Micromegas modules achievements and plans Paul Colas, CEA Saclay Santander, LCWS 2016 Single modules 2008-2010 7 modules: 2013-2015: Electronics integration, 2PCO2 cooling, DLC coating Future : 1 large module with gate?

SINGLE MODULE OPERATION Several kinds of single modules were tried, with Carbon-Loaded Kapton, and resistive inks Readout by T2K AFTER-based electronics Operation was smooth and uniformity was good with CLK Resolution down to 60 µm at z=0 31/05/2016 Micromegas modules

Mitigation of distortions at the boarder For Micromegas: reconcile the grounding of the resistive layer with the field homogeneity. 0 V 380 V See Deb Sankar’s presentation on distortions 31/05/2016 Micromegas modules

4-layer routing (CERN) and 6-layer routing (Saclay) 24x72 pads, 2.7-3.2 mm x 7 mm 27/01/2010 31/05/2016 Micromegas modules

7-MODULE OPERATION Electronics integration : make new FECs with AFTER chips. Zero-force connectors 2P CO2 cooling (see Deb Sankar’s talk) Allowed distortions to be studied Allowed a new coating to be studied: Diamond-Like Carbon (see A. Bellerive’s talk) 31/05/2016 Micromegas modules

Work in (slow) progress Writing papers, finalizing analysis Set up of a UV lamp (for ion disk) Mounting of a setup for transparency measurement of a Raytech GEM gate ASTRE electronics? 31/05/2016 Micromegas modules

Future Present electronics getting old (many mounting-dismountings) Make a larger module (up to 8000 pads), with ASTRE electronics? Adapt a gate (mesh? GEM?) Future is very uncertain, as funding is 31/05/2016 Micromegas modules

Endplate panels Dimensions from ‘after-Cambridge’ Panel height 336 mm Panel width : from 278 to 454 About 6800 pads per panel 31/05/2016 Micromegas modules