RB and RQ shunted BusBar current carrying capacities

Slides:



Advertisements
Similar presentations
RRR Measurements in S23 during LS1 Emmanuele Ravaioli Daniel Rasmussen Scott Rowan Thanks to Z. Charifoulline, R. Denz, J. Steckert, H. Thiesen, A. Verweij.
Advertisements

Thermal Analysis of Two Braze Alloys to Improve the Performance of a Contactor During the Temperature Rise Test G. Contreras 1, E. Gutierrez-Miravete 2.
Cryogenic Experts Meeting (19 ~ ) Heat transfer in SIS 300 dipole MT/FAIR – Cryogenics Y. Xiang, M. Kauschke.
Possibilities of Finite Element Modelling for a Better Understanding of Heat Transfer in Rutherford-Type Cables The use of COMSOL Multiphysics as an analysis.
Thermal Analysis of Two Braze Alloys to Improve the Performance of a Contactor During the Temperature Rise Test G. Contreras 1, E. Gutierrez-Miravete 2.
TMM of the CLIC Two-Beam Module T0 in the LAB – Proceedings to structural FEA Riku Raatikainen
ELECTRO THERMAL SIMULATIONS OF THE SHUNTED 13KA LHC INTERCONNECTIONS Daniel Molnar, Arjan Verweij and Erwin Bielert.
Lecture 4: Boundary Value Problems
Shielding the Weiner PSU 7 May 2013 Kiril Marinov ASTeC, MaRS, DL 1.
A novel model for Minimum Quench Energy calculation of impregnated Nb 3 Sn cables and verification on real conductors W.M. de Rapper, S. Le Naour and H.H.J.
Click to edit Master subtitle style 4/25/12 Thermal Management By using PLPCB technology with HEAVY Copper in PCB Pratish Patel CEO, Electronic Interconnect.
FAIR MT/Cryogenics, Seong Yeub Shim Beam-Tube Eddy Loss S. Y. Shim.
What are common results of heat transfer? Case #1, no phase transition or work done. How much does the temperature vary? Heat is energy in transit! Positive,
LMC 30 LPC A. Verweij, TE-MPE. 30 Sept 2009, LMC meeting 1.9 K, 0 T, 7.5 kA run Heat pulse.
A. Verweij, TE-MPE. 3 Feb 2009, LHC Performance Workshop – Chamonix 2009 Arjan Verweij TE-MPE - joint stability - what was wrong with the ‘old’ bus-bar.
Proposal for RRR measurement in S-12 at K MP3 meeting, 15 July 2009, Arjan Verweij With input from Bob Flora and Udo Wagner Arjan Verweij, TE-MPE,
QXF protection heater design : Overview and status Tiina Salmi QXF quench protection meeting April 30, 2013.
1 Numerical study of the thermal behavior of an Nb 3 Sn high field magnet in He II Slawomir PIETROWICZ, Bertrand BAUDOUY CEA Saclay Irfu, SACM Gif-sur-Yvette.
The diode lead resistance ‘issue’ A. Verweij, TE-MPE, CSCM workshop 7/10/2011 Contents:  Diode geometry  Measurements performed in the past  Measurements.
Heat Transfer from Extended Surfaces Heat Transfer Enhancement by Fins
1 A. Verweij, TE-MPE. LHC Performance Workshop – Chamonix Feb 2010 Arjan Verweij TE-MPE - type of defects - FRESCA tests and validation of the code.
QXF quench heater delay simulations Tiina Salmi, T. Salmi.
Start Presentation October 25, th Homework In this homework, we shall model and simulate a thermal system. We shall model heat conduction along.
LHC Magnets/Splices Consolidation (20 minutes) Francesco Bertinelli 7 June, slides  Status of LHC: electrical connections  Description of shunt.
1 A. Verweij, TE-MPE. LHC Performance Workshop – Chamonix Feb 2010 Arjan Verweij TE-MPE - type of defects - FRESCA tests and validation of the code.
Splice Joint Design and Analysis John Escallier Brookhaven National Lab bnl - fnal- lbnl - slac US LHC Accelerator Research Program.
LHC circuit modeling Goal: Create a library of electrical models and results for each circuit Useful and usable for the next 20 years…… Web site cern.ch/LHC-CM.
Cooling of GEM detector CFD _GEM 2012/03/06 E. Da RivaCFD _GEM1.
Daniel Molnar Diode simulations and measurements.
P. P. Granieri 1,2, M. Breschi 3, M. Casali 3, L. Bottura 1 1 CERN, Geneva, CH 2 EPFL-LPAP, Swiss Federal Institute of Technology, Lausanne, CH 3 University.
Update on the TDI impedance simulations and RF heating for HL- LHC beams Alexej Grudiev on behalf of the impedance team TDI re-design meeting 30/10/2012.
Protection heater design for MQXF outer layer *Using long Super- Heating Stations for ensuring quenhces at low currents* Tiina Salmi, Tampere.
HALL EFFECT TRANSDUCERS As already explained in- Art page 562, when a conductor is kept perpendicular to the magnetic field and a direct current.
TS Cool Down Studies TSu Unit Coils (24-25) N. Dhanaraj and E. Voirin Tuesday, 10 March 2015 Reference: Docdb No:
Grid Pix Field Simulations and precision needed for a module Peter Kluit, Jan Timmermans Prepared 16 May 2016.
MQXFS1 Protection heater delays vs. Simulations 9 May 2016 Tiina Salmi, Tampere university of technology Acknowledgement: Guram Chlachidze (FNAL), Emmanuele.
The most likely cause of death for a superconducting magnet Input data for thermal modeling of Nb 3 Sn Superconducting Magnets by Andrew Davies Find the.
CHATS-AS 2011clam1 Integrated analysis of quench propagation in a system of magnetically coupled solenoids CHATS-AS 2011 Claudio Marinucci, Luca Bottura,
Beijing Institute of Technology
Task 5: High-Tc superconducting link Summary of work-package
Ohm’s Law and Resistance. Resistivity.
Quench estimations of the CBM magnet
UK-HL-LHC WP4 Cold Powering
Grid Pix Field Simulations and precision needed for a module
LHC Interconnect Simulations and FRESCA Results
12 October 2009 RRB Plenary R.-D. Heuer
Chapter 4 Interconnect.
Nb-Ti Strand and 2D magnet coil
Numerical simulations on single mask conical GEMs
(with Nikolaos D. Kylafis)
Circuits description and requirements - Closed Session-
Numerical simulations on single mask conical GEMs
SUBJECT : HEAT & MASS TRANSFER Date : 15/02/2013
MODEL INVESTIGATION OF MOLD LEVEL MONITORING WITH THERMOCOUPLES
I. Bogdanov, S. Kozub, V. Pokrovsky, L. Shirshov,
ANSYS FE model for thermal and mechanical simulation
Atlas Calorimeter with LN2 Cooling Loops, Revision B
L. Bottura and A. Verweij Based on work and many contributions from:
MQXF coil cross-section status
Using the code QP3 to calculate quench thresholds for the MB
Transient Heat Conduction
P.Fabbricatore & S.Farinon
Lattice (bounce) diagram
Atlas Calorimeter with LN2 Cooling Loops
Thermal behavior of the LHCb PS VFE Board
The superconducting solenoids for the Super Charm-Tau Factory detector
PANDA Collaboration Meeting
Other arguments to train two sectors to 7 TeV
Assessment of stability of fully-excited Nb3Sn Rutherford cable with modified ICR at 4.2 K and 12 T using a superconducting transformer and solenoidal.
Presentation transcript:

RB and RQ shunted BusBar current carrying capacities Daniel Molnar

Physical description Joule heating is implemented Also magnetic effects are taken into consideration SFF: Self Field Factor The effective field later Material parameters are all Temperature dependent, exp decaying current, etc. : highly non linear problem Conservative values for materials, time constants, boundary and initial conditions are used (eg.:T0=10K) and definition of “safe” current Completely Adiabatic case, no cooling to HE

Main model descriptions If possible symmetry is used to speed up the calculations Rectangular elements, with same area as “real” shape for modeling reasons (same results) Perfect splice between the two cables in the interconnection Non stabilized length of the cable by default is 15mm(below the “tongue” of BUS)

Symmetries used in the models Type a) :parallel to the length typically in RB simulations, but in some RQ as well Type b): perpendicular to the length

Material properties For metals (Cu(RRR),solders, cable is mixture): (Magnetic effects) Nb-Ti electrical resistivity Copper thermal conductivity Copper electrical resistivity

Comparisons, Validations The QP3 and Comsol 4.1.0.88 comparisons Various cases have been compared, the most interesting ones are mentioned here First a one D model was taken Then 3D with the half of the length (also “full” length) And then shunted comparisons All were fit to each other in order to compare properly

Defect types for non shunted Stabilized cable(i.e. well soldered) wedge 15 BUS BUS U-profile Non soldered cable -In the non-shunted case the non stabilized length of the cable “moves” towards the BUS Y Non soldered cable X

RQ/RB non shunted

RB up shunt Top view for up-shunt 15 -Note that the two reservoir holes are always considered to be AIR, with rectangular shape -The defect of SnPb solder is indicated by green lines, different lengths of it -also non perfect contact between wedge and U-profile Wedge U-profile

RQ/RB below shunt Bottom view below shunt 15 -The shunt is the same as for the up one -The defect of SnPb solder is indicated by green lines, different lengths of it -Also the defect is symmetric with respect to the connection of Bus and U profile

Description of symmetric shunt defects Up shunt 50 Holes wedge BUS BUS U-profile Below shunt 15

RQ below shunt:Temperature and current distribution Temperature distribution in X-Y Current density Z component

RB up shunt The minimum detectable void

RQ below shunts The minimum detectable void Symmetric defects Asymmetric defects

RQ below shunts-length of the shunt Length of shunt [mm] Current density Y Current density Y Length of shunt [mm] The current “flow” Current density Y component

RQ Side-shunt zl zm zr x 15 8

RQ sideshunt type_b zb 15 zj x x z y

RQ shunts summary

Different Time constants(Tau)

The effect of the SnPb thickness The “standard” is 100 mm but , also the effect of a thicker SnPb layer under (or above) the shunt has been investigated For an RB below shunt with 8mm of GAP in the SnPb -100 mm thickness:16200 A -300 mm thickness:15900 A

Conclusions QP3 and Comsol 4.1 results are correlating very well (within less than 8 % difference) The main shunts are capable to carry more than 13 kA and no gain with longer shunt The margin is bigger for Quadropole shunts The safe current is less than 13 kA for the side shunts with original design parameters, but modified ones could be fine The safe current also highly depends on the distribution and the size of both defects With Comsol it is possible to implement any type of geometry or/and physical effects (cooling etc.)

Acknowledgement Many thanks to Arjan Verweij and Erwin Bielert

Back up slides

QP3 Comsol difference; shunt RRR 150 For RB shunted calculations (0=0.5) For RQ shunted calculations(0=0.5) QP3 the shunt’s RRR=150

Extreme case: full length non stabilized cable

Extreme case II) full length NSC,non symmetric SnPb defect

And a more Extreme:No Cu in the defect for RQ below shunt

Defect look-a-like

Magnetic models, mesh quality

Magnetic effects: First results

Different Time constants-same current The safe current for Tau 30 sec: 16kA (also a bd case)

Modeled RQ side shunts

An example of usage beyond Comsol Resistance as a function of time; It could carry14kA without reaching 300 K, shunted version, no void in SnPb