Safety and Reliability Analysis Team KANG Group 1

10.22 Failures/Million hours MTTF 9.78E4 hours ~ 11.2 years MC9S12XD Microcontroller Reliability Analysis λp = (C1πT + C2πE)πQπL (Microcircuit Model) Parameter Value Justification / Assumptions C1 0.280 16 Bit Microprocessor, MOS ([1], Section 5.1) C2 0.077 144 Pin, Nonhermetic SMT Packaging, Value determined by interpolation ([1], Section 5.9) πT 3.1 Digital MOS Device Assumptions: TJ=125C. ([1], Section 5.8) πE 2.0 Ground Fixed Environment ([1], Section 5.10) πQ 10.0 Commercial Component ([1], Section 5.10) πL 1.0 Years in Production >= 2 ([1], Section 5.10) λp 10.22 Failures/Million hours MTTF 9.78E4 hours ~ 11.2 years

Justification / Assumptions GAL26CV12 PLD Reliability Analysis λp = (C1πT + C2πE)πQπL (Microcircuit Model) Parameter Value Justification / Assumptions C1 .0017 PLA, 1000 Gates, MOS ([1], Section 5.1) C2 .013 28 Pin, Nonhermetic DIP Packaging ([1], Section 5.9) πT 3.1 Digital MOS Device Assumptions: TJ=125C. ([1], Section 5.8) πE 2.0 Ground Fixed Environment ([1], Section 5.10) πQ 10.0 Commercial Component ([1], Section 5.10) πL 1.0 Years in Production >= 2 ([1], Section 5.10) λp .3127 Failures/ Million hours MTTF 3.20E6 hours ~ 365.1 years

Justification / Assumptions TIP122 (Darlington NPN Expitaxial Transistor) Reliability Analysis λp = λbπTπAπQπE (Transistor Model) Parameter Value Justification / Assumptions λb .012 NPN, Si MOSFET ([1], Section 6.4) πT 5.1 Assumptions: TJ=125C. ([1], Section 6.4) πA 4.0 Power MOSFET, Assumption: PR = 6 V * 6 A = 30 W ([1], Section 6.4) πQ 8.0 Assumption: Plastic (worst case scenario) ([1], Section 6.4) πE 6.0 Ground Fixed Environment ([1], Section 6.4) λp 11.75 Failures/Million hours MTTF 8.51E4 hours ~ 9.7 years

MAX3232 Level Translator Reliability Analysis λp = (C1πT + C2πE)πQπL (Microcircuit Model) Parameter Value Justification / Assumptions C1 0.040 Linear MOS, 399 Transistor count ([1], Section 5.1) C2 0.072 16 Pin, Nonhermetic SMT Packaging ([1], Section 5.9) πT 0.98 Linear MOS Device Assumptions: TJ= 85C. ([1], Section 5.8) πE 2.0 Ground Fixed Environment ([1], Section 5.10) πQ 10.0 Commercial Component ([1], Section 5.10) πL 1.0 Years in Production >= 2 ([1], Section 5.10) λp 1.83 Failures/Million hours MTTF 5.46E5 hours ~ 62.3 years

Safety Analysis – FUNCTIONAL BLOCKS A. Microcontroller B. Sensors C. Fire Control D. Motor Control/Motor Driver E. User Interface F. Video G. RAM H. Power

F D E C A B H G

Levels of Criticality Criticality Failure Effect Maximum Probability Low Device stops functioning or is damaged, but reparable p ≥ 10-6 High Irreparable damage to the device and harm to user p ≤ 10-9

Failure No. Failure Mode Possible Causes Failure Effects Method of Detection Criticality Remark A1 MCU Failure Short of bypass caps Failure of MCU Unpredictability of MCU Dead MCU Human Damage Observation High Can be lethal to humans B1 Failure of friendly Detection Failure of IR Transmitter or Receiver Gun functions as if everything is enemy Friendlies get shot once motion sensor is tripped in auto-mode B2 Failure of Enemy Detection Failure of Motion Sensors Enemy not detected, user at harms way C1 Gun shoots unpredictably TIP122 failure MCU failure User harm Friendly can get shot even if IR remote works D2 Unpredictable motion of gun Failure of GAL Gun can move to friendly and shoot

Failure No. Failure Mode Possible Causes Failure Effects Method of Detection Criticality Remark D4 Unpredictable motion of camera Failure of driver Failure of GAL Video Alg run where the camera moves Enemy Evades Observation High E1 User Interface communication failure MAX3232 failure Shorted bypass Manual override failure H3 AC line failure Bad power splitting Shorted PCB Device will be irreparable

Questions?