ALD for Industry Workshop Opportunities, Challenges and Solutions for ALD Encapsulation in Flexible Electronics Applications Dr. Mikko Söderlund ALD for Industry Workshop 18.1.2017, Dresden, Germany

ALD for Industry, Dresden 17.-18.1.2017 Home of ALD Beneq has three main business areas: Development & Coating Services Thin film equipment Electroluminescent displays Thin film expertise is the common denominator of everything we do. The Beneq factory is where atomic layer deposition was applied in industrial production for the first time. It is the largest ALD-dedicated production facility in the world. Over 30 years of thin film experience is at your service. Beneq is 120 people strong 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

ALD for Industry, Dresden 17.-18.1.2017 One stop for all ALD Coating Services Development Services Industrial Equipment Customer Services Research 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

Beneq equipment platforms TFS 200 & T2S Up to 8’’ wafers Automation & low particle 20 wafer/h @ 50 nm TFS 500 Batch ALD Up to 300 x 420 mm P400A/P800 Large batch ALD Up to 250 L chambers e.g. 300 wafers/PCBs/frames R11 Rotary spatial ALD Plasma enhanced 1 µm (SiO2)/hour WCS 600 Roll-to-Roll ALD (spatial) 500 mm wide web 1 m/min 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

Flexible electronics FEATURES: new designs & form factors Source: Hanergy Source: Samsung Source: Plastic Logic FEATURES: new designs & form factors no glass –> unbreakable conformal/bendable/rollable... ultra-light weigth & flat edgeless Source: FlexEnable Source: LG Source: Microsoft Source: BMW Source: Konica Minolta Source: Samsung 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

Flexible encapsulation approaches Type Barrier component Deposition method Thickness Glass Borosilicate Frit sealing + dessicant <200 µm Inorg./org. Multilayer Al2O3 CVD 3-5 µm Inorganic SiNx PECVD <1 µm ALD 10-30 nm Flexible glass does not apprear to be a robust solution Commercial inorg./org. multilayer requires thick stack, sells for a prohibitively high price PECVD + organic currently applied, but not flexible enough ALD value proposition: ultra-thin, flexible and low cost of ownership 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

ALD barrier WVTR and Flexiblity ALD metal oxide barrrier on a low-cost PET film *D.C. Miller et al, J Appl. Phys. 105, 093527, 2009. WVTR ≤ 10-4 g/(m2 day) @ 10 nm, critical curvature radius in mm’s 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

Size and form factor challenge Source: AUO Requirement (Industrial) Sheet format Roll format Scalability Gen 5.5 (Gen 8.5) Up to 1600 mm Productivity 1-2 min TACT ≥0.5 m/min Mean-time-to-clean ≥ two weeks Process monitoring In-line (by sheet) Continuous +high uptime, low particle, low CoO, system integration... Very difficult to map these requirements onto pulsed ALD aproach 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

Spatial ALD method as enabler 1. Throughput: 10-100 faster ALD cycle By rapid substrate translation 1-15 seconds < 1 second 3. Insitu monitoring possibilities + Thickness measurement (inline/in-head) + Accurate MFC control of precursor feed + Exhaust monitoring by RGA 2. Scale-up in size +Injector scales modularly in width & length +high uniformity in ”machine/movement direction” -> focus on transverse injector design Spatially separated precursor ”zones” Continuous (not pulsed) flows through injector Gap control 4. Low maintenance requirement + only the substrate ”sees” the two precursors + no parasitic deposition in chamber 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

ALD for Industry, Dresden 17.-18.1.2017 WCS 600 roll-to-roll ALD Ultra-barrier film deposition on flexible substrates (e.g. PET) Web width 500 mm Uniform coating along & across MD: < 1%, across < 5% WVTR <10-4 g/(m2 day) on PEN, with 20 nm Al2O3 @ 0.5 m/min demonstrated reproducibly Very low maintenance req. First maintenance check after 2 years of operation & 450 runs Total ~85 µm of deposited Al2O3 No/low parasitic coating Very attractive CoO e.g. for flexible PV applications WCS 600 at CPI, Sedgefield, UK 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

SCS 1000 sheet-by-sheet ALD Fast sheet-based spatial ALD system for direct encapsulation Substrate size 1500 x 640 mm Effective coating area equal to Gen2.5 (400 x 500 mm) Non-uniformity < 4 % Al2O3) Al2O3 deposition speed up to 21 m/min demonstrated 50 nm Al2O3 deposition takes roughly 6 minutes Again, low maintenance reqmt. Inline monitoring capability Optical reflectance meas. Maps very well to flexible AMOLED manufacturing reqmts. 2.6 m 1.1 m 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

ALD for Industry, Dresden 17.-18.1.2017 Summary Flexible electronics market drives a transition from glass to polymer-based devices Opportunity for ALD, especially for low temperature processes Thin-film encapsulation is the driving application Challenging to map the mass production requirements onto conventional pulsed ALD method Trade-off between speed / quality / maintainability Spatial ALD is disruptive method, enabling simultaneously High depostion rate Scalability In-situ monitoring Low maintenance Beneq WCS 600, SCS 1000 and R11 spatial ALD systems are at the forefront of this exciting transition 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017

ALD for Industry, Dresden 17.-18.1.2017 Thank you! 18.1.2017 ALD for Industry, Dresden 17.-18.1.2017