Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Schematic of the 388LD/PBGA: (a) side and (b) top views of one-fourth of the component. Note: dimensions are in millimeters and the parallel piped components have a square cross section.

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Side view of the mesh developed for the PBGA assembly

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Component mask showing the inspection surface regions for the mesh independence study

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Component mask showing the missing solder joint defects location and its respective inspection surface region

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Thermal contour for a PBGA assembly with no defects during an active infrared thermography inspection simulation after 9 s of heating

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Detectability variation as inspection region size increases during heating for missing solder joint 3

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Comparison of detectability on function of defect number

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Geometric models developed for: (a) head on pillow, (b) open, and (c) cracked solder joints; R1 = 0.380, L1 = 0.260, L2 = 0.096, L3 = 0.016, L4 = 0.032, H1 = 0.480. Note: dimensions are in millimeters.

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Component mask showing: head on pillow, open, and cracked solder joint defects location and its respective inspection surface region. Note: hp, op, and ck abbreviations mean head on pillow, open, and cracked solder joint defects, respectively.

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Detectability as function of blocking objects for open solder joint defects; op, open solder joint defect

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Detectability as function of blocking objects for cracked solder joint defects; ck, crack defect

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Detectability as function of defect kind. Note: hp, op, and ck abbreviations mean head on pillow, open, and cracked solder joint defects, respectively.

Date of download: 10/20/2017 Copyright © ASME. All rights reserved. From: Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378 Figure Legend: Detectability versus time for head on pillow (hp), open (op), and cracked defects (ck). Note: The reader should be cautious when deriving conclusions from this plot. Comparisons among kind of defects is possible if they are located on a region of the PBGA component that exhibits the same characteristics (e.g., comparison among 9 op, 8 hp, and 10 ck is valid but not among 9 op, 5 hp, and 3 ck. Comparisons among the same kind of defects are possible to study the effect of defect location on the PBGA component.