Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: Segment of a thermoelectric material

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: Schematic of (a) conventional, (b) composite, and (c) integrated thermoelectric devices

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: Effects of hot surface temperature on (a) electrical power output and (b) heat input for various TED designs (at h = 0 Wm-2K-1,Tc = 300 K, d = 5 mm, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: h = 0 Wm-2 K-1,Tc = 300 K, d = 5 mm, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: The temperature variation along the length of leg (L) for various TED designs at Th = 350 K and 500 K values (at h = 0 Wm-2K-1,Tc = 300 K, d = 5 mm, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: Influence of cold surface temperature on (a) electrical power output and (b) heat input for various TED designs (at h = 0 Wm-2K-1,Th = 450 K, d = 5 mm, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: Influence of cold surface temperature on (a) thermal efficiency and (b) electrical current for various TED designs (at h = 0 Wm-2K-1,Th = 450 K, d = 5 mm, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: The variation of (a) electrical power output and (b) heat input for different semiconductor slice thicknesses (at h = 0 Wm-2K-1,Th = 450 K,Tc = 300 K, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: The variation of (a) thermal efficiency and (b) electrical current for different semiconductor slice thicknesses (at h = 0 Wm-2K-1,Th = 450 K,Tc = 300 K, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: The response of (a) electrical power output, (b) heat input, and (c) thermal efficiency of TED designs with various convection heat transfer coefficients (at Th = 450 K,Tc = 300 K, d = 5 mm, and RL = Ri)

Date of download: 10/9/2017 Copyright © ASME. All rights reserved. From: Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery J. Heat Transfer. 2013;135(3):031706-031706-11. doi:10.1115/1.4007892 Figure Legend: The variation of (a) electrical power output and (b) thermal efficiency with load resistance (RL) for different semiconductor slice thickness (at h = 0 Wm-2K-1,Th = 450 K and Tc = 300 K)