Basic Planar Processes

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Presentation transcript:

Basic Planar Processes

Processes used to fabricate IC Silicon Wafer (Substrate) Preparation Epitaxial Growth Oxidation Photolithography Diffusion Ion Implantation Isolation Technique Metallization Assembly Processing and Pacckaging

Silicon Wafer Preparation Czochralski Crystal Growth

Silicon Ingot & Ingot Slicing

Wafer Polishing and Etching

Epitaxial Growth

Oxidation Si + 2H2O SiO2 + 2H2

Photolithography

Diffusion

Ion Implantation

Isolation Techniques PN Junction Isolation Dielectric Isolation

PN Junction Isolation

Dielectric Isolation

Metallization Aluminium is used in metallization due to following reasons: It is a good conductor. Easy to deposit using aluminium films using vacuum deposition It makes good mechanical bonds with silicon It forms low resistance contact with p type Si and heavily doped n-type Si.

Vacuum Evaporation

Assembly Processing and Packaging

Assembly Processing and Packaging