Date of download: 10/15/2017 Copyright © ASME. All rights reserved. From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes J. Electron. Packag. 2013;136(1):011003-011003-7. doi:10.1115/1.4025915 Figure Legend: Reflow temperature profile

Date of download: 10/15/2017 Copyright © ASME. All rights reserved. From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes J. Electron. Packag. 2013;136(1):011003-011003-7. doi:10.1115/1.4025915 Figure Legend: Interface analysis of the SnCuNi IMC: (a) Sn0.7Cu1.0Ni + OSP [9] and (b) Sn0.7Cu + EING

Date of download: 10/15/2017 Copyright © ASME. All rights reserved. From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes J. Electron. Packag. 2013;136(1):011003-011003-7. doi:10.1115/1.4025915 Figure Legend: IMC Growth of SnCuNi subject to thermal aging: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

Date of download: 10/15/2017 Copyright © ASME. All rights reserved. From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes J. Electron. Packag. 2013;136(1):011003-011003-7. doi:10.1115/1.4025915 Figure Legend: Typical failure modes of ball pull test

Date of download: 10/15/2017 Copyright © ASME. All rights reserved. From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes J. Electron. Packag. 2013;136(1):011003-011003-7. doi:10.1115/1.4025915 Figure Legend: Ball pull test results: (a) Sn0.7Cu0.05Ni + OSP [9], (b) Sn0.7Cu1.0Ni + OSP [9], and (c) Sn0.7Cu + ENIG

Date of download: 10/15/2017 Copyright © ASME. All rights reserved. From: Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes J. Electron. Packag. 2013;136(1):011003-011003-7. doi:10.1115/1.4025915 Figure Legend: Comparison of ball pull strength of brittle failure