Pico-second TDC Schedule & Production

schedule We are ~1 year late compared to initial schedule Underestimated 130nm -> 65nm technology mapping Timing problems in high speed time decoder: 2.56GHz -> 1.28GHz Pico-second time resolution not easy ( PLL jitter, DLL mismatch, timing distribution, power supply noise, etc.) Additional features Did not get expected student to help on configuration/test (Engineer trainee will come from ~June to help with testing) Prototype submission: April 2017 Initial bare die test: June – July At CERN only to verify chip is alive Packaging of 50-100 chips: Aug. – Sep. 2017 Testing of packaged chips: Oct. – Dec. 2017 At CERN plus selected users Possible design corrections: Jan. – Feb. 2018 Production submission: March 2018 Production chip test/verification: May 2018 Production testing: June – August 2018 Chips available on quantity: Sep, 2018

PicoTDC users and quantities Project Test chips Final quantity Certainty 0 - 10 CBM 5 2100 9 SuperFRS 5 (CBM) 100 Crispin ? CAEN 1000 - 2000 LHCb Torch 1600 6 MPD/NICA 150 IHEP CMS-TOTEM PPS <10 CMS timing layer 50 ? 10000 4 ? ATLAS forward proton 20 10 Other ? (RD51, ?) Total <100 (200) 3k – 20k

Production scenarios Masks, engineering run and packaging are dominating costs Si costs: 12inch wafer (5k$) = 2-3k working PicoTDCs Dedicated MLM engineering run + packaging: ~600k 3k chips: 600k/3k = 200CHF/chip 20k chips: (600k+200k)/20k = 40CHF/chip Shared MLM engineering run + packaging: 350k 3k chips: 350k/3k = 120CHF/chip 20k chips: (350k+200k)/20k = 30CHF/chip Realistic scenario: 10k chips Shared MLM engineering run: 350k Packaging + etc.: 150k Cost: (500kCHF/10k): 50CHF/chip (if we can only sell half of these then 100CHF/chip) ~1-2 CHF per channel There will obviously be a modulation of price according to volume, scientific or commercial, CERN or non-CERN use.