Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: (a) A photograph of the mated micro-USB connector, (b) a computer-aided design (CAD) model of the USB plug connector where the plug terminal is enlarged to show design details, and (c) a CAD model of the USB receptacle connector where the receptacle terminal is enlarged to show design details

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: Relationships between the averaged amplitude and the frequency level of the surface of (a) C5191_P, (b) C5191_R, and (c) C18400_R

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: Schematic drawing of the experimental setup for the temperature measurement of the mated micro-USB connectors

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: Relationships between the calculated ECR based on the MSRS model and contact node numbers in the analysis model

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: (a) Temperature distributions over the mated connectors with C5191_P–C5191_R based on the MSRS model. (b) Detailed temperature variations of the mated terminals inside the plastic housing.

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: (a) Temperature distributions over the mated connectors with C5191_P–C18400_R based on the MSRS model. (b) Detailed temperature variations of the mated terminals inside the plastic housing.

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: Continuous temperature distribution of the part of the mated C5191_P–C18400_R (a) captured by using the infrared thermal camera and (b) based on the MSRS model

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: Temperature distributions over the mated C5191_P–C5191_R based on the conventional approach

Date of download: 10/16/2017 Copyright © ASME. All rights reserved. From: Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model J. Electron. Packag. 2015;137(3):031012-031012-7. doi:10.1115/1.4030803 Figure Legend: Temperature distributions over the mated C5191_P–C18400_R based on the conventional approach