Overview and update of LHCb Upgrade “Preamble” Excellent performance of current detector in hadronic environment demonstrated! excellent vertexing performance excellent mass resolution excellent particle identification high selectivity and low background very efficient trigger world best measurements in flavour physics and rare decays ΔACP=[-0.82± 0.21(stat)±0.11(sys)]% @HCP2011 Note: seminar today at 11:00 on First evidence of direct CP violation in D0K+K-,π+π- charm decays Why upgrading LHCb? LHCC Upgrade Session Dec 2011 Andreas Schopper

Global reconstruction High-Level Trigger ~3 kHz Level -0 L0 e, g 40 MHz ≤1 MHz had m Global reconstruction 30 kHz HLT1 HLT2 Inclusive selections m, m+track, mm, topological, charm, ϕ & Exclusive selections Storage: “nominal” event size ~35kB High pT track with non-zero Impact Parameter Why upgrading LHCb? main limitation of current detector: bandwidth & rate limitation of L0 trigger trigger yield for hadronic channels flattens out at L ~ 2-3∙1032 cm-2 s-1 (ET - cut!) nominal allows to accumulate ~1-1.5/fb per year ~5-7/fb in 5 years up to LS2 LHCC Upgrade Session Dec 2011 Andreas Schopper

LHC schedule LHCb upgrade Plan to continue Not yet approved! 2022 LS3 Installation of the HL-LHC hardware (accelerator and detector) LHCb upgrade Plan to continue until around 2030 Shown by Steve and by DG at EPS 2011 in Grenoble! LHCC Upgrade Session Dec 2011 Andreas Schopper

Upgrade of LHCb flexible software trigger with up to 40 MHz input rate and 20 kHz output rate run at ~ 5-10 times nominal LHCb luminosity → L ~ 1-2 ∙ 1033 cm-2 s-1 big gain in signal efficiency (up to x7 for hadron modes) upgrade electronics & DAQ architecture collect ≥ 5/fb per year and ~ 50/fb in 10 years LLT custom electronics CPU Event Filter Farm LHCC Upgrade Session Dec 2011 Andreas Schopper

Sensitivities to key quark flavour channels LHCb Upgrade LHCC Upgrade Session Dec 2011 Andreas Schopper

Common 40 MHz electronics architecture Front-end electronics: transmit data from every 25ns BX Current Readout Supervisor L0 Hardware Trigger HLT Upgrade Readout Supervisor Low-level Trigger HLT++ LHCC Upgrade Session Dec 2011 Andreas Schopper

Architecture Overview Tell40 board LHCC Upgrade Session Dec 2011 Andreas Schopper

Generic TELL40 board generic board covers all functionalities required by the timing, control, low level trigger and data acquisition first prototype to be fully tested by end 2012 LHCC Upgrade Session Dec 2011 Andreas Schopper

Detector upgrade to 40 MHz R/O VELO Si strips (replace all) Silicon Tracker Si strips (replace all) Outer Tracker Straw tubes (replace R/O) Muon MWPC (almost compatible) RICH HPDs (replace HPD & R/O) Calo PMTs (reduce PMT gain, replace R/O) LHCC Upgrade Session Dec 2011 Andreas Schopper

Detector upgrade to luminosity of 1-2 ∙ 1033 cm-2s-1 Main limitation: increased occupancy in Outer Tracker 2∙1032 cm-2s-1 at 25ns  μ = 0.4 10∙1032 cm-2s-1 at 25ns  μ = 2 Note: have been running already at μ~2.5 current geometry limiting to L ≤ 10∙1032 cm-2s-1 no safety margin OT IT LHCC Upgrade Session Dec 2011 Andreas Schopper

Detector upgrade to luminosity of 1-2 ∙ 1033 cm-2s-1 Two scenarios in LoI for new tracker geometry 10∙1032 cm-2s-1 at 25ns 20∙1032 cm-2s-1 at 25ns OT OT “IT+20 cm” “IT+30 cm” IT IT  designing detector to cope with 20∙1032 cm-2s-1 LHCC Upgrade Session Dec 2011 Andreas Schopper

Status of LHCb Upgrade submitted upgrade LOI to LHCC beginning of March: [CERN-LHCC-2011-001] physics case fully endorsed, 40 MHz architecture reviewed recommendation in June 2011 to proceed to “framework TDR” and detector TDRs now proceeding to TDRs in time for installing the detectors & electronics in 2018 Towards a “frame work TDR” ( “Addendum to the LoI”) in 2012 review status of possible technical options and R&D activities define sub-system milestones towards TDRs (in particular those for technical reviews to decide between options) provide cost estimate of upgrade for different options clarify and substantiate interest of collaborating institutes start discussion with LHCb funding representatives  “LHCb Upgrade Resource Board”, set-up by management/CB define splitting between common items and individual sub-system TDRs & MoUs LHCC Upgrade Session Dec 2011 Andreas Schopper

Organizational aspects LHCb Upgrade Organization The overall coordination is provided by the Upgrade Coordinator (Andreas Schopper) with the help of a Steering Panel, covering three domains: Tracker & Tracking – all tracking detectors: upgrade of VELO, TT, IT, OT, with two representatives, one focusing on technical issues (Massimiliano Ferro-Luzzi) and one on tracking performance (Stephanie Hansmann-Menzemer) Particle identification – both hadronic and leptonic, involving the upgrade of RICH&Torch, the Calorimeter and Muon systems (Guy Wilkinson) Data processing – the full chain, from detector readout to offline: upgrade of Front-End, TELL40, Trigger (LLT+HLT), data acquisition and computing (Renaud Le Gac) nb: The upgrade activities are driven by the current subprojects (no duplication of existing projects) and involve the Technical, Physics, Electronics, Simulation, etc. Coordinators to coordinate the upgrade effort in their domains. LHCC Upgrade Session Dec 2011 Andreas Schopper

Review of sub-system activities Review baseline upgrade with following criteria: detector is read out at 40 MHz HLT runs at a rate of at least 10 MHz sustain a instantaneous luminosity of L~2∙1033 cm-2s-1 with 25ns spacing sustain an integrated luminosity ~50/fb over 10 years detector ready for installation in 2018 (LS2) Detailed review of R&D activities and future plans in various workshops: 15-16 Sep. Tracker (OT, IT, TT) workshop 24-25 Oct. PID (RICH, calo, muon) workshop 2 Nov. Scintillating Fiber Tracker Meeting 09-10 Nov. VELO workshop 16-17 Nov. Data Processing workshop (FE, TELL40, DAQ, trigger, computing) 5 Dec. Simulation kick-off meeting a lot of progress in R&D, planning, declaration of interests by institutes, costing LHCC Upgrade Session Dec 2011 Andreas Schopper

Sub-System Milestones towards TDR Agreed on overall generic milestones, to be fine-tuned to specific sub-system: in 2018: installation 2016-17: quality control & acceptance tests 2014-16: tendering & serial production 2013: TDR & prototype validation 2012: technical review & choice of technology 2011-12: continue R&D towards technical choices End 2011: progress towards an “Addendum to the LoI” (in 2012) Early 2011: LoI (fully endorsed in June) timeline Several technical choices & decisions before TDRs VELO: pixel vs. strips Large IT (and shorter OT straw tubes) vs. fiber CT Optimized tracker geometry (# u,v,x planes OT, CT, IT, TT) Back-End R/O board (TELL40) technology (ATCA /backplane free) … few more info on these major ones…  identified also need for major simulation effort! LHCC Upgrade Session Dec 2011 Andreas Schopper

VELO options pixel detector: LOI pixel layout pixel detector: VELOPIX based on Timepix chip with 55 μm x 55 μm pixel size, advantageous for pattern recognition L-shaped half modules with two blocks of 6 chips several sensor options being investigated strip detector: based on proven design, but with reduced strip pitch and increased number of strip prototypes in production (Hamamatsu & Micron) same chip as other silicon strip detectors Layout of R and Ф strip sensor prototypes (every 5th strip plotted) LHCC Upgrade Session Dec 2011 Andreas Schopper

VELO challenges @ 40 MHz & 2 x 1033 New modules and FE electronics must be able to withstand radiation levels of ~ 370 MRad or 8 x 1015 neq/cm2 two options: pixels and strips capable of dealing with huge data rate Pixel: > 12 Gbit/s for hottest pixel chip Strip: on-chip zero suppression and CM algorithms New module cooling interface New RF foil All without sacrifices in material budget Number of tracks per event per chip for pixels  a lot of R&D ongoing with much progress in all areas per sensor for strips Strip sensors Pixel sensors LHCC Upgrade Session Dec 2011 Andreas Schopper

VELO module building activities R&D phase Construction phase Strips: Large, thin sensors: Handling, irradiation ASIC design Pixels: Chip Production Wafer Testing Metal deposition Wafer thinning and dicing Flip Chip assembly and probing Strips: Sensor QA ASIC production High density sensor wire bonding Pixels: Finalise ASIC Chip attachments to diamond heat spreader Items in common: R/O development for testing CVD diamond as support Hybridisation options Cooling within module Cooling integration Fast flex development Connectors Irradiation tests Sensor choice Items in common: Bonding and assembly jigs Common DAQ systems Cooling plane attachment Flex attachment Module wire bonding Quality Control Burn-in Conservative design: 55 um pixel pitch bump bonding is well established technology sensor and wafer thinning accomplished routinely for 10M ALICE pixel system  a lot of items in common LHCC Upgrade Session Dec 2011 Andreas Schopper

Tentative VELO milestones 2018: Installation 2017: Production, integration 2016: Production readiness reviews, module production launch 2015: readout chain prototype, module prototype, final FE chip early 2014: TDR end 2013: 12-chip demonstrator module 2013: decision on thermal management of module 2013: FE chip prototype pixel Chip => 2012: Timepix3, 2013: VELOpix strip Chip => 2012: ADC submission, 2013: 1st multichannel 2012: demonstrator module 0 LHCC Upgrade Session Dec 2011 Andreas Schopper

“Central Tracker” with 250 μm SciFi Tracker options “large-area Silicon Strip Inner Tracker” (with short OT straws) or “250 μm Scintillating Fiber Central Tracker”  OT: Straws “Central Tracker” with 250 μm SciFi OT: Straws “large area” IT with Silicon Strips  both compatible with 2*1033 luminosity LHCC Upgrade Session Dec 2011 Andreas Schopper

Light & large area IT with silicon strips OT: Straws light IT: Silicon Strips Current IT Tape Automated Bond Effort started strip chip design cooling proof of concept (air flow) received 10 sensors for testing TAB, module assembly, HV, etc. Light & large area IT light: reduce X/X0 ~ 2 large: increase area by ~ 3.3-4 : from 126x22(42)cm to 255x42(63)cm optimise station layout: now 3x(xuvx)=12 layers in-front of T3 to 2x(xuxvx)=10 layers behind T1 & T3 LHCC Upgrade Session Dec 2011 Andreas Schopper

Central Tracker (CT) made from 250μ fibers (Evolution of scintillating fiber Inner Tracker to Central Tracker) OT: Straws “Central Tracker” CT: Scintillating Fibers 5 layers of densely packed 250μm diameter fibers readout with 128-channel Silicon Photomultipliers (SiPM) 2×2.5m long fibers, readout on top and at bottom of stations Advantages: only sensitive material in acceptance (no cables, no cooling, ...) uniformity in material distribution 50-60 μm resolution (to be demonstrated with test beam data) LHCC Upgrade Session Dec 2011 Andreas Schopper

Central Tracker (CT) Challenges: long fibers => multiple hits per channel (occupancy)  in principle not a problem with existing tracking strategy (to be demonstrated with simulation data) building and alignment of 2.5m-long modules develop, test, and produce front-end electronics in tight schedule SiPM radiation hardness => shielding & cooling needed a lot of R&D ongoing in all areas SiPM investigations: integrated neutron flux at the level of ~1012/cm2 various studies showed significant deterioration at ~1011/cm2 radiation tolerance is actively studied: in situ SiPM samples with and without shielding irradiation with neutrons and with protons testing effect of shielding (Polyethylene, Cd, Pb) testing effect of cooling solution is taking shape, as a combination of: improved technology (with manufacturer) shielding (factor ~2) active cooling of SiPM (factor 2 every 8-10°C) ...and S/N performance as function of accumulated dose LHCC Upgrade Session Dec 2011 Andreas Schopper

Tentative milestones Central Tracker (CT) LHCC Upgrade Session Dec 2011 Andreas Schopper

Declaration of Interests, Common Projects and Cost Interests for participation to sub-systems, as declared at the upgrade workshops: Common Projects (still evolving!) Baseline upgrade: detector R/O at 40 MHz L ~ 2∙1033 cm-2 s-1 ; 25ns HLT at ≥ 10 MHz rate Total re-estimated investment cost  ~ 52 MCHF (does not include R&D and MP) Common Fund part  ~ 30% (= investment to Common Projects) First “LHCb Upgrade Resources Board” took place to discuss manpower and funding situation For the R&D phase manpower is an issue in particular for simulation and Common Projects New Collaborators welcome to join LHCb upgrade effort! LHCC Upgrade Session Dec 2011 Andreas Schopper

Conclusions LHCb is planning to upgrade to 40 MHz R/O and for a luminosity of up to L ~ 2∙1033 cm-2 s-1 for installation in LS2 (2018) LoI endorsed  aiming at addendum to LoI in 2012 detector TDRs in ~2013 reviewing and monitoring progress in the various R&D activities, simulation efforts, planning and cost clarifying interests by collaborating institutes and funding Requirements to the LHC IP8 to be compatible with HL-LHC after LS3 (shielding!?) 25 ns bunch spacing essential (pile-up!) keep possibility of swapping B-field (systematic errors!) LHCC Upgrade Session Dec 2011 Andreas Schopper

Spare slides LHCC Upgrade Session Dec 2011 Andreas Schopper

LHCC Upgrade Session Dec 2011 Andreas Schopper

LHCC Upgrade Session Dec 2011 Andreas Schopper

LHCC Upgrade Session Dec 2011 Andreas Schopper

LHCC Upgrade Session Dec 2011 Andreas Schopper

TORCH Time Of internally Reflected CHerenkov light TORCH could provide positive identification of kaons up to p ~ 10 GeV/c and beyond Cherenkov light production is prompt → use quartz as source of fast signal ~ 70 ps resolution required per detected photon Focusing element currently designed around commercial micro-channel plate (MCP) device: the Planacon [Burle/Photonis] available in 1024-channel (32×32) version R&D on photodetector performance progressing well Excellent timing resolution achieved for single photons using Planacon: σ(t) = 47 ps (single-channel readout) LHCC Upgrade Session Dec 2011 Andreas Schopper

LHCC Upgrade Session Dec 2011 Andreas Schopper