Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Schematic illustration of a blister test

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Schematic of boundary conditions applied in axisymmetric 2D model of blister test

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Deflection versus pressure curve for an ideal stretching case; finite element method results and analytical solutions are compared

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Blister profile before and after a delamination of Δa = 75 μm obtained from the FEA analysis: the case of Fig. 3 with Pcrit = 10 psi

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: G versus Δa plot for numerically determined energy release rate for the case shown in Fig. 4

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Deflection versus pressure curve for a blister test specimen with an intermediate thickness

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Deflection versus pressure curve for intermediate case with several pseudomaterial property pairs to fit experimental curve

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Copper substrates for blister test samples (a) before and (b) after attaching the stencil

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Schematic of sample preparation procedure: (a) creating temporary plug, (b) creating the predefined area, (c) curing the adhesive, and (d) the final sample ready for testing

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Schematic diagram of the blister test setup

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Representative deflection versus pressure curves for an epoxy/copper interface at as-is testing conditions

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: A typical blister sample (a) before and (b) after critical delamination event

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Representative deflection versus pressure curves for an epoxy/copper sample at three conditions: (a) as-is, (b) after thermal aging, and (c) after moisture degradation

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Energy release rate comparison of three conditions: (a) as-is, (b) after thermal aging, and (c) after moisture degradation

Date of download: 10/19/2017 Copyright © ASME. All rights reserved. From: Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions J. Electron. Packag. 2016;138(4):041003-041003-8. doi:10.1115/1.4034454 Figure Legend: Moduli comparison of three conditions: (a) as-is, (b) after thermal aging, and (c) after moisture degradation