Radiation hardness tests of GaAs and Si sensors at JINR S. M

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Radiation hardness tests of GaAs and Si sensors at JINR S. M Radiation hardness tests of GaAs and Si sensors at JINR S.M. Shakour  JINR, Dubna, Russia 2017  

Gallium arsenide as a detector material GaAs is a well-known semiconductor, second widespread after silicon Limited use in particle detection because of low resistivity, low CCE and high intrinsic noise New modification of GaAs, compensated by Cr (GaAs:Cr), has been invented in Tomsk State University in 2000-2005 suitable for detector construction radiation hard Z(GaAs)~ 32 vs Z(Si)=14 → 20% higher photon detection efficiency Material main charge carriers electron drift length bulk resistivity active sensor thickness intrinsic noise LEC SI-GaAs holes 0.3-0.5 mm <2*108 Ω*cm <300 μm high GaAs:Cr electrons 0.7 – 2 mm ~109 Ω*cm up to 1 mm low

Two types of GaAs:Cr detectors 'Resistive' GaAs:Cr resistivity ~109 Om*cm active thickness up to 1 mm electron drift length up to 2 mm πν junction structure active thickness is determined by πν junction (~0.1-0.2 mm depending on Ubias) resistivity and CCE is Ok ν-type GaAs:Cr π-type GaAs:Cr ν-type GaAs:Cr n-type GaAs

Summary of previous measurements GaAs:Cr detectors based on πν junction structure may have the same or better radiation hardness comparing with the 'resistive' GaAs:Cr πν junction structures were never tested systematically in electron beams. We never reported (= never systematically studied) the dependence of the radiation degradation on the irradiation rate

GaAs:Cr and Si sensors 1 4 2 3 1 N Type Holder Size, x y z, mm Sensitive area, mm2 1 GaAs:Cr barrier, n+-π-ν-n(radiation hard) Plastic  5x5x0.3 5x5 2 GaAs:Cr high resistive PCB   4.5x4.5 3 Si n-type Plastic 4x4 4 Si n-type rad-hard sensor from USCS PCB 10x10x0.4 1 4 2 3 1

LINAC-800 Set up our experiments 800 MeV electron linear accelerator (LINAC-800) is under construction at JINR. 20 MeV beam channel was used for sensors irradiation. Beam parameters: bunch current up to 10 mA, duration 2 ms, frequency from 1 to 10 Hz.

Irradiation setup Beam pipe Sensors Faraday cup Collimator Keithley 6517

Irradiation control The radiation sensitive film was placed behind the sensor to control the absorbed dose, and the uniformity of electron flounce during irradiation. Sensor 5mm 5mm 5mm 5mm 48 kGy 194 kGy

GEANT 4 simulation The electron transport through the irradiation setup was simulated by GEANT4 in order to obtain the ratio of registered by Faraday cup charge to absorbed dose in the sensor. Sensor Holder Thickness, um Energy deposit by one e, MeV Absorbed dose to charge in Faraday cap, kGy/uC Error GaAs Plastic  300 0.2218 5.56 0.04 PCB   0.2238 5.61 Si   Plastic 0.1064 6.09 0.06 PCB 0.1066 6.10

CCE(Charge collection efficiency ) measurement set up electrons from Sr90 source well collimated and triggered by 2 scintillators. It allows to cut and measure signal only from electrons passed throw the sensor with energy from 1 to 2.2 MeV which is close to MIP electrons

Installation for CCE and I-V(Volt - Ampere) measurement All the sensors measured at room temperature, except some measurements at low temperature for Si

Results I-V Si I-V characteristics of the normal n-type Si (N3) and radiation hard USCS Si (6888). The dark current increased almost 4 orders of magnitude after the absorbed dose of 1.5 MGy

Results I-V: πν junction structure and HR GaAs:Cr I-V characteristics of the sensors: high resistive GaAs:Cr (left), πν junction structure GaAs:Cr(right) Resistivity of GaAs:Cr sensors is about 2-5*109 Ohm*cm, the dark current increased only 3 times for the high resistive and 4-5 times for the barrier GaAs:Cr.

MIP of non irradiated GaAs:Cr sensors MIP spectrum from Sr90 of the HR GaAs (left) and πν junction structure GaAs sensors (right)

GaAs MIP signal vs Dose 0kGy 48kGy 190kGy 350kGy 550kGy 950kGy 1350kGy Mean : 34.93 Mean : 22.21 Mean : 14.05 0kGy 48kGy 190kGy Mean : 4.64 Mean : 13 Mean : 8.5 350kGy 550kGy 950kGy Mean : 4.99 Mean : 4.97 Mean : 4.95 1350kGy 1550kGy 1150kGy

GaAs pedestal vs Dose 0kGy 48kGy 1550kGy In GaAs:Cr the CCE drops 5 times even at a dose 0.5 MGy, but then it decreases slowly, keeping about 10% of the initial CCE after dose 1.5 MGy. The width of the pedestal in a GaAs remains practically unchanged.

UCSC Si 6886 MIP vs Dose 493kGy Sig+Ped 0kGy 493kGy Ped 493kGy Sig The pedestal expands and the signal from pedestal separation becomes difficult after doses 0.5MGy

N-type Si N5 MIP vs Dose T =22°C T =20°C 0kGy Sig 104kGy Sig 208kGy S+P 274kGy S+P 383kGy S+P 602kGy S+P 492kGy S+P T =22°C T =20°C

Si vs GaAs 550 kGy Si N5; 492kGy ; T= 16°C GaAs N4 barrier; 550kGy ; T =22°C PED SIG A slight cooling of the sensor Si for 5°C significantly improves the MIP-signal and pedestal separation, but it is still worse than GaAs:Cr.

Si vs GaAs 1550 kGy Si 1260 kGy ; T =22°C GaAs 1550 kGy ; T =22°C PED SIG After 1.5 MGy the MIP-signal and the pedestal still separated for GaAs:Cr

Si cooling Si 602 kGy ; T =20°C Si 602 kGy ; T =-1°C SIG PED

Si cooling Si 1260 kGy ; T =22°C Si 1698 kGy ; T =-0.7°C SIG PED

GaAs CCE vs Dose (GaAs) (GaAs)

Si CCE vs Dose Due to increasing of the dark current the pedestal considerably broadened and the measurement becomes difficult for doses higher 0.5 MGy.

GaAs:Cr and Si sensor resolution. GaAs barrier Si N5 𝑲= 𝑵 2σ 𝑵 𝐭𝐨𝐭𝐚𝐥 2σ-criterion was applied for a correct comparison of Si and GaAs sensor performance. K is the ratio of events departed greater than the total number 2σ from pedestal to the total number of events in MIP-spectrum. The greater K, the better the signal and pedestal are separated in the spectrum.

GaAs CCE-Vbias dependence. GaAs HR GaAs barrier GaAs barrier GaAs barrier GaAs HR For the irradiated GaAs sensors CCE increases significant with the field strength up to 20 kV / cm, while in the non-irradiated sensors saturation begins at 1 kV/cm

CCE measurements for GaAs and Si under neutron irradiation from IBR 2

Summary Irradiation of the high-resistive and barrier GaAs:Cr sensors and the normal and radiation-resistant n-type Si sensors by 20 MeV electron beam of was performed. Radiation damage in GaAs and Si are different: increasing of the dark current in Si and dropping signal in GaAs. A significant difference between two types of GaAs:Cr sensors and two types of Si is not found. 2-σ criterion was applied to separate the signal from the pedestal. After dose 1.5 Mgy in GaAs:Cr signal magnitude remains about 10% of initial, when Si is not possible to use at room temperature.