Introduce PCB Products of KC

Content 1.Introduction 2.Thin board PCB 3. FPCB board 4. Tab PCB 5.High frequency PCB 6.HDI PCB 7.BIB PCB 8. POV PCB 9. Metal Core PCB 10.Technology Roadmap 改成立體層次的感覺

Introduction Establishment August,1990 Capital US$ 5,000,000 Estate 2,500 sq meter Plant Area 3,600 sq meter Employees 250

Thin Board PCB Material : FR-4 Mid Tg Layer : 2 L Board Thickness : 0.127 +/-0.01mm Line: Width/Space : 3/3.5 mil Surface Finish ﹕Ni/120u” ,Au 5u” Application: Memory card

FPCB Material : FCCL Layer : 2L PNL size:11.85 X 19.8 MM Cu thickness: 1oz Board Thickness : 0.16 mm Impedance control: 100+/-5ohm Surface Finish ﹕ENIG Application: High Speed Connector C side S side

FPCB Material : FCCL Layer : 3L PNL size:1.6X 3.9 MM Cu thickness: 1oz Board Thickness : 0.22 mm SF-PC5000 paste x2 G/F Stiffener x2 Surface Finish ﹕ENIG Application: Communication C side S side

Tab PCB Material : FPC or FR-4 halogen free material Layer : 1 L Board Thickness : 0.05~0.127 mm Pcs Size: about 1.11x 1.5 mm Surface Finish ﹕Ni/100u” ,Au 2u” Application: Hearing instrument , Audiphones

Hi Frequency PCB Material : Nelco N4000-13 si Layer : 6 L Board Thickness : 1 +/-0.1mm Line: Width/Space : 5/5 mil Surface Finish ﹕Ni/120u” ,Au 2u” G/F : Selective Au plating 30u” Blind via for L12 and L56, Buried via for L13 and L46 Impedance control: 100+/-5ohm Application: Hi frequency connector

Hi Frequency PCB Material : Rogers 4350 & FR4 Rogers material 4350 L12 and L23 Layer : 6L Board Thickness : 2.0+/-0.15mm Surface Finish ﹕Ni/120u” ,Au 2u” Blind via for L12 Impedance control: 50+/-2.5ohm Application: Hi frequency test board

HDI PCB Material : FR-4 Hi Tg Layer : 4 L Board Thickness : 0.7 +/-0.01mm Line: Width/Space : 7.87/7.87 mil Surface Finish ﹕Ni/120u” ,Au 2u” Blind via for L12 and L34, Buried via for L23 Application: DC Power supply

Burn In Board PCB Material : FR5 Layer : 10L Board Thickness : 1.6 +/-0.16mm Line: Width/Space : 5/5 mil Surface Finish ﹕Ni/120u” ,Au 2u” G/F : Au plating 35u” Drill pitch:0.65 mm Application: Burn In Board

Burn In Board PCB Material : NP175 Layer : 8 L Board Thickness : 1.6 +/-0.16mm Line: Width/Space : 5/5 mil Surface Finish ﹕Ni/120u” ,Au 2u” G/F : Au plating 35u” Drill pitch:0.5 mm Application: Burn In Board

POV (Pad On Via) PCB Material : FR4 Layer : 4 L Board Thickness : 0.8 +/-0.08mm Line: Width/Space : 4/4mil Surface Finish ﹕Ni/120u” ,Au 3u” Application: GPS

Metal Core PCB Material : Metal Core PCB Layer : 1L PNL size:18.11 x 20.65 inch Cu thickness: 1oz Board Thickness : 3.2 mm Thermal conductivity:3 W / mk Surface Finish ﹕Ni/120u” ,Au 2u” Application: Lighting

Metal Core PCB Material : Metal Core PCB Layer : 1L PNL size:3.38 x 4.40 inch Cu thickness: 1oz Board Thickness : 1.0 mm Thermal conductivity:3 W / mk Surface Finish ﹕OSP Application: Lighting