened By Design (S-RHBD) Trusted commercial fabrication lines with no process modification Design and layout rules added to conventional RHBD to address strategic prompt dose-rate radiation upset, recovery and survivability Radiation-Hardened by Design (RHBD) with up-screen Design and layout rules for space level total dose and single-event effects mitigation Intrinsic with up-screen for strategic prompt dose rate effects Commercial off-the-shelf (COTS) Commercial fabrication line/parts with no modification Up-screen for all radiation environments

Challenges Strategic and conventional RHBD have challenges Fabrication process stability Difficult to reduce strategic system 5 to 10 year cycle to model, design, fabricate, qualify, flight qualify and procure entire production quantity Commercial fabrication processes undergo “continuous process improvement” for yield, performance and cost with minimal to no consideration for radiation hardness impact Possible notification but no influence (except life-of-type-buy) Coordination/interface (store-front) Multiple parties involved in modeling, design, fabrication, packaging, electrical and radiation testing, qualification of finished product No single party accepts responsibility for final product Liability, schedule and cost risk fall back on program/prime Reliability models do not support 30+ year product life Basic reliability models, design and layout rules require modification Conventional RHBD does not design for strategic prompt dose rate Limited dose rate testing fault coverage may not identify “weak-links”

Challenges (2) Commercial Off-the-Shelf has significant challenges Fabrication process and design stability Difficult to reduce strategic system 5 to 10 year cycle to qualify, flight qualify and procure entire production quantity No notification of process or design change Parts may be from multiple fabrication lots, further complicating radiation hardness assurance Testability and fault coverage Unlikely to have access to circuit design details or test vectors to develop adequate fault coverage With no design or layout radiation hardening rules for any radiation environments there are likely to be weak radiation hardness areas Limited radiation tests and bias conditions give high opportunity for test escapes Unlikely to have been designed for 30+ year life Reliability testing impacted by same testability and fault coverage issues as radiation testing Packaging is likely non-hermetic and also does not support 30+ years

Commercial Off-the-Shelf challenges - continued Additional packaging concerns Lead-free Copper bond wires Plastic compounds stability, chemical reactions, outgassing, … Flip-chip warm x-ray thermo-mechanical issues

Summary Strategic Radiation-Hardened by Design is lowest risk alternative to traditional strategic rad-hard Addition of design and layout rules for prompt dose rate survivability, upset and recovery Establishment of storefront business model willing to take full responsibility for final product Extend reliability models to support 30+ year life Long-term availability and stability of fabrication process is remaining challenge 97% of typical strategic system part count are already non-developmental off-the-shelf parts 13% active discrete transistors and diodes 84% passive discrete capacitors, resistors, magnetics

Audience Participation Are there other Alternatives ? Are there other Challenges ? Are some Challenges non-issues ? What are potential solutions to challenges ?