3-D IC Fabrication and Devices Abstract: 3-D integrated circuits utilize z-axis allowing unique fabrications designs. This utilization allows cheaper, more compact, and efficient integrated circuits. Thong Moua Monday April 11th 2016

Outline Background information Introduction to 3D IC Fabrication Benefits/issues Current technology Applications

Background info How integrated circuits are made Silicon ingot is grown Sliced into wafers Chip design is etched on Wafer is diced according to chip

Introduction to 3-D IC’s A Single Circuit with two or more layers of active components connected by TVS Utilizes the z-directional axis to improve performance, reduce power, etc.

Four main types of Fabrication Monolithic Wafer-on-Wafer Die-On-Wafer Die-On-Die

Fabrication (Wafer-on-Wafer) Components are built on two or more wafers Wafers are aligned accordingly Bonding of the two wafers Thinning of wafers (can be done before or after bonding) Wafer is diced

Benefits of 3D IC Lower fabrication cost Save space Allows for miniaturization Improved performance Better bandwidth Reduced power

Issues with 3D IC Yield Heat Design complexity Testing Lack of standards

Current technology

SIP (system in packaging) SiP is multiple bare dice and/or chips mounted on a common substrate, which is used to connect them all together. Packaged together.

2.5D integrated Circuits Package-on-Package (PoP)

3D technology

Applications True 3d IC is still in need of further research and development. Monolithic IC 3D inc. 3D Logic 3D memory 3D electro optics DRAM (Intel and micron hybrid memory cube)

Xilinx 3D IC

Conclusion 3-D integrated circuits is the next step in increasing performance of our technology. Its unique design in the z-axis allows for profound benefits, but at a cost of heat, complexity, etc. However further research and development can minimize the cons and allow a more commercialized product.

References http://www.extremetech.com/computing/197720-beyond-ddr4-understand-the-differences-between- wide-io-hbm-and-hybrid-memory-cube http://www.monolithic3d.com http://www.invensas.com/Company/Documents/Invensas_IPCAPEX2013_3D.pdf http://www.eetimes.com/document.asp?doc_id=1279540 http://www.xilinx.com/programmable/about/research-labs/3-D_Architectures.pdf https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit All Images provided by Google

5 key concepts 3D IC is a integrated circuit by stacking wafers/dies so they behave as one single device. Four main types of fabrication; Monolithic, Wafer-on-Wafer, Die-on- Wafer, Die-on-Die Benefits of 3D IC Issues of 3D IC Applications; HMC and Vertex-7 2000t