APSEL6D Architecture, simulations and results

Slides:



Advertisements
Similar presentations
Lecture 15 Finite State Machine Implementation
Advertisements

Registers and Counters
M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR PXL Sensors Overview.
Striplet option of Super Belle Silicon Vertex Detector Talk at Joint Super B factory workshop, Honolulu 20 April 2005 T.Tsuboyama.
HT46 A/D Type MCU Series Data Memory (Byte) Program Memory HT46R22 (OTP) HT46C22 (Mask) 2Kx Kx16 4Kx HT46R23 (OTP) HT46C23 (Mask) HT46R24.
Phase 2 pixel electronics 21 May 2015 – CERN, Geneva First look at data compression Konstantin Androsov – INFN Pisa & University of Siena Massimo Minuti.
Vth INFIERI workshop April 2015 – CERN, Geneva First look at data compression Konstantin Androsov – INFN Pisa & University of Siena Massimo Minuti – INFN.
Ultimate Design Review G. Bertolone, C. Colledani, A. Dorokhov, W. Dulinski, G. Dozière, A. Himmi, Ch. Hu-Guo, F. Morel, H. Pham, I. Valin, J. Wang, G.
SVT workshop October 27, 1998 XTF HB AM Stefano Belforte - INFN Pisa1 COMMON RULES ON OPERATION MODES RUN MODE: the board does what is needed to make SVT.
U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.
I2C Master Core Simulation Environment. I2C Master Core Requirements Coverage (*) Requirement I2C IP RS-906: The I2C IP shall define the period of time,
Development of an ASIC for reading out CCDS at the vertex detector of the International Linear Collider Presenter: Peter Murray ASIC Design Group Science.
14/6/2000 End Cap Muon Trigger Review at CERN 1 Muon Track Trigger Processing on Slave and Hi-pT Boards C.Fukunaga/Tokyo Metropolitan University TGC electronics.
NA62 Trigger Algorithm Trigger and DAQ meeting, 8th September 2011 Cristiano Santoni Mauro Piccini (INFN – Sezione di Perugia) NA62 collaboration meeting,
J. Crooks STFC Rutherford Appleton Laboratory
Joel Goldstein, RAL 4th ECFA/DESY LC Workshop, 1/4/ Vertex Readout Joel Goldstein PPd, RAL 4 th ECFA/DESY LC Workshop DAQ Session 1 st April 2003.
FPGA firmware of DC5 FEE. Outline List of issue Data loss issue Command error issue (DCM to FEM) Command lost issue (PC with USB connection to GANDALF)
1 Programming of FPGA in LiCAS ADC for Continuous Data Readout Week 5 Report Tuesday 29 th July 2008 Jack Hickish.
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
REQUIREMENTS FOR A NEW PIXEL CHIP L. Demaria - Torino INFN Lino Demaria - New Pixel Chip - Torino 01/06/2011.
CERN, 18 december 2003Coincidence Matrix ASIC PRR Coincidence ASIC modifications E.Petrolo, R.Vari, S.Veneziano INFN-Rome.
Low Power, High-Throughput AD Converters
.1PXL READOUT STAR PXL READOUT requirement and one solution Xiangming Sun.
Progress on Pixel Region Optimization and SystemVerilog Simulation Phase 2 Pixel Electronics Meeting – Progress on Pixel Region Optimization and SystemVerilog.
CSNSM 14-16/09/2011 Frédéric DULUCQ Digital part of SPIROC 3.
Software for tests: AMB and LAMB configuration - Available tools FTK Workshop – Pisa 13/03/2013 Daniel Magalotti University of Modena and Reggio Emilia.
Alessandro Gabrielli - SLAC - 15/02/081 Alessandro Gabrielli Physics Dep. & INFN Bologna -APSEL4D readout architecture -APSEL256x256D proposal -Emulator-Debugger.
Pixel structure in Timepix2 : practical limitations June 15, Vladimir Gromov NIKHEF, Amsterdam, the Netherlands.
Low Power, High-Throughput AD Converters
1 Programming of FPGA in LiCAS ADC for Continuous Data Readout Week 4 Report Tuesday 22 nd July 2008 Jack Hickish.
GGT-Electronics System design Alexander Kluge CERN-PH/ED April 3, 2006.
Alberto Stabile 1. Overview This presentation describes status of the research and development of main boards for the FTK project. We are working for.
FSSR2 block diagram The FSSR2 chip architecture is virtually identical to that of FPIX2. Each strip is treated as one pixel cell (Pseudo-Pixel architecture)[*]
DIRECT MEMORY ACCESS and Computer Buses
End OF Column Circuits – Design Review
OMEGA3 & COOP The New Pixel Detector of WA97
Updates on the R&D for the SVT Front End Readout chips
CLUster TIMing Electronics Part II
IAPP - FTK workshop – Pisa march, 2013
3D CMOS monolithic 3-bit resolution pixel sensor with fast digital pipelined readout Olav Torheim, Yunan Fu, Christine Hu-Guo, Yann Hu, Marc Winter.
DCH FEE STATUS Level 1 Triggered Data Flow FEE Implementation &
LHC1 & COOP September 1995 Report
Digital readout architecture for Velopix
Production Firmware - status Components TOTFED - status
INFN Pavia and University of Bergamo
Preliminary considerations on the strip readout chip for SVT
Pending technical issues and plans to address and solve
TDC per 4 pixels – End of Column Approach
Christophe Beigbeder PID meeting
DCH FEE 28 chs DCH prototype FEE &
SLP1 design Christos Gentsos 9/4/2014.
David Christian Fermilab October 18, 2016
Some basic ideas (not a solution)
FTK variable resolution pattern banks
CAM in L1 pixel trigger architecture
Chess2 Review ASIC Configuration
GTK TDC design and characterization notes Gianluca Aglieri Rinella
EEPROM Comparison – Parallel or Serial
Dominique Breton, Jihane Maalmi
SVT detector electronics
SVT detector electronics
Triangular Sorter Using Memristive Architecture.
Tests Front-end card Status
PID meeting Mechanical implementation Electronics architecture
TPC Electronics Meeting, 13/01/05 Carmen González Gutiérrez
SVT detector electronics
On behalf of the CEPC MOST2 Vertex detector design team
Perugia SuperB Workshop June 16-19, 2009
Preliminary design of the behavior level model of the chip
IN5350 – CMOS Image Sensor Design
Presentation transcript:

APSEL6D Architecture, simulations and results SuperB Meeting – Perugia, 6/16/2009 Filippo Giorgi - INFN Bologna

Outline Expected Target Conditions Matrix Architecture Readout architecture Simulations Efficiencies Summary APSEL6D architecture simulations

Target Conditions 100 MHz/cm2 hit rate: 160 Mhit/s chip bandwidth 25 MHz/cm2 track rate (includes x5 security factor) 4 MHz/cm2 cluster factor 160 Mhit/s chip bandwidth 0.25 – 2.0 µs BCO clock: Time Counter clock, represents the time granularity of the events. 60-100 MHz Matrix Read Clock APSEL6D architecture simulations

The Matrix Architecture Pixel Matrix Active Column Common Pixel Data Bus – Active 1 column of pixel at a time APSEL6D architecture simulations

The Matrix 320x256 (40µm pitch) 80 x 4 = 320 pxl 80K pixel matrix Total area ~ 1.3 cm2 130 Mhit/s AC AC AC AC 256 pxl 4 independent Submatrix 1 000 pixels analyzed in 1 CLK cycle 4 horizontal parallel scans for the Active Column 80 x 256 pxl, 40 microns pitch APSEL6D architecture simulations

Submatrix Scan Policy Column scan time oriented: 1 scan for each Time Stamp  The hits are time sorted APSEL6D architecture simulations

The Macro Pixels Matrix divided into MPs: group of pixels (2x8) MP global lines: Fast-OR line: (output) inclusive OR of all pixels. Freeze line: (input) disable the reception of new hits. On BCO clock edge all MPs with active fast-OR : Gets frozen Are associated to the current value of BCO counter (Time Stamp) Waits to be scanned and reset BC edge TIME STAMP MP reset after read Active Fast-OR MP gets frozen APSEL6D architecture simulations Time

Zone sparsification of the Active Column The 256 pixels of the Active Column are divided into 32 vertical zones (1x8 pixels each) Every HIT stored contains the information of a zone, not of a single pixel: HIT= (Zone address+ Zone pattern) X zone address = Column address : 80 columns 7 bit Y zone address : 32 vertical zones  5 bit Zone pattern: 8-pixel zone  8 bit Time Stamp: since the hits are time sorted, the relative TS word is stored at the beginning of each hit sequence Zone 0 TS Zone 1 Active Column APSEL6D architecture simulations

The sparsifiers and barrels 8-hit wide BUS 64 PXL 1 Hit BUS ACTIVE COLUMN 8 zones N Hit to write Barrel: an asymmetric FIFO with variable input width: from 1 to 8 hits stored per clk cycle. 64 PXL 8 zones 64 PXL 8 zones 64 PXL 8 zones APSEL6D architecture simulations

Sparsification and barrel trees Each submatrix scan has its own readout – all working in parallel 80 80 80 80 Common output stage 27/03/2009 APSEL6D proposte & simulazioni - Parte 2

Output stage FULL resolution Hit + time stamp 8 bit TS (modulo 256 BCO counter) 9 bit X address (320 pixels) 8 bit Y address (256 pixels) TOT 25 bit  expected rate 130 MHit/s per chip = 130MHz x 25bit = 3.2 Gbps Zone sparsification & time sorting of the hits (TS heading the relative hits) lead to: 2 bit Barrel L2 address (1/4 of submatrix: 80x64 pxl) 2 bit Barrel L1 address (1 submatrix: 80x256 pxl) 7 bit X address (80 pixels) 3 bit zone Y address (8 vertical zones for each L2 barrel) 8 bit zone pattern TOT 22 bit  expected rate: 130 (+1 TS) * 22 = 2.8 Gbps  [(22*2)* 0.875 + (22*4)*0.125 ] *25 Mtrack s-1 cm-2 * 1.3 cm2 Weighted average ~ 1.6 Gbps BUT: Considering the cluster factor x4 of the expected rate in the form 2x2: in 87.5% of cases 2 hits only & in 12.5% are required 4 hits APSEL6D architecture simulations

The components simulated: 2nd layer barrels (B2) 1st layer barrel (B1) Sub Matrix NB: Full B1 output bandwidth supposed available (1 hit/clk cycle) Concentrator Scan Control Freezer Scan Buffer TS + MP pattern Sparsifiers All the models are described using synthesizable VHDL APSEL6D architecture simulations

Study on Barrel optimal Depth: Expected rate @B2: 8,2 MPxl/s Expected rate @B1: 32,8 MPxl/s Forbidden region Mean input rate > ouput throughput B counts/ A counts Barrel depth Barrel inefficiencies due to fluctuation over the mean rate Barrel clock 40 MHz APSEL6D architecture simulations

Frozen Efficiency @ 100 MHz/cm2 BCO period (us) % Readout efficiency not 100% : Scan buffer overflow Barrels efficiency 100% No barrel overflow (B2 and B1) frozen effi. BCO (us) 0,25 0,5 1 1,5 2 100 99.7 99,5 99,3 99,2 99,0 Rd_clk (MHz) 80 99,6 99,4 99,1 98,8 60 97,5 98,9 98,4 Fast read clock and narrow BC edges APSEL6D architecture simulations NB: for 200 MHz/cm2 minimum Rdclk 80MHz and efficiency with BC=1 us is 97.6%

Slow Control : I2C-like system Hard Wired Addresses ½ Modulo: 6 APSEL 6D 001 010 011 100 101 110 slave slave slave slave slave slave VDD DAQ BUS master SDA SCL Registers R/W access communication type I²C : two bidirectional open-drain lines. Serial Data (SDA) Serial Clock (SCL), pulled up with resistors.

Conclusions Study conducted to point out the optimal readout policy and architecture. A parametrized model has been coded with synthesizable VHDL. Simulations perfomed allowed a fine adjustment of the free parameters, and showed for a “typical” configuration a global readout efficiency: above 98,4% Works in progress: Realization of the final output stage I2C like interface for slow control To Do Service infrastructure (killmask, MP mask, calib facilities…) Selection of the elements to be implemented in the sett 09 chip APSEL6D architecture simulations

BackUp Slides APSEL6D architecture simulations

Macro Pixel Cycle APSEL6D architecture simulations

2D scan BCO vs RDclk @ 1MHz/mm2 RN sim DURATION (us) RDclk (MHz) BCO (us) Mean Sweeping time (us) global hit rate (MHz) rate on area (MHz/mm2) B2 depth B1 depth B1 max fill B1 mean fill BC lost Already hit effi (%) frozen effi (%) ro effi B2 (%) ro effi B1 (%) 107 1 60 0,5 0,45 33,8 1.03 8 32 5 99,96 98,90 100 108 80 0,34 99,95 99,39 109 0,27 99,53 110 0,75 99,91 98,83 111 0,56 9 99,10 112 99,25 113 1,5 0,95 19 99,86 98,78 114 0,71 18 99,05 115 0,57 99,23 116 2 1,08 24 3 99,84 98,42 117 0,81 23 99,83 98,81 118 0,65 99,04 APSEL6D architecture simulations