EFW DFB Systems Assurance Trent Taylor LASP

DFB LASP QA Organization LASP Engineering Director Configuration Management LASP Flight Assurance Manager Quality Assurance Engineer Quality Assurance Build Configuration Verification Safety Inspections Personnel Safety PMPCB, FRB, MRB Flight Hardware Safety Documentation and Records ESD Control Training and Certification Contamination Control Support Flight H/W & S/W Testing Lab Inspections

DFB PA Requirements and Safety Performance Assurance Matrix Status No open issues No waiver/deviation requests to date System Safety LASP provided initial safety input with CDRL MA-006 for PDR. There are no safety compliance issues with the EFW DFBs. LASP will provide any further safety input upon request.

DFB Suppliers and GIDEP LASP procures all flight parts and materials through vendors on LASP’s approved vendor list. LASP procures EEE parts directly from the manufacturer or through authorized distributors. LASP requires full traceability on all flight procurements. Program requirements are flowed through procurement documentation. Where necessary, procurement documentation may include source control documents (SCDs) and engineering documentation. LASP’s DFB contains no custom or non-standard EEE parts. LASP’s DFB procurements required no additions to the LASP approved vendor list. GIDEP Status LASP has responded to APL GIDEP evaluation requests meeting all delivery dates. There are no current GIDEP “hits” – no parts on the DFB are impacted by any Alert or Advisory.

Radiation Engineering Approval Screening/Qual Approval DFB EEE Parts Parts All EEE parts are procured to program requirements with no additional screening required with the exception of the following: JANTXV cavity devices (3 part types): GSFC will PIND test these parts. AD648/883B (OpAmp): GSFC will screen and qualify to EEE-INST-002 Level 2. No additional radiation testing is required. OP262GS (dual Op Amp - Plastic COTS). Parts were radiation tested by APL. GSFC will screen and qualify to EEE-INST-001 requirements. VTF100-267TBX (Resistor Network – COTS): GSFC will screen and qualify to EEE-INST-002 Level 2. Parts CE Approval Radiation Engineering Approval Screening/Qual Approval PMPCB Approval TOTAL EEE Parts 63 Detectors ASICs Hybrids 2

DFB Materials & Processes Materials and Processes MIL is up-to-date Regular meetings with PMPCB Will add PWB data when ordered (will be per required IPC specs) Limited Life Items DFB has no limited life items M&P Category Submitted Approved Pending Non-Metallic Materials 13 12 1 Metallic Materials 2 Fasteners 5 4 Processes

DFB Configuration Management LASP uses Agile software for Configuration Management Documents submitted, reviewed, and approved electronically All documents and records are searchable As-built records and as-run test procedures archived Follow LASP’s Document & Record Control Procedure Assembly Travelers (ATs) generated and archived in the system Flight Drawing/Document Status Drawings Release Date Documents Schematic 9/18/09 DFB Spec Released Rev D Layout FPGA Spec Draft 10/01/09, Prelim 12/01/09, Final 02/01/10 Fab, Assembly Instructions 10/01/09 Test Plan Prelim 10/01/09, Final 12/01/09 Test Results 1st Qtr ‘10

DFB Contamination & ESD Control Contamination Control All assembly performed at laminar flow-benches Class 10,000 cleanrooms available Packaging and shipping provisions to maintain low contamination exposure during transport ESD Control QA owns and implements the ESD control program LASP’s ESD Control Procedure meets ANSI/ESD S20.20 requirements All applicable personnel trained and certified by LASP’s NASA-trained Level B instructor Training certifications required for lab entry

DFB Inspections Mandatory Inspection Points and photo documentation specified in Fabrication & Assembly Instructions (FAIs) within ATs Plans to be worked out with APL for their MIPs Audit Assembly Traveler data package at each inspection point Check sign-offs, traceability, document revisions, etc. Verify acceptable lab temperature and humidity PWAs Inspect solder workmanship to NASA-STD-8739.2 and .3 Parts placement and orientation – per engineering drawings and FAIs Polymerics Inspect per NASA-STD-8739.1, FAIs, drawings, and in-house standards Check mix records, durometer hardness of cure samples Cables, Harnesses, Wiring Inspect crimps, solder and other workmanship to NASA standards Dimensions, shield terminations, shrink sleeve, etc. to FAIs, drawings, etc. Other Inspections Incoming/Receiving; Kitting; Pre-cap; Calibration of Equipment; Acceptance and Environmental Test Set-up; Flight Connector Safe-to-Mate

DFB Non-Conformance Reporting Non-conformances addressed per LASP’s Anomaly Reporting Plan Reporting Methods - Fabrication and Assembly Discrepancy Report (FADR) For rework-type non-conformances identified during fabrication/assembly - Non-Conformance Report (NCR) Level 1 NCR- for minor discrepancies Level 2 NCR- for test failures or any other anomaly that the Integrated Project Development Team (IPDT) determines to warrant Level 2. - Dispositions include: scrap, rework, return to supplier, refer to MRB Processing of Level 2 NCRs is consistent with standard Failure Review Board (FRB) practices. - Material Review Board (MRB) report Dispositions include: scrap, rework, return to supplier, repair by standard or non-standard procedures, use as-is, request for waiver

DFB Material Review Board (MRB) Process The LASP MRB will be chaired by the Project Manager or designee, and will at a minimum include QA and cognizant lead engineer(s) for MRB actions resulting in Class 2 changes. JHU/APL participation is required when MRB recommendation is to use as-is, repair, or causes a Class I change. A Class 1 change is defined as one that may, or will, result in a product that: Does not meet established functional or performance specifications Does not meet established physical envelope and/or ICDs Does not meet the established electrical ICDs Significantly and adversely affects cost and/or schedule Requires repairs other than approved standard repairs Will not meet structural, thermal, EMI/EMC, and/or ionizing radiation requirements Class 2 changes are those that do not fall within the parameters of a Class 1 change. Any condition requiring MRB action will be documented as a non-conformance.

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