AIDA-2020 1st annual meeting DESY, 27/01/2016 Activities in Task 14.3.1 Test infrastructure for innovative calorimeters with semiconductor readout Vincent Boudry École polytechnique, Palaiseau on behalf of the WP14.3.1 task participants AIDA-2020 1st annual meeting DESY, 27/01/2016 Part I TNA support + WP14

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Task 14.3 Test infrastructure for innovative calorimeters with semiconductor readout (CERN, CNRS- LLR, CNRS-LPNHE, CNRS-LAL, DESY, TAU, AGH-UST) Assembly and QA chain for silicon-based Ecals Development of an assembly line for highly granular calorimeters with semiconductor readout Test benches for individual silicon wafers and PCB for quality assurance and to study alternatives Development of a test station to determine signal characteristics in highly irradiated silicon sensors Validation of a compact calorimeter prototype including flexible precision mechanics and readout Calorimeters with pixelated Si wafers allow for an excellent particle separation. After an extensive R&D activity supported by EUDET and AIDA, the next step is the development of tools for construction and quality assurance of large-scale prototypes for an ILC-like detector. This starts with the production of test benches for Si wafers and interface boards. These components are glued together into a detection unit of the order of 20×20 cm² using a robotic system. Up to 10 units will be assembled into detector layers using automated tools. Such a calorimeter could be also a viable option in a hadron collider environment, such as CMS. A dedicated test set-up is needed to test the signal characteristics of irradiated Si wafers operated at temperature at or below -35 degrees C. This talk Marcello Marek Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Document for MS14 Slightly late Proof reading by WP coordinators → SC coordinator Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

SLAB Assembly: full chain Copper (cooling) Shielding R&D for “mass production” and QA Quality tests & preparation of large production Modularity → ASU & SLABs Choice of square wafers (≠ from hex: SiD, CMS HGCAL) Numbers (RECAL = 1,8 m, |ZEndcaps|=2,35m) (likely to be reduced by 30–40%) Barrel modules: 40 (as of today all identical) Endcap Modules: 24 (3 types) Slabs = 6000 (B) + 3600 (EC) = 9600 many ≠ lengths ASUs = ~75,000 Wafers ~ 300,000 (2500 m²) VFE chips ~ 1,200,000 Channels: 77Mch PCB (FeV) ASU Wafer (4) Adapter board (SMB) Carbon+W U layout of a short slab Now we have 10 ! U layout of a long slab Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Full assembly chain resp: R. Cornat + L. Lavergne ⚠ Simplified view ⚠ Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

PCB Metrology by D. Lacour Development of an automatic process using a coordinate measuring machine (tri-dim machine) Before cabling : Squaring, Parallel edges , Size Thickness (flatness in depression) Flatness After cabling : flatness and thickness Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 PCB Metrology results 40 PCB controlled Criteria (measurements before cabling) Planarity tol.0.4 mm Size : 180.20 to 180.30 mm Thickness: 1.55 to 1.70 mm Squaring: tol. 0.05 mm Edge parallelism tol.0.05 mm Rejection yield : ~40% (essentially due to a too large size for alveola) Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

ASU Setup“4 wafers without glue” Mickael Frotin @ Annecy  The goal: 2.0 – Setup option with support of test electric probes for connecting WAFER to FEV - Realize an assembly with removable wafer in order to acquire cosmic data. This assembly will test the entire acquisition chain (Wafer-FEV-SMBV4-DIF-GDCC-CCC-PC-Software) before the wafer gluing operation. The first test was realized last week Hv Kapton WAFER FEV SMBV4 Dif Mechanical support for 1024 Test Probes PCB shielding Thanks to Marc Louzir Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Test plates: noise reconstruction With single glued ASU: Noise determination Prelimary cosmics measurements → Testbeam measurement Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Measurement and Gluing Test Bench Several test with fake (glass ASU) 10 ASU glued and in test Quality procedure to be consolidated Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

First step : one wafer glued per PCB The parameters of the gluing robot have been optimized to glue a silicon sensor (18×18 pads) on a PCB Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Second step : 4 wafers per PCB Deposit of glue on the PCB 256 × 4 = 1024 dots Move the plate with the 4 wafers on the PCB The alignment is fundamental : PCB = 180.3 mm maximum Wafer = 90 mm Possible improvement: optical measurement of planarity Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Electrical tests results Measurement after gluing onto the PCB 10 ASU tested, all functional (no short cut). I(V) measurement for each wafer before gluing – leakage current 150 nA @ 200 volts ASU 23 33 34 42 I total (µA)@140V 1.9 11 15 5 Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Assembly of SiW ECAL layers (LAL) ~ 13 steps for assembly, 8 élements! Tests done: Soldering: ✔ Electrical test: ✔ Readout test: ✔ 10 Slabs produced and tested QA procedure to be consolidated Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Production of SLAB’s Prod between LLR + LPNHE + LAL Supervision done by Rémi Cornat → production for next TB ~3 batches of production All critical material available (ASIC’s, Wafers) ~Now August Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Beam Tests Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Beam test at CERN 2015 2–16th of November Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

CERN 2015: Running conditions & program Masking : 2.2% of all channels in TRIGGER only Muon beam spots (X-Y distribution of N triggers, requiring ADC-pedestal>10) from typical muon run (361 as example) DAQ & config: very smooth (1 single crash due to unchecked physicist scripting) Adjust threshold by progressive noisy cell masking Many data taken (but “only” ~85 GB) Beam structure + ACQ for ILC (bursts of 50 ms × 4Hz) Muons runs Calibration first @ high threshold variation of threshold, and angles (49°, 90°) Electrons of 15, 30, 50, 100, 150 GeV with 8.5 X0 with mini-cal option this WE Pions of 50 and 150 GeV with 1.75 λ Check non unconventional events Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 CERN 2015: Analyses 1st : verification of behaviour with simple events SK2 response ⇐ was a priority for SK2A prod Filtering Noise and establishing clean events 2nd : check of collective response Correlation between plates Modelling of shower response G4 MC being written by A. Psallidas (National Taiwan University, CMS) Examples given here analyses from V. Balagura, K. Shpak First analysis of efficiency Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 CERN 2015: Annoyances Good news !!! Re-triggering! Masking verification: some issues Data corruption in case readout time wasn’t sufficient corrected by DAQ settings Negative signal (ADC=4) located near the DIF connectors Pedestal stability Slow drift after power-on on long period Spilt and delayed triggers “High intensity” signal delays trigger Chip full events Non-operationnal chips if SCA=15 in ACQ-1 Pedestal width: S(MIP) / RMS(pedestal) =17..18. Good even for short spills with “real” power pulsing and drift effects For 100M ch ECAL, with a Thr @ mip/3 = 5–6 σ ⇒ p(noise/cell) = 6×10-7–2×10-9 ⇔ 60–0.2 hits/BX Most corrected in SK2A Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Efficiency from tracks (prelim.) by V. Balagura Space Using tracks extrapolation from 2 planes onto the 3rd one very clean samples of tracks 1 hit/ layer adc-ped > 40. no constrain on studied layer Time : BX±1 Track maps (layer 3) Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Efficiency map of triggering on mips (prelim.) by V. Balagura ε vs ch per chip ε vs Memory (SCA) ~ Time ⟨ε⟩CHIP> 97%; ⟨ε⟩LAYER ≥ 98.3 % Single inefficient chip (in 48) Small dependence (also in pedestals) but for faulty chip – High mip detection efficiency – mandatory for PFA – is reached – Low fraction of non-triggering zone (~2%) + 2% as faulty chip. – Re-triggering occurrence in BX±1 ≤0.5% Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

OMEGA SKIROC2A by S. Callier, C. de la Taille 400 SK2A chips delivered. Power OK Production possible through CMS-HGCAL collaboration Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 BT in 2016 and beyond Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Beam test June 2016, 7–22 preparation by R. Cornat, F. Magniette, J. Nanni Real calorimetric tests with 10 SLAB’s in coordination with SDHCAL 10 slabs (no more test plates) 3 JIT + 1 repaired but 1 lost due to a brutal general power cut @ CERN expected improved S/N ratio, robustness Flexible structure to accommodate variable number of SLAB’s be in “real conditions” for PFA tests: 24 X0 of W + 3 7 cm gap before SDHCAL Goals: ⇒ Instrumental characterisation of SLABs ⇒ test of PFA tools R. Cornat Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

Commissioning by R. Cornat, F. Magniette, J. Nanni Beam ≥ 10/06 but Power Cut on 11/06 → damages SDHCAL (5 layers) + ECAL (1 slab) DAQ running in common with SDHCAL (SC, spill, Control) Synchronous data storage ✔ Data Exchange unstable ✘ (for online) Commissioning Noise scan (High Gain) → threshold high (270 ~ 85% mpv)! Noise issue tracked to limited PS on Sunday (+effect of power cut ?) Plans: Strengthen PS ✔ update DAQ for exchange (today) Common Runs 16–22... Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016

WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016 Conclusions Production of 2 small batches well on tracks 10 slabs working! (but for CERN PS) Some procedural defects corrected Spin-off for ATLAS HGTD 3×3 mm³ pads gluing Quality procedure to be consolidated (e.g. centralized) SiW-ECAL detector units: Fine at low E (mips) Some issues with ASICs ⇒ to be corrected in next version High Energy behaviour to be tested. Activity on time... MS report almost through (~2M late) Vincent.Boudry@in2p3.fr WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016