EECS 473 Advanced Embedded Systems

Slides:



Advertisements
Similar presentations
EECS 373 Winter 2014 Finishing up. Design expo Design Expo is on Tuesday the 22 nd from 11am-1:30pm in the EECS atrium. – Setup starts at 9:30am – We’ll.
Advertisements

» When you have completed this module you will know, what components do, what they physically look like and how they are represented in a circuit diagram.
MICHAEL CHIANG EECS /05/2013 Presenting: Capacitors.
1 EE40 Summer 2010 Hug EE40 Lecture 10 Josh Hug 7/17/2010.
Announcements Troubles with Assignments… –Assignments are 20% of the final grade –Exam questions very similar (30%) Deadline extended to 5pm Fridays, if.
2/9/2007EECS150 Lab Lecture #41 Debugging EECS150 Spring2007 – Lab Lecture #4 Laura Pelton Greg Gibeling.
CIS 310 Management Information Systems Course Overview Guthrie, Summer 2014.
EECS 498 Advanced Embedded Systems Lecture 10: Power review, Switching power supplies, Start on signal integrity.
10/31/2008EECS150 Lab Lecture #10 The Waveform Generator EECS150 Fall Lab Lecture #10 Chris Fletcher Adopted from slides designed by Chris Fletcher.
Administrative Stuff (yawn) How rude - I think I forgot to introduce myself. Lecturer: Rob Day Cell Office Kenny Road, Room 200E.
ENGR 6806 – Motor Control Prepared By: Rob Collett September 15, Office: EN2074.
CVD PCB, first steps. 15 mm 25 mm Chip area. No ground plane underneath the chip. Bulk isolated => only one ground line Power lines Connector: 11,1mm*2,1mm:
Modelling of TPM noise problems Greg, following discussions and measurements with David and Senerath.
EECS 498 Advanced Embedded Systems Lecture 8: Topic Groups, RTOS Review & Power Introduction.
Fang Gong HomeWork 6 & 7 Fang Gong
Impact of High Impedance Mid-Frequency Noise on Power Delivery Jennifer Hsiao-Ping Tsai.
Effective Campaigning GCU Students’ Association Elections 2015.
EECS 373 On Operational Amplifiers and Other Means of Manipulating Voltage and Current.
Basics of Bypass Capacitor, Its Functions and Applications.
Mr. Silva History Room L17.  You will learn:  How to enter the room  How to pick up and pass back papers  What the rules are  How you will be graded.
Objection Handling. Agenda Seven Steps to handle objections 10 Common objections Questions.
Power Distribution Copyright F. Canavero, R. Fantino Licensed to HDT - High Design Technology.
TERMINATIONS Copyright F. Canavero, R. Fantino Licensed to HDT - High Design Technology.
Hidden Slide for Instructor
Adapter Board Design Changes
Day 38: December 4, 2013 Transmission Lines Implications
ECE 3355 Electronics Lecture Notes -- Set 1 -- Version 15
INDUSTRIAL ELECTRONICS/ELECTRICITY
SAR ADC Input Types TIPL 4003 TI Precision Labs – ADCs
We will watch a short news clip on the topic of ‘FORENSIC ENTOMOLOGY’
Online Course Design: Is the Conversation Over?
Reflecting on Sprint 1 Reports
Effective Campaigning
Project of Network Analysis
EECS 473 Advanced Embedded Systems
EECS 473 Advanced Embedded Systems
Melanie Edmondson County Operations
Department of Economics University of Leicester 2010/11 SO’H
PCB Design & Layout Tips
OUTCOME MEASUREMENT TRAINING
Do Now Turn in Homework – it is LATE after the Do Now.
Homework 3 (Due 3/10) Submit code and report to:
ESL - Equivalent Series Inductance ‘L’
Day 31: November 23, 2011 Crosstalk
Introduce as appropriate, and explain this assembly will help us to understand what’s happening when we feel worried.
Homework 3 (Due 3/10) Submit code and report to:
Unit 1 The History of Earth Overview and Unit Guide
Day 31: November 26, 2012 Inductive Noise
EECS 473 Advanced Embedded Systems
“last minute” strategies
Basic Electronics Part Two: Electronic Components.
Computer Science Testing.
EECS 373 On Operational Amplifiers and Other Means of Manipulating Voltage and Current.
EECS 473 Advanced Embedded Systems
EECS 373 Advanced Embedded Systems
EECS 473 Advanced Embedded Systems
EECS150 Fall 2007 – Lab Lecture #4 Shah Bawany
What Should I Do About Worries?
EECS 473 Advanced Embedded Systems
Tonga Institute of Higher Education IT 141: Information Systems
Hi, lovely to meet you all…….. Etc……..
BIT 115: Introduction To Programming
Building a Winning Campaign Team
What Should I Do About Worries?
DC Circuits Ch. 27 These circuit elements and many others can be combined to produce a limitless variety of useful devices wire open switch closed switch.
Tonga Institute of Higher Education IT 141: Information Systems
Introduction to Distribution Systems
Your Project Title (It is YOUR project, not the team's project, not CAM2) Your Name Date.
Some electrical issues related to the building of PCBs
This is a template for a presentation that you can use to introduce your team to Harvest. You can customize the content of the slides. You’ll want to pay.
Presentation transcript:

EECS 473 Advanced Embedded Systems Lecture 9: Groups introduce their projects Power integrity issues

Project groups Please give a 2-3 minute overview of your project. Today: ARM chairs The group formerly known as ARM chairs, Glove, Waiter, Sign detect, ERP. Everyone else on Tuesday After this we’ll have ~90 second talks by half the groups each day. Keeping the same grouping Don’t worry about these They aren’t graded, they aren’t formal, they are merely informative. Just Spend 5 minutes thinking about what you want to say (and who will say it). Write down 3-5 talking points you want to touch so you can be sure you hit what you wanted to hit. Feel free to chime in if your speaker leaves something important out you want to say. Do ask questions. Turns out a “hummm… why are you doing X instead of Y?” or “Have you looked at part Z?” questions can really help (either your team or their team!). I’ll often provide some guidance for a given “week” of reports. This time is “give us an elevator pitch” Next time will be “What’s your status on part ordering, board design, and programming”

Final proposal due today Today Thursday @11pm I should have signed group agreement now. I should have feedback by Monday night to all groups.

Where we are; where we are going Labs 1-3 done, lab 4 due this week PCB lab Much less conceptual—it’s about learning a tool Entering full-time project mode. Have midterm and 2 homework assignments before project due. Everything else is project (and lecture). HW1 posted by the end of the day. Due 10/18 (12 days from now) I expect it will take ~4 hours It’s a nice prep for the midterm. Also practice midterms are posted. You should be putting in ~15 hours/week into the project. The more you put in now, the less you have later. And some things (reorders, PCB redos) just take time—can’t cram. You really (really) want time to debug! Large part of project grade based upon fully working. More complex projects get a bit more slack, but… Project due a week before classes end (design expo)

Power Distribution Network Power Integrity Power Distribution Network Talked a lot about keeping the power supply voltage constant. Should think of situation as follows: If the processor drops 3.3V and uses 100mA, what is it’s effective resistance? If the power supply is 3.3V, the processor uses 100mA and the total resistance of the PDN (Power distribution network) is .01Ω, what voltage does the processor really see? Input PDN Processor Output

Consider an FPGA with the following characteristics Acceptable voltage range is from 2.65 to 2.75V Max current is 5A. What is the largest impedance we can see on the PDN and still have this work?

Given the previous table.. Power Integrity Given the previous table..

Power Integrity Removing the PCB…

Power Integrity But wait… VRM Voltage regulator module bulk bypass (tantalum) and decoupling capacitors (ceramic). These capacitors supply instantaneous current (at different frequencies) to the drivers until the VRM can respond.  However sets of different capacitors cause problems! http://www.pcbdesign007.com/pages/columns.cgi? artcatid=0&clmid=65&artid=85396&pg=3&_pf_=1

Other power integrity issues Of course, one source of power integrity problems is coming from the processor Power supply just can’t keep up with processor varying (what we just did) But there are other problems. And these are issues introduced by the PCB designer. Don’t be that guy/gal.

Connecting ground poorly Power Integrity Connecting ground poorly One big issue is that people think of ground as, well, ground. It isn’t. Only one point is “0V”. Everything else has a higher voltage. Wires aren’t perfect. It’s really easy to make this mistake. Classes like EECS 215 basically encourage it. Better to think of things as “return path” not ground. And yes, you can make the same mistake with power, but people do that a lot less often. Partly because we often have different “Vcc” levels on the board. But mostly because we just think of power and ground differently.

Consider the following Power Integrity Consider the following Consider the figure on the right. Why is the top picture “wrong”? Let’s consider the case of “A” being DC motor that runs at 120 Watts (12V 10A). B is processor drawing 100mA Wire from A to PSU return is 15cm long, 400mils wide. What is the voltage at the “ground”? 0.1A 0.02Ω 10A 3.3V 12V Top figure from “The Circuit Designer’s Companion”. If you are going to do PCB design much, buy and read this book.

Review: Power integrity (1/2) Processors and other ICs have varying current demands Sometimes at frequencies much greater than the device itself runs at Why? So the power/ground inputs need to be able to deal with that. Basically we want those wires to be ideal and just supply how ever much or little current we need. If the current can’t be supplied correctly, we’ll get voltage droops. How much power noise can we accept? Depends on the part (read the spec). If it can run from 3.5V to 5.5V we just need to insure it stays in that range. So we need to make sure that given the current, we don’t end up out of the voltage range. Basically need to insure that we don’t drop too much voltage over the wires that are supplying the power!

Review: Power integrity (2/2) So we need the impedance of the wires to be low. Because the ICs operate at a wide variety of frequencies, we need to consider all of them. The wires themselves have a lot of inductance, so a lot of impedance at high frequencies. Need to counter this by adding capacitors. Problem is that the caps have parasitic inductance and resistance. So they don’t help as well as you’d like But more in parallel is good. Each cap will help with different frequency ranges. We also can get a small but low-parasitic cap out of the power/ground plane. Finally we should consider anti-resonance*. * http://www.n4iqt.com/BillRiley/multi/esr-and-bypass-caps.pdf provides a very nice overview of the topic and how to address it.

Power Integrity (PI) summary Power integrity is about keeping the Vcc/ground difference constant and at the value you want. Covered two issues: Many devices that sink power do so in “pulses” Due to internal clocks and time-varying behavior Need caps to keep value constant But parasitic ESR/ESL cause problems So lots of them==good Reduce ESR/ESL Increase capacitance. Anti-resonance can cause problems! Need Spice or other tools to model. Will do a bit of this next time Also, need to watch return paths Can easily bump up your ground level Cuts into your margin for the work above…

Additional “reading” http://www.murata.com/en-us/products/emiconfun/capacitor/2013/02/14/en-20130214-p1 Very nice coverage of ESR and impedance in a non-idea capacitor. Touches on the fact that ESR varies by frequency! Very readable and short! http://ksim.kemet.com/ Nice spice models of real capacitors. http://doc.utwente.nl/64874/1/tiggelman.pdf A much more academic treatment of ESR. https://www.youtube.com/watch?v=sW0a9d_vWoc Mildly amusing and useful (who doesn’t like magic smoke?)