Digital Interface inside ASICs & Improvements for ROC Chips

Slides:



Advertisements
Similar presentations
Jeudi 19 février 2009 Status of SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La.
Advertisements

AHCAL Electronics. Status EUDET Prototype Mathias Reinecke for the DESY AHCAL developers EUDET Electronics/DAQ meeting London, June 9th, 2009.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
SEQUENTIAL CIRCUITS Component Design and Use. Register with Parallel Load  Register: Group of Flip-Flops  Ex: D Flip-Flops  Holds a Word of Data 
08/10/2007Julie Prast, LAPP, Annecy1 The DHCAL DIF and the DIF Task Force Julie Prast, LAPP, Annecy.
EUDET FEE status C. de LA TAILLE. EUDET annual meeting 6 oct 08 cdlt : FEE statrus 2 EUDET module FEE : main issues 2 nd generation ASICs –Self triggering.
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
C. Combaret DIF_GDIF_MDIF_D ASU 6x 24 HR2 ASU USB Hub RPi USB2 DCC SDCC RPi USB 1 hub+Rpi for 4 cassettes 1 DCC for 8 cassettes (1 spare) Trigger.
C. Combaret 11/10/ 2008 Status of the DHCAL m2 software C. Combaret IPNL.
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
Organization for Micro-Electronics desiGn and Applications HARDROC 3 for SDHCAL OMEGA microelectronics group Ecole Polytechnique CNRS/IN2P3, Palaiseau.
Vendredi 18 décembre 2015 Status report on SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin- Chassard, Christophe.
ClicPix ideas and a first specification draft P. Valerio.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
Mathias Reinecke CALICE week Manchester DIF development – Status and Common Approach Mathias Reinecke for the CALICE DAQ and Front-End developers.
CERN, 18 december 2003Coincidence Matrix ASIC PRR Coincidence ASIC modifications E.Petrolo, R.Vari, S.Veneziano INFN-Rome.
ILD/ECAL MEETING 2014, 東京大学, JAPAN
17-19/03/2008 Frédéric DULUCQ Improvements of ROC chips VFE - ROC.
HARDROC2: First measurements. HR2 status, Hambourg 12 dec 08, NSM 2 HARDROC2 4.3mm 4.5 mm Ceramic: 4.3 mm Plastic (Thin QFP): 1.4 mm 28 mm Hardroc2 submission:
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
12/09/2007Julie Prast, LAPP, Annecy1 The DIF Task Force and a focus on the DHCAL DIF Remi Cornat, Bart Hommels, Mathias Reinecke, Julie Prast.
SKIROC2 Silicon Kalorimeter Integrated Read-Out Chip Stéphane CALLIER, Christophe DE LA TAILLE, Frédéric DULUCQ, Gisèle MARTIN-CHASSARD, Nathalie SEGUIN-MOREAU.
RTL Hardware Design by P. Chu Chapter 9 – ECE420 (CSUN) Mirzaei 1 Sequential Circuit Design: Practice Shahnam Mirzaei, PhD Spring 2016 California State.
CSNSM 14-16/09/2011 Frédéric DULUCQ Digital part of SPIROC 3.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
June 13rd, 2008 HARDROC2. June 13rd, 2008 European DHCAL meeting, NSM 2 HaRDROC1 architecture Variable gain (6bits) current preamps (50ohm input) One.
AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.
CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.
News from the 1m 2 GRPC SDHCAL collection of slides from : Ch.Combaret, I.L, H.Mathez, J.Prast, N.Seguin, W.Tromeur, G.Vouters and many others.
SPIROC ADC measurements S. Callier, F. Dulucq, C. de La Taille, M. Faucci, R. Poeschl, L. Raux, J. Rouenne, V. Vandenbussche.
1 Programming of FPGA in LiCAS ADC for Continuous Data Readout Week 4 Report Tuesday 22 nd July 2008 Jack Hickish.
SKIROC status Calice meeting – Kobe – 10/05/2007.
MADEIRA Valencia report V. Stankova, C. Lacasta, V. Linhart Ljubljana meeting February 2009.
HARDROC2: Before production in2p3
Digital Design - Sequential Logic Design
OMEGA3 & COOP The New Pixel Detector of WA97
DIF – LDA Command Interface
ASIC Skiroc 2 Digital part
Class Exercise 1B.
ECAL front-end electronic status
Clock Skew and Slow Control Register issues
14-BIT Custom ADC Board Rev. B
ASIC PMm2 Pierre BARRILLON, Sylvie BLIN, Selma CONFORTI,
HR3 status.
Status of ROC chips C. De La Taille for the OMEGA group
R&D activity dedicated to the VFE of the Si-W Ecal
TDC per 4 pixels – End of Column Approach
SKIROC2 Silicon Kalorimeter Integrated Read-Out Chip
Basics of digital systems
Flip-Flop.
CPE/EE 428/528 VLSI Design II – Intro to Testing (Part 3)
Latches and Flip-flops
332:437 Lecture 12 Finite State Machine Design
AT91 Memory Interface This training module describes the External Bus Interface (EBI), which generatesthe signals that control the access to the external.
02 / 02 / HGCAL - Calice Workshop
STATUS OF SKIROC and ECAL FE PCB
ECEN 248: INTRODUCTION TO DIGITAL SYSTEMS DESIGN
HARDROC STATUS 6-Dec-18.
SKIROC status Calice meeting – Kobe – 10/05/2007.
Status of SPIROC: Next generation of SPIROC
PRODUCTION RUN: ROC chips STATUS
Tests Front-end card Status
SYEN 3330 Digital Systems Chapter 7 – Part 1 SYEN 3330 Digital Systems.
Interfacing Data Converters with FPGAs
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
AIDA KICK OFF MEETING WP9
Reference Chapter 7 Moris Mano 4th Edition
ASIC PMm2 Digital part Frédéric DULUCQ 08/02/2008.
Presentation transcript:

Digital Interface inside ASICs & Improvements for ROC Chips Frédéric DULUCQ 02/06/2008

Probe and Slow Control shift registers: Multiplex Multiplex these 2 registers (in, out, clock, reset)  save PADS (8  4+1) Select line added : default register is probe to prevent glitch on SC 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Probe and Slow Control shift registers: Extra FF Improve shift registers daisy chain between ASICs: Add opposite edge FF at the end of shift registers Chip “N” sends data at falling edge and chip “N+1” captures at rising edge (time margin = half period clock) Inside chip  use clock reversing to prevent timing problem 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Slow Control shift registers: default configuration Use Set / Reset of Flip-Flops for default configuration Example default configuration : “011” Implemented for digital interfaces (HARDOC2 and SPIROC2) 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Frederic DULUCQ - dulucq@lal.in2p3.fr DHCAL : Data Readout During readout, remove “bad frame” (address pointer error when chip is not full) First irrelevant frame Capacity of 127 trigger instead of 128  change digital memory limits 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

SPIROC  All ROC Chips : StartAcquisition Change for SPIROC like  “StartAcquisition” active on level. RamFull  ChipSat (uniformity between ROC chips) Allow to remove “RamFullExt” signal (DHCAL) and to let DAQ stop acquisition 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

StartReadOut and EndReadOut: bypass Add bypass for these 2 signals (SRO, ERO  SRO-B, ERO-B). In red, StartReadOut and EndReadOut flow if chip “N” fails Chip N can bypass itself by SC Chip “N-1” and chip “N+1” can bypass chip “N” by SC If Chip N fails : Chip N-1 sends EndReadOut signal on EndReadOutBypass Chip N+1 reads StartReadOut signal on StartReadOutBypass 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Frederic DULUCQ - dulucq@lal.in2p3.fr Slow Control: bypass Add bypass jumpers on PCB In red, SC flow if chip “N” fails Default position is chip “N” reads chip “N-1” If Chip N fails : Switch N removed Switch N+1  in position to read chip “N-1” 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Data and TransmitOn: extra buffers Add 1 extra buffer on these 2 signals Each one is removable from bus line by SC OR Allow to remove one buffer that stick the bus line 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On digital: Timing aspect 1/2 ILC based on a 200 ms bunch crossing period Timing aspect of each phases: Acquisition: 1 ms (common) Conversion : max 103 us = 12 bits ADC @ 40 MHz (common) Readout (daisy chained) @ 5 MHz: max 4 ms for 1 HARDROC max 3.8 ms for 1 SPIROC max 0.6 ms for 1 SKIROC Max working time for 1 chip < 5 ms (195 ms idle) 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On digital: Timing aspect 2/2 PowerON start/stop clocks and LVDS receiver bias current to meet power budget. 2 working modes : Acquisition, Conversion  common to all managed by DAQ Readout  daisy chained managed by StartReadOut and EndReadOut 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On Digital: POD block diagram POD module inserted for the 2 clock LVDS receivers Clock is started asynchronously, enabled and stopped synchronously (at ‘0’) 2 others LVDS receivers (RazChn/NoTrig and ValEvt) active during PowerOnAnalog (during bunch crossing) 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On digital: sequence Some security added: StartReadOut managed asynchronously  low pass filter added Possibility to use StartReadOut instead of the one generated by POD (like first prototype of ROC chips) PowerOnDigital at ‘1’ can force the clock 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Frederic DULUCQ - dulucq@lal.in2p3.fr CONCLUSION Next run for SPIROC2 and HARDROC2 is 9 June 2008 Many improvements already inserted for the run: Shift registers improvements (multiplex, default, extra FF) Bypass signals Extra buffers Bug correction for DHCAL 1 Major improvement for digital is POD module (in progress): Start / Stop clocks Start / Stop LVDS receivers POD should be implemented carefully but it is needed Only way to meet power budget Bypass signals have been added 1 signal can overtake all the others 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Frederic DULUCQ - dulucq@lal.in2p3.fr BACKUP SLIDES 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On digital (very preliminary): 1/3 PowerON must start/stop clocks and LVDS receiver to meet power budget. 2 working modes : Acquisition, Conversion (common to all)  managed by DAQ Readout  managed internally Internal PowerON  OR of “PowerOnDAQ” and “PowerOnChip” 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On digital from DAQ : 2/3 PowerON set during a reset phase before each acquisition Completely managed by DAQ Reset pulse > LVDS start time PowerON release at the end of conversion Synchronized internally to properly stop clocks Effective PowerOn release  after max 2 ticks of Slow Clock PowerON DAQ is asynchronously set and synchronously release (internally in each chips) 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr

Power On digital for Readout : 3/3 PowerON of Chip N set by chip “N-1” Internally managed by ASIC StartReadOut pulse > LVDS start time Synchronous clocks start Internal StartReadOut starts state machine PowerON release at the end of Readout of chip N Synchronized internally to properly stop clocks Effective PowerOn release  after max 2 ticks of Slow Clock PowerON stops LVDS and clock at the same time synchronously PowerON split into 2x“StartLVDS” and 2 x“StartClock” 02/06/2008 Frederic DULUCQ - dulucq@lal.in2p3.fr