Development of the CMS Silicon Strip Tracker Readout

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Presentation transcript:

Development of the CMS Silicon Strip Tracker Readout Matthew Noy Imperial College London 7th April 2004, IOP, Birmingham

Introduction LHC: CERN, Geneva. CMS: To replace LEP (same tunnel) starts ~2007 14 TeV P-P collisions (+ HI programme) Design L ~ 1034 cm-2s-1 Bunch Crossing ~40MHz CMS: 1 of 2 General Purpose detectors Solonoidal design, v. dense 12kTonnes Largest superconducting magnet L~21m, D~14m Higgs, SUSY, others

Silicon Microstrip Tracker Cylindrical volume of ~25m3 is instrumented ~210m2 of Si 107 Si Microstrip Channels length 5.4m, Diameter 2.4m Analogue readout No L1A decision involvement On detector analogue buffering APV25 (IC/RAL col.) Expected rate ~100kHz ~80000 Analogue Optical readout links Harsh environment Operates in 4T magnetic field Expected 10MRads integrated over lifetime Everything on-detector is rad-hard

Control and Readout Architecture Generic 40MHz Occupancy ~ few % Total noise < 2000e- Control Token ring arch. Timing ~ 1ns (indv. ch.) I2C on detector control L1A ~ 100kHz Readout 40MSs-1 ~ 3GBs-1FED-1 Serialised: 256:1 Undersampling Zero Suppression etc. On detector (rad.) 100m Off detector (non-rad.)

FED Architecture/Interfaces 9U VME64x Form Factor VME module / Configuration Modularity matches Opto Links 8 x Front-End “modules” 96 channels in tot. OptoRx/Digitisation/Cluster Finding Back-End module / Event Builder Power module Other Interfaces: TTC : Clk / L1 / BX DAQ : Fast Readout Link TCS : Busy & Throttle JTAG : Test & Configuration VME-FPGA TTCrx BE-FPGA Event Builder Buffers FPGA Configuration Compact Flash Power DC-DC DAQ Interface 12 Front-End Modules x 8 Double-sided board CERN Opto- Rx Analogue/Digital 96 Tracker Opto Fibres VME FE-FPGA Cluster Finder TTC TCS Temp Monitor JTAG TCS : Trigger Control System 9U VME64x Xilinx Virtex-II FPGA

First FED Prototype (01/03) “Primary” Side OptoRx CFlash VME64x 9U board 34 x FPGAs Analogue TTC FE Unit Power Memories 96 channels JTAG

CMS Tracker FED Zoom in on FE Unit OpAmps Dual ADCs Rsense = 100 Ohm Delay FPGAs “OptoRx” Resistor Packs Test Connector Microstrip Tracker readout System overview All Silicon Tracker Redaout chain: Detectors->APV->Optical link->FED->DAQ L1 rate sustained 100kHz Subject of this talk is Front End Driver card, refer to as FED Optoreceivers, ADC, Digital processing-sparsification, Memory -> DAQ Better if called Front-End Receiver card! APV and Optical links nearly ready for production Final FED still at design stage PMC prototype used in LHC beam tests this year. Refer to related talks: Geoff APV25 Francois Optical link - FED optoreceivers Nancy prototype system in LHC beam test- controls Attila Trigger Throttle system Danek Pixel Vertex detector = different readout system TrimDAC “Primary” Side Front-End Unit = 12 channels “OptoRx” modules CERN project Commercial Package with PIN Diode + Custom Analogue ASIC

FED Collaboration IC responsibilities RAL responsibilities Modelling Design/Layout Complex analogue sec. Firmware Provide/test functionality Low level software Closely linked to firmware Abstraction to middle UI Brunel responsibilities software IC responsibilities Modelling Design sufficient? Performance Does it do what we need? Software Online interfaces Test benches Internal/Fed Tester

Development and Testing I Design Verification Hardware (Hw) Performance Permits firmware Has required interfaces Firmware (Fw) Provides functionality Respects interfaces Stable Software (Sw) Robust Efficient Abstracts complexity to user interface Interfaces/respects online environment Nearly there… FED in use Pisa, CERN (now), Lyon (after Easter) Beam Test (25ns) June and Oct. 04. LHC-like conds.

Timing Functionality (M. Noy) Timing control crucial Time-of-flight delays Fibre propagation differences Undersampling readout Careful choice of sampling point Xilinx Virtex II FPGA DCM Implementation of clock skewing 96 independent ADC clock points 32 fine steps of ~ 800 psec

Development and Testing II Need ~500 Have seen failures Problem for similar ATLAS boards BGA Soldering problems (batch 10.03) Overcome with latest batch (03.04) Produced in industry JTAG B.S. amongst others. Internal/Self Testing (M. Noy) Significant software task Development of robust algorithms Abstract complexity Simple interface Pass/Fail decision Provides Rapid, accurate feedback to assembly co. Identification of: Assembly mistakes Component failures

Summary Production In Use FED card Begin 2005 Hw, Fw, Sw First off detector electronics 9U VME form 96 ADC ch, ~3GBs-1 V. dense analogue sec. 36 FPGAs (big, complex) Hw, Fw, Sw High degree of development,testing required, and done Robust, stable, nearly full functionality Performant Production Begin 2005 We will be ready. In Use CERN, Pisa (now) Lyon (soon) Beam Test June, Oct. 04.