Status Report on Bonding at Catania Salvatore Costa University and INFN – Catania

Machine Fix, Upgrade,Tune-up …Wire breaking problem… Help from colleague with extensive past experience with Hughes, Enrico Scarlini of Florence (thanks!) Adjusted bonding parameters [e.g. a much lower ”Z speed”: 10 vs. 100, default is 231, do not exceed 20] Replaced tool Mounted wire despooler Disabled upper wire clamp Lubricated head travel shafts (it would not reach full rest position or it would jam onto piece) Cleared axis initialization failures

Bonding Test # 2 (1) Pre-Bonding visual inspection under microscope showed same damaged pads (scratches across rows of pads) in PAs. [Piece was no longer sticking to ESD box when I opened the box]. Used Hughes loop mode “5”, a simple 1-parameter (loop height) arch. Set loop height=150 (mm or .1 mil ?) …measure ?… for all bonds (SEN-SEN and PA-SEN)

Test bonds on Test Areas… Bonding Test # 2 (2) Test bonds on Test Areas… (Destructive) Pull Tests with automatic Puller: 8-12 g break force mid-span break

Bonding Test # 2 (3) HPK - ST SEN bonds Used following bond parameters (for both ends): Force: 20 Time: 40 U/S: 55 No problems during bond program execution Post-Bonding visual inspection: All bonds OK

Bonding Test # 2 (4) PA - HPK SEN bonds Used same bond parameters as for HPK - ST SEN bonds Some problems during bond program execution: Wire would not hold onto scratched spots of pads manually bonded choosing a different spot on pad 3 funny loops pulled out and redone 1 wire almost touching neighbor gently pushed aside with pliers At last bond, PA seemed short of 1 pad: First one missing!

Bonding Test # 2 (5) PA - ST SEN bonds Using same bond parameters as for HPK - ST SEN or PA - HPK SEN bonds, wire would not stick to PA pads Increased some parameters: Time: from 40 to 50 U/S: from 55 to 65 At visual inspection first few SEN pads will show traces of pulled wires from SEN pad Except for this, all bonds should be OK.

Bonding Jig Being distribued by Filippo Bosi, Pisa Got “Type 1” jig for (single sided) TIB modules Should get “Type 2” jig for (double sided) TIB modules sometime He said he is currently designing jigs for stereo TIB and for TID modules

Bonding Tool From Saneco, n. 4284 Concave…

Test System We have identified a person in charge of this ARC has been installed and is going to be tested

Bonding Lab Upgrade Purchased (for a nominal price) a second (used) Hughes, being dismissed by CERN Will transport to Catania tomorrow Might be operational in September (after we move to new building)

Next Step Bonding a dummy module Bari has promised they will assemble a dummy module for us to bond ad soon as HPK sensors arrive

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DataBase Interface Update Salvatore Costa University and INFN – Catania

Interface Releases (1) Version 0.1 was released on 13 March 2002 Non-working evaluation version: See interface look Stimulate communication of center-specific input data from Center DB responsibles to me. Version 0.2 to be released soon Working evaluation version: Exercise all functions Will include User’s Manual Includes people’s comments to v. 0.1 Center specific defaults and lists (where available) All data stored in Catania…will eventually be deleted!

Interface Releases (2) Version 1.0 will follow shortly Production version: Available for download from Web site in Catania Will include installation instructions Installation will create Center-specific version (same look, different default and list values) Initially for Unix only, will make version for Windows if requested Data will be stored locally to Center and will be broadcast to TrackerDB when “VALIDATED”

Center “DB Readiness” Center DB Responsible Input Data Aachen Wolfgang Braunschweig MISSING Bari Valeria Radicci OK Catania Salvatore Costa CERN Alan Honma FNAL Bill Kahl Florence Simone Paoletti Karlsruhe Hans-Jürgen Simonis Padova Maurizio Loreti TOO EARLY Pisa Andrey Starodoumov Santa Barbara Strasbourg Pierre Juillot Torino Ernesto Migliore Vienna Thomas Bergauer Zurigo Klaus Freudenreich

Data Recording In TrackerDB Do we all agree that, as it is currently foreseen in the Interface v. 0.1, PRE-BONDING, BONDING, POST-BONDING and BONDING REPAIR data are independently recorded in the central TrackerDB as soon as they are individually VALIDATED? Of course the Interface will have itself checks so that you cannot VALIDATE, say, POST-BONDING data until BONDING data have been.