Errors due to process variations Deterministic error within a die Characterized a priori Over etching, vicinity effects, … A priori unknown Gradient errors due to thermal, potential, stress, … Random errors Intrinsic randomness in materials Randomness in processes Randomness during operation
Various Capacitor Errors
Common error reduction techniques Use large area to reduce random error Common Centroid layout to reduce linear gradient errors Use unit element arrays Interdigitize for matching Use of symmetry of photolithographic invariance Controlled edge or corner effects Dummy device for similar vicinity Guard rings for isolation Careful floor planning
Gradient errors: Linear gradient Higher order gradient Unknown magnitude and direction Common centroid cancels linear gradient errors, but not nonlinear gradient errors nor local random errors
Edge effects better
Better A-B matching
Capacitor layout example
Are there any thing else you can improve? Is there full symmetry between C1 and C2?
Resistor layout example
OK for really non-critical resistors. Accuracy is quite poor. Should use unit cell arrays for improved accuracy.
Positives: use of dummy, use of unit cells, intedigitized, outfold jumps Negatives: fold-in jumps, centroids not co-incidental Improvements: ???
Transistor layout example
Layout of a differential pair Which layout is a better implementation of the differential pair? (b) or (c) or (d)?
Tilted implant beam causes asymmetry Aligned gate Parallel gate PLI? PLI
Parallel gate can be PLI Aligned gate can benefit from symmetry Add dummy metal metal Dummy makes it symmetric Asymmetric
Can have both gate alignment and symmetry But still suffers from gradient errors
This pattern cancels gradient M2 M1 M2 M1 Can it be made more compact?
Here is a simpler way But it does not offer common centroid for PLI devices.
This pattern cancels gradient M2 M1 M2 M1 This one does.
Does the layout of M1 and M2 have common centroids? Does the layout have symmetry? Does it have PLI?
Donut shaped MOS to reduce CD and Cgd
Avoiding the Antenna Effect Long metal acts as antenna to collect charges that may destroy gates: Break the antenna by going to a different layer:
Reference distribution Converted Iref to Vref to be shared Vulnerable to voltage drops in ground lines
Reference distribution Distribute Iref over longer distances is more robust
Routing long interconnects Parasitic capacitors or even inductors between parallel metal lines Parasitic caps between crossing metal lines
Differential signaling to reduce parasitic coupling effects
Shield or guard critical lines Larger spacing reduces coupling
Example shielding scheme Critical signals shielded
Substrate Coupling Distributed substrate network model Digital activities couple to analog part through substrate coupling
Nearby devices affect each other through effect on Vth change Effect is worse at very high speed Example effect:
Techniques for reducing couple Use differential circuit Distribute digital signals in complementary Critical circuit in “quiet area”, far away from noisy (digital) circuit Devices in a well are less sensitive Use trenches for isolation Critical circuit inside guard ring Critical operations in “quiet time”
Example use of guard ring
H-shape distribution Analog cell array Other circuit
Introduction Theorem: If only linear gradient effects are present, then the mismatch of a parameter f of two elements will vanish if a common centroid layout is used. Common Centroid Layout Gradient Direction
Introduction A B B A Common Centroid Layout with Nonlinear Gradient Hypothesis of common-centroid theorem are not satisfied and
Introduction A B B A Common Centroid Layout with Nonlinear Gradient Are there any simple layout strategies that will also cancel nonlinear gradients?
Objective Develop a layout strategy for canceling mismatch of parameters for two matching-critical elements when nonlinear gradients of higher orders are present
Center-Symmetric Patterns Definition: A layout pattern Pn of two devices generated by the following recursive algorithm is called an n-th order center symmetric pattern. Start with a layout for device A and B, with A’s unit cells labeled 1 and B’s unit cells labeled -1. This is the zeor-th order pattern P0. Assume pattern Pk has been generated If k<n, create pattern Pk+1 by Rotating pattern Pk by 180o around any point external to pattern Pk Multiplying all elements in the rotated pattern by (-1)k Define pattern Pk+1 to be the union of pattern Pk and the rotated pattern from b)
Center-Symmetric Pattern Example B 1 -1 P0 180deg -1 1 Rotating point P1
Center-Symmetric Pattern Example 1 -1 -1 1 Rotation Point Common Centroid Layout 1 -1 k=1 -1 1 Rotated Pattern k=2
Center-Symmetric Pattern Example 1 -1 1 -1 -1 1 -1 1 1 -1 -1 1 -1 1 1 -1 Rotated Pattern constrained complimented pattern k=2
Center-Symmetric Pattern Example 1 -1 1 -1 -1 1 -1 1 Pattern P1 -1 1 1 -1 Pattern P2
Center-Symmetric Pattern Example 1 -1 1 -1 1 -1 -1 1 -1 1 1 -1 Pattern P2 Rotated Pattern k=3
Center-Symmetric Pattern Example k=3 1 -1 1 -1 constrained complimented pattern (no change since k is odd)
Center-Symmetric Pattern Example 1 -1 -1 1 1 -1 1 -1 -1 1 Pattern P3
1 2 3 4 1st order 5 2 8 3 1 6 7 4 2nd order 7 12 1 13 9 5 11 15 3 14 2 6 4 10 8 16 4th order 5th order 3rd order
Center-Symmetric Patterns Many different center-symmetric layouts can be easily generated Different starting common-centroid circuits and different external rotation points will generate different structures
Property of Center-Symmetric Networks Theorem : A parameter f of a layout pattern of two elements that is center-symmetric of order n is insensitive to the kth-order gradients for
Gradient Modeling 1st order gradient Up to nth order gradient Let (x0,y0) be any reference point in the neighborhood of the matching critical devices 1st order gradient Up to nth order gradient
Gradient Effect Let (xA,yA) be any point in the neighborhood of the matching critical region It can be shown that fn(x,y) can be written as Moving the center of the nth order gradient will only introduce lower order components This argument can be repeated for gradient components of orders n-1, n-2, … 1
Mismatch Systematic mismatch Random mismatch Gradient error Can be reduced by increasing area
Nth order circular symmetry (x0,y0) Divided into 2N Cells Uniformly distributed around a circle
Nth order circular symmetry 1-1 Matching from linear to Nth-order Gradient Rotation Invariant N elements matching A B
Hexagon tessellation High Area Efficiency Easy to Extend Cancel up to 2nd gradient Easy to Extend Honeycomb Structure Tight Uniform A B
Simulation Results Totally 5 patterns are simulated 1st order 2nd order 4th order 5th order 3rd order
Simulation Results Totally 5 patterns are simulated 1st order 2nd order 4th order 5th order 3rd order
Highest Order of Gradient Effect Simulation Results Setup: Same total device area are assigned. Large gradient effects are artificially generated. Random variations are neglected. Mismatch (%) Highest Order of Gradient Effect 1st 2nd 3rd 4th 5th 2.77 5.22 7.43 10.39 0.24 0.87 1.70 0.01 0.068 0.0023 Pattern’s order
Test structure <0.002% systematic mismatch 3rd order central symmetry <0.04% systematic mismatch 2nd order central symmetry
Measurement results
Measurement results
Matching performance Conference papers: Journal papers: C. He, et al., ‘Nth order circular symmetry pattern and hexagonal tessellation: two new layout techniques canceling nonlinear gradient,’ ISCAS 2004 X. Dai, C. He, et al., ’an Nth order central symmetrical layout pattern for nonlinear gradients cancellation,’ ISCAS 2005 Journal papers: C. He, et al., ‘New layout strategies with improved matching performance,’ Analog integrated circuits and signal processing, vol. 49 , issue 3, pp 281-289,2006