DiamondInsideTM LED Speaker:Dr. James Sung (MIT) DLC LED Advantages︰

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Presentation transcript:

DiamondInsideTM LED Speaker:Dr. James Sung (MIT) DLC LED Advantages︰ Diamond–Like Carbon (DLC) is LED’s Best Friend DLC LED Advantages︰ Eliminate Hot Spots Lower Junction Temperature Radiate Heat Tolerate Overdrive Relieve Interface Stress Improve Reliability Minimize Light Decay Reduce Cost Speaker:Dr. James Sung (MIT)

The comparison with Cree, Nichia and DLC COB on light performance

Buffer layer: Ti (TiW)/DLC/Ti (TiW)/DLC/Ti(TiW)/DLC Cree VLED Chip DLC VLED Chip Buffer layer: TiW/Pt/TiW/Pt/TiW/Pt/TiW/Pt Buffer layer: Ti (TiW)/DLC/Ti (TiW)/DLC/Ti(TiW)/DLC

DLC Terminated Hot Spot of MQW

Testing sample: 8 dies of 45x45mil COB package

DLC VLED light module on DLC MCPCB at 350mA 8 dies of DLC VLED chips on DLC MCPCB COB Tmax: 70.2 0C 8 dies of regular VLED chips on DLC MCPCB COB Tmax: 76.38 0C

DLC flip chip light module (Regular MCPCB) at 350mA 8 dies of DLC flip chip LED chips on regular MCPCB COB DLC LED chip Tmax: 59.61 0C T: <1 0C Regular LED chip Tmax: 76.98 0C T: ~6 0C 8 dies of regular flip chip LED chips on regular MCPCB COB www.ritedia.com

DLC flip chip light module (Regular MCPCB) at 700mA DLC LED chip Tmax: 102.74 0C T: <8 0C 8 dies of DLC flip chip LED chips on regular MCPCB COB Regular LED chip Tmax: 135.23 0C T: ~28 0C 8 dies of regular flip chip LED chips on regular MCPCB COB www.ritedia.com

8x45mil chip (350mA) on ceramic substrate (18x16mm) Regular LED chip Tmax: 68.51 0C T: ~2 0C (32 chips) DLC LED chip Tmax: 61.58 0C T: <1 0C (32 chips)

8x45mil chip (700mA) on ceramic substrate (18x16mm) Regular LED chip Tmax: 119.4 0C T: ~9 0C (32 chips) DLC LED chip Tmax: 106.93 0C T: 3~4 0C (32 chips)

The reliability of soldering COB package at 85oC and RH 85%

Process Flow 製程流程圖

DLC Light Module及球泡燈

Light Module 訂購錸鑽光板300片 密切合作 密切合作

Radiation Patterns

Big 10 + 5 光束角 : 280 ° 總流明 : 450 lm 最大光強度 : 61.2 cd

Omni-directional LED bulb-DLC LEDs light module with remote phosphor

Light pattern of LED and fluorescent bulb

Thermal Conductivity Thermal Conductivity = Thermal Diffusivity * Heat Capacity * Specific Gravity Thermal Diffusivity ≒Sound Speed     Diamond = Mach 60 (18 Km/sec) Sound ≒ Phonon ≒ Lattice Vibration

The Thermal Mechanism of DLC to DLC LED Light Module

Relative Luminous Flux (%)

Thank you!